Page 228 - NXP Products | Heisener Electronics

BB202,135
NXP

DIODE VAR CAP 6V 10MA SOD523

Package: SC-79, SOD-523

Stock3,424
MPC17533EVEL
NXP

IC MOTOR DRIVER PAR 16VMFP

Package: 16-SSOP (0.209", 5.30mm Width)

Stock35,628
NTS0102GU8,125
NXP

IC TXRX 2BIT TRANSLATING 8XQFN

Package: 8-XFQFN

Stock2,448
74ABT841DB,112
NXP

IC 10BIT BUS INTRFC LATCH 24SSOP

Package: 24-SSOP (0.209", 5.30mm Width)

Stock4,512
UJA1078TW/3V3,118
NXP

IC SBC CAN/DUAL LIN 3.3 32HTSSOP

Package: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

Stock4,496
MCZ33989EG
NXP

IC SYSTEM BASIS CHIP CAN 28-SOIC

Package: 28-SOIC (0.295", 7.50mm Width)

Stock12,144
TJA1042T/3/1J
NXP

IC TRANSCEIVER CAN HS 8SOIC

Package: 8-SOIC (0.154", 3.90mm Width)

Stock631,800
MPC8347VRAGD
NXP

IC MPU MPC83XX 400MHZ 620BGA

Package: 620-BBGA Exposed Pad

Stock5,728
KMPC885ZP80
NXP

IC MPU MPC8XX 80MHZ 357BGA

Package: 357-BBGA

Stock7,232
MC7447AVS1000LB
NXP

IC MPU MPC74XX 1.0GHZ 360FCCLGA

Package: 360-CLGA, FCCLGA

Stock3,248
MC7447AHX1167NB
NXP

IC MPU MPC74XX 1.167GHZ 360BGA

Package: 360-BCBGA, FCCBGA

Stock5,728
P2020NXN2KFC
NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

Package: 689-BBGA Exposed Pad

Stock7,344
MPC5554MVR132R2
NXP

IC MCU 32BIT 2MB FLASH 416BGA

Package: 416-BBGA

Stock11,196
KMSC7118VF1200
NXP

DSP 16BIT W/DDR CTRLR 400-MAPBGA

Package: 400-LFBGA

Stock2,128
MMA6271QR2
NXP

ACCELEROMETER 2.5-10G ANAL 16QFN

Package: 16-LQFN Exposed Pad

Stock7,938
PCF7961ATT/C00V1,5
NXP

IC RF REMOTE WIRELESS 20-TSSOP

Package: -

Stock8,856
TWR-WIFI-GS1500M
NXP

MSG IMM TWR-WIFI-GS1500M PILOT

Package: -

Stock3,636
MMG3012NT1
NXP

IC AMP RF GP 6000MHZ 5V SOT-89

Package: TO-243AA

Stock13,962
TEA19381T/1J
NXP

FLYBACK CONVERTER QR/DCM

Package: 10-SOIC (0.154", 3.90mm Width)

Stock4,240
NX5P3363UKZ
NXP

5V TYPE-C LOAD SWITCH

Package: -

Stock2,320

Part Number	Manufacturer	Description	Package	Stock
BB202,135	NXP	DIODE VAR CAP 6V 10MA SOD523 Capacitance @ Vr, F: 11.2pF @ 2.3V, 1MHz Capacitance Ratio: 2.5 Capacitance Ratio Condition: C0.2/C2.3 Voltage - Peak Reverse (Max): 6V Diode Type: Single Q @ Vr, F: - Operating Temperature: -55°C ~ 85°C (TJ) Mounting Type: Surface Mount Package / Case: SC-79, SOD-523 Supplier Device Package: SOD-523	Package: SC-79, SOD-523	Stock3,424
MPC17533EVEL	NXP	IC MOTOR DRIVER PAR 16VMFP Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC Function: Driver - Fully Integrated, Control and Power Stage Output Configuration: Half Bridge (4) Interface: Parallel Technology: CMOS Step Resolution: - Applications: Battery Powered Current - Output: 700mA Voltage - Supply: 2.7 V ~ 5.7 V Voltage - Load: 2 V ~ 6.8 V Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 16-SSOP (0.209", 5.30mm Width) Supplier Device Package: 16-VMFP	Package: 16-SSOP (0.209", 5.30mm Width)	Stock35,628
NTS0102GU8,125	NXP	IC TXRX 2BIT TRANSLATING 8XQFN Translator Type: Voltage Level Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: 2 Voltage - VCCA: 1.65V ~ 3.6V Voltage - VCCB: 2.3V ~ 5.5V Input Signal: - Output Signal: - Output Type: Open Drain, Tri-State Data Rate: 50Mbps Operating Temperature: -40°C ~ 125°C (TA) Features: Auto-Direction Sensing Mounting Type: Surface Mount Package / Case: 8-XFQFN Supplier Device Package: 8-XQFN (1.4x1.2)	Package: 8-XFQFN	Stock2,448
74ABT841DB,112	NXP	IC 10BIT BUS INTRFC LATCH 24SSOP Logic Type: D-Type Transparent Latch Circuit: 10:10 Output Type: Tri-State Voltage - Supply: 4.5 V ~ 5.5 V Independent Circuits: 1 Delay Time - Propagation: 4ns Current - Output High, Low: 32mA, 64mA Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-SSOP (0.209", 5.30mm Width) Supplier Device Package: 24-SSOP	Package: 24-SSOP (0.209", 5.30mm Width)	Stock4,512
UJA1078TW/3V3,118	NXP	IC SBC CAN/DUAL LIN 3.3 32HTSSOP Applications: Automotive Interface: CAN, LIN Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	Package: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	Stock4,496
MCZ33989EG	NXP	IC SYSTEM BASIS CHIP CAN 28-SOIC Applications: System Basis Chip Interface: CAN, SPI Voltage - Supply: 5.5 V ~ 18 V Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC Mounting Type: Surface Mount	Package: 28-SOIC (0.295", 7.50mm Width)	Stock12,144
TJA1042T/3/1J	NXP	IC TRANSCEIVER CAN HS 8SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 120mV Data Rate: 5Mbps Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	Package: 8-SOIC (0.154", 3.90mm Width)	Stock631,800
MPC8347VRAGD	NXP	IC MPU MPC83XX 400MHZ 620BGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: - RAM Controllers: DDR Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-PBGA (29x29)	Package: 620-BBGA Exposed Pad	Stock5,728
KMPC885ZP80	NXP	IC MPU MPC8XX 80MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (3), 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	Package: 357-BBGA	Stock7,232
MC7447AVS1000LB	NXP	IC MPU MPC74XX 1.0GHZ 360FCCLGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-CLGA, FCCLGA Supplier Device Package: 360-FCCLGA (25x25)	Package: 360-CLGA, FCCLGA	Stock3,248
MC7447AHX1167NB	NXP	IC MPU MPC74XX 1.167GHZ 360BGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.167GHZ Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25x25)	Package: 360-BCBGA, FCCBGA	Stock5,728
P2020NXN2KFC	NXP	IC MPU Q OR IQ 1.2GHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	Package: 689-BBGA Exposed Pad	Stock7,344
MPC5554MVR132R2	NXP	IC MCU 32BIT 2MB FLASH 416BGA Core Processor: e200z6 Core Size: 32-Bit Speed: 132MHz Connectivity: CAN, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 256 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock11,196
KMSC7118VF1200	NXP	DSP 16BIT W/DDR CTRLR 400-MAPBGA Type: Fixed Point Interface: Host Interface, I2C, UART Clock Rate: 300MHz Non-Volatile Memory: ROM (8 kB) On-Chip RAM: 464kB Voltage - I/O: 3.30V Voltage - Core: 1.20V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (17x17)	Package: 400-LFBGA	Stock2,128
MMA6271QR2	NXP	ACCELEROMETER 2.5-10G ANAL 16QFN Type: Analog Axis: X, Y Acceleration Range: ±2.5g, 3.3g, 6.7g, 10g Sensitivity (LSB/g): - Sensitivity (mV/g): 480 (±2.5g) ~ 120 (±10g) Bandwidth: 350Hz Output Type: Analog Voltage Voltage - Supply: 2.2 V ~ 3.6 V Features: Selectable Scale Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 16-LQFN Exposed Pad Supplier Device Package: 16-QFN (6x6)	Package: 16-LQFN Exposed Pad	Stock7,938
PCF7961ATT/C00V1,5	NXP	IC RF REMOTE WIRELESS 20-TSSOP Frequency: 315MHz, 434MHz Applications: Remote Keyless Entry Modulation or Protocol: ASK, FSK Data Rate (Max): 20kbps Power - Output: - Current - Transmitting: - Data Interface: PCB, Surface Mount Antenna Connector: PCB, Surface Mount Memory Size: 16KB Features: Programmable Voltage - Supply: 2.1 V ~ 3.6 V Operating Temperature: - Package / Case: -	Package: -	Stock8,856
TWR-WIFI-GS1500M	NXP	MSG IMM TWR-WIFI-GS1500M PILOT Type: Transceiver; 802.11 b/g/n (Wi-Fi, WiFi, WLAN) Frequency: 2.4GHz For Use With/Related Products: Freescale Tower System Supplied Contents: Board	Package: -	Stock3,636
MMG3012NT1	NXP	IC AMP RF GP 6000MHZ 5V SOT-89 Frequency: 0Hz ~ 6GHz P1dB: 18.5dBm (70.8mW) Gain: 19dB Noise Figure: 3.8dB RF Type: Cellular, PCS, PHS, WLL Voltage - Supply: 5V Current - Supply: 82mA Test Frequency: 900MHz Package / Case: TO-243AA Supplier Device Package: SOT-89-4	Package: TO-243AA	Stock13,962
TEA19381T/1J	NXP	FLYBACK CONVERTER QR/DCM Output Isolation: - Internal Switch(s): - Voltage - Breakdown: - Topology: - Voltage - Start Up: - Voltage - Supply (Vcc/Vdd): - Duty Cycle: - Frequency - Switching: - Power (Watts): - Fault Protection: - Control Features: - Operating Temperature: - Package / Case: 10-SOIC (0.154", 3.90mm Width) Supplier Device Package: 10-SO Mounting Type: Surface Mount	Package: 10-SOIC (0.154", 3.90mm Width)	Stock4,240
NX5P3363UKZ	NXP	5V TYPE-C LOAD SWITCH Switch Type: - Number of Outputs: - Ratio - Input:Output: - Output Configuration: - Output Type: - Interface: - Voltage - Load: - Voltage - Supply (Vcc/Vdd): - Current - Output (Max): - Rds On (Typ): - Input Type: - Features: - Fault Protection: - Operating Temperature: - Package / Case: - Supplier Device Package: -	Package: -	Stock2,320
MC9S08PL4CSC	NXP	MCU 8-BIT 4KB 20MHZ SOIC8 Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: LINbus, SCI, UART/USART Peripherals: LVD, POR, PWM Number of I/O: 6 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	Package: 8-SOIC (0.154", 3.90mm Width)	Stock10,128
MKV42F128VLF16	NXP	KINETIS V 32-BIT MCU ARM CORTEX Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Speed: 168MHz Connectivity: CANbus, I²C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: - Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 21x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock5,792
S912ZVLA64AVFMR	NXP	S12Z CPU, 64K FLASH Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Data Converters: A/D 6x10b; D/A 1x8b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN-EP (5x5)	Package: -	Request a Quote
TDF8531HH-N2K	NXP	CLASS D AMPLIFIER Type: - Output Type: - Max Output Power x Channels @ Load: - Voltage - Supply: - Features: - Mounting Type: - Operating Temperature: - Supplier Device Package: - Package / Case: -	Package: -	Request a Quote
MIMX8UD5DVK08SC	NXP	I.MX8ULP,DUAL 800MHZ Core Processor: ARM® Cortex®-A35 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 800MHz Co-Processors/DSP: 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP RAM Controllers: LPDDR3, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-CSI, MIPI-DSI Ethernet: 10/100Mbps SATA: - USB: USB 2.0 (2) Voltage - I/O: - Operating Temperature: 0°C ~ 95°C (TJ) Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
MWCT2016SHT0VPBR	NXP	MWCT2016S,MAXQFP172 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
FS32K118LAT0VLHT	NXP	IC MCU 32BIT 256KB FLASH 64LQFP Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Speed: 48MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Number of I/O: 58 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 25K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: -	Request a Quote
A2G22S251-01SR3	NXP	RF MOSFET GAN 48V NI400 Transistor Type: GaN Frequency: 1.805GHz ~ 2.2GHz Gain: 17.7dB Voltage - Test: 48 V Current Rating: - Noise Figure: - Current - Test: 200 mA Power - Output: 52dBm Voltage - Rated: 125 V Package / Case: NI-400S-2S Supplier Device Package: NI-400S-2S	Package: -	Request a Quote