NXP Products

MOSFET N-CH 30V 75A TO220AB

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 30V
• Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 10V
• Vgs(th) (Max) @ Id: 4V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 75nC @ 10V
• Input Capacitance (Ciss) (Max) @ Vds: 4951pF @ 25V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 255W (Tc)
• Rds On (Max) @ Id, Vgs: 3.4 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: TO-220AB
• Package / Case: TO-220-3

FET RF 66V 880MHZ NI-880

• Transistor Type: LDMOS
• Frequency: 880MHz
• Gain: 21.2dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.4A
• Power - Output: 58W
• Voltage - Rated: 66V
• Package / Case: NI-880
• Supplier Device Package: NI-880

TRANS PREBIAS NPN 150MW SC75

• Transistor Type: NPN - Pre-Biased
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 4.7k
• Resistor - Emitter Base (R2) (Ohms): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
• Current - Collector Cutoff (Max): 1µA
• Frequency - Transition: -
• Power - Max: 150mW
• Mounting Type: Surface Mount
• Package / Case: SC-75, SOT-416
• Supplier Device Package: SC-75

DIODE ZENER TO-236AB SOT23

• Voltage - Zener (Nom) (Vz): 33V
• Tolerance: ±5%
• Power - Max: 250mW
• Impedance (Max) (Zzt): 80 Ohms
• Current - Reverse Leakage @ Vr: 50nA @ 23.1V
• Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

DIODE UHF VAR CAP 32V SOD523

• Capacitance @ Vr, F: 2.25pF @ 28V, 1MHz
• Capacitance Ratio: 10
• Capacitance Ratio Condition: C1/C28
• Voltage - Peak Reverse (Max): 32V
• Diode Type: Single
• Q @ Vr, F: -
• Operating Temperature: -55°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SC-79, SOD-523
• Supplier Device Package: SOD-523

IC REG CTRLR FLYBACK PWM 6TSOP

• Output Isolation: Isolated
• Internal Switch(s): No
• Voltage - Breakdown: -
• Topology: Flyback
• Voltage - Start Up: 22V
• Voltage - Supply (Vcc/Vdd): 10.5 V ~ 36 V
• Duty Cycle: 90%
• Frequency - Switching: 36kHz ~ 130kHz
• Power (Watts): -
• Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
• Control Features: -
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: SC-74, SOT-457
• Supplier Device Package: 6-TSOP
• Mounting Type: Surface Mount

IC GATE NOR 4CH 2-INP 14-SSOP

• Logic Type: NOR Gate
• Number of Circuits: 4
• Number of Inputs: 2
• Features: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Max): 50µA
• Current - Output High, Low: 15mA, 20mA
• Logic Level - Low: 0.8V
• Logic Level - High: 2V
• Max Propagation Delay @ V, Max CL: 3.7ns @ 5V, 50pF
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-SSOP
• Package / Case: 14-SSOP (0.209", 5.30mm Width)

IC AMP CLASS B CAR RADIO DBS17

• Type: Class B
• Output Type: 2-Channel (Stereo) or 4-Channel (Quad)
• Max Output Power x Channels @ Load: 24W x 2 @ 4 Ohm; 12W x 4 @ 2 Ohm
• Voltage - Supply: 6 V ~ 18 V
• Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Through Hole
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: DBS17P
• Package / Case: 17-SIP Formed Leads

IC UART SINGLE W/FIFO 64-LQFP

• Features: -
• Number of Channels: 1, UART
• FIFO's: 64 Byte
• Protocol: -
• Data Rate (Max): 3Mbps
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

IC DISPLAYPORT TO LVDS 56HVQFN

• Applications: LVDS
• Interface: -
• Voltage - Supply: 3.3V
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (7x7)
• Mounting Type: Surface Mount

IC SPI GPI 16-BIT 24-TSSOP

• Number of I/O: 16 (Input Only)
• Interface: SPI Serial
• Interrupt Output: Yes
• Features: -
• Output Type: Push-Pull
• Current - Output Source/Sink: -
• Clock Frequency: 5MHz
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 24-TSSOP

IC HD RADIO PROCESSOR 144HLQFP

• Type: -
• Applications: -
• Voltage - Supply, Analog: -
• Voltage - Supply, Digital: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

IC MPU MPC85XX 1.0GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

IC MPU MPC8XX 50MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 50MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

IC MCU 16BIT ROMLESS 100LQFP

• Core Processor: XA
• Core Size: 16-Bit
• Speed: 30MHz
• Connectivity: EBI/EMI, UART/USART
• Peripherals: DMA, WDT
• Number of I/O: 33
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

IC MCU 8BIT 32KB FLASH 32LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 22
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

MIFARE DESFIRE EV2 PLLMC

• Type: RFID Reader
• Frequency: 13.56MHz
• Standards: ISO 14443
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -25°C ~ 70°C
• Package / Case: MOB6, Smart Card Module
• Supplier Device Package: PLLMC

MOD ATOP AUTO TELEMATIC

• Function: -
• Frequency: -
• RF Type: -
• Secondary Attributes: -
• Package / Case: -
• Supplier Device Package: -

KIT EVAL ADAM 2.1GHZ

• Type: Amplifier
• Frequency: -
• For Use With/Related Products: -
• Supplied Contents: 2 Boards, Cables

IC SWITCH HIGH SIDE 32SOIC

• Switch Type: -
• Number of Outputs: -
• Ratio - Input:Output: -
• Output Configuration: -
• Output Type: -
• Interface: -
• Voltage - Load: -
• Voltage - Supply (Vcc/Vdd): -
• Current - Output (Max): -
• Rds On (Typ): -
• Input Type: -
• Features: -
• Fault Protection: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

I.MX6ULL ROM PERF ENHAN

• Core Processor: ARM® Cortex®-A7
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 900MHz
• Co-Processors/DSP: Multimedia; NEON™ MPE
• RAM Controllers: LPDDR2, DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: Electrophoretic, LCD
• Ethernet: 10/100 Mbps (2)
• SATA: -
• USB: USB 2.0 OTG + PHY (2)
• Voltage - I/O: 1.8V, 2.8V, 3.3V
• Operating Temperature: 0°C ~ 95°C (TJ)
• Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
• Package / Case: 289-LFBGA
• Supplier Device Package: 289-MAPBGA (14x14)

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 79
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 28x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 123
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 36x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

16-BIT MCU S12 CORE 256KB FLAS

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
• Peripherals: LCD, Motor control PWM, POR, PWM, WDT
• Number of I/O: 88
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 8K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

GATE DRIVER

• Driven Configuration: High-Side
• Channel Type: Single
• Number of Drivers: 1
• Gate Type: IGBT, SiC MOSFET
• Voltage - Supply: 4.5V ~ 40V
• Logic Voltage - VIL, VIH: -
• Current - Peak Output (Source, Sink): 15A, 15A
• Input Type: Non-Inverting
• High Side Voltage - Max (Bootstrap): -
• Rise / Fall Time (Typ): -
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-BSSOP (0.295", 7.50mm Width)
• Supplier Device Package: 32-SOIC

IC MCU 32BIT 256KB FLASH 100LQFP

• Core Processor: ARM® Cortex®-M4
• Core Size: 32-Bit Single-Core
• Speed: 180MHz
• Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 64
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 16K x 8
• RAM Size: 136K x 8
• Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
• Data Converters: A/D 12x12b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

IC MCU 8BIT 16KB FLASH 20TSSOP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, LINbus, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 18
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

SAFETY SYSTEM BASIS CHIP WITH LO

• Applications: -
• Current - Supply: -
• Voltage - Supply: 3.2V ~ 40V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)