Page 292 - NXP Products | Heisener Electronics

MMRF1315NR1
NXP

FET RF 66V 880MHZ TO270

Package: TO-270-2

Stock5,568
PDTC144WE,115
NXP

TRANS PREBIAS NPN 150MW SC75

Package: SC-75, SOT-416

Stock4,336
PZM5.6NB,115
NXP

DIODE ZENER 5.6V 300MW SMT3

Package: TO-236-3, SC-59, SOT-23-3

Stock5,520
BAP65-02,135
NXP

DIODE PIN 30V 100MA SOD523

Package: SC-79, SOD-523

Stock4,480
MMPF0200F0AEPR2
NXP

IC PWR MGMT I.MX6 56QFN

Package: 56-VFQFN Exposed Pad

Stock2,448
UBA2015AT/1,118
NXP

IC LAMP DVR FLUORES 600V 20-SOIC

Package: 20-SOIC (0.295", 7.50mm Width)

Stock19,206
74ABT240N,602
NXP

IC BUFF INVERT 5.5V 20DIP

Package: 20-DIP (0.300", 7.62mm)

Stock2,720
PCA9674PW,118
NXP

IC I/O EXPANDER I2C 8B 16TSSOP

Package: 16-TSSOP (0.173", 4.40mm Width)

Stock23,778
NX3L2T384GT,115
NXP

IC ANALOG SWITCH SPDT XSON8

Package: 8-XFDFN

Stock3,104
MPC8535EAVTAKGA
NXP

IC MPU MPC85XX 600MHZ 783FCBGA

Package: 783-BBGA, FCBGA

Stock7,856
P1020PSE2FDB
NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

Package: 689-BBGA Exposed Pad

Stock6,016
MPC8360ECZUAGDG
NXP

IC MPU MPC83XX 400MHZ 740TBGA

Package: 740-LBGA

Stock2,144
MPC8265AVVMHBC
NXP

IC MPU MPC82XX 266MHZ 408TBGA

Package: 480-LBGA

Stock4,240
MC9S12XD256VAA
NXP

IC MCU 16BIT 256KB FLASH 80QFP

Package: 80-QFP

Stock3,632
LPC11A02UK,118
NXP

IC MCU 32BIT 16KB FLASH 20WLCSP

Package: 20-UFBGA, WLCSP

Stock7,120
LPC1765FBD100,551
NXP

IC MCU 32BIT 256KB FLASH 100LQFP

Package: 100-LQFP

Stock119,520
MK02FN64VFM10
NXP

IC MCU 32BIT 64KB FLASH 32QFN

Package: 32-VFQFN Exposed Pad

Stock59,388
MF1SEP1001DUD/03V
NXP

MIFARE CLASSIC SMART CARD IC

Package: Die

Stock6,516
ASC3101HVK
NXP

IC RF TXRX+MCU AISG 144-LQFP

Package: 144-LQFP Exposed Pad

Stock3,006
1322XNSK-IAR
NXP

KIT STARTER 1322X IAR 256K

Package: -

Stock7,830

Part Number	Manufacturer	Description	Package	Stock
MMRF1315NR1	NXP	FET RF 66V 880MHZ TO270 Transistor Type: LDMOS Frequency: 880MHz Gain: 21.1dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 450mA Power - Output: 14W Voltage - Rated: 66V Package / Case: TO-270-2 Supplier Device Package: TO-270-2	Package: TO-270-2	Stock5,568
PDTC144WE,115	NXP	TRANS PREBIAS NPN 150MW SC75 Transistor Type: NPN - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 47k Resistor - Emitter Base (R2) (Ohms): 22k DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA Frequency - Transition: - Power - Max: 150mW Mounting Type: Surface Mount Package / Case: SC-75, SOT-416 Supplier Device Package: SC-75	Package: SC-75, SOT-416	Stock4,336
PZM5.6NB,115	NXP	DIODE ZENER 5.6V 300MW SMT3 Voltage - Zener (Nom) (Vz): 5.6V Tolerance: ±5% Power - Max: 300mW Impedance (Max) (Zzt): 40 Ohms Current - Reverse Leakage @ Vr: 2µA @ 2.5V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	Package: TO-236-3, SC-59, SOT-23-3	Stock5,520
BAP65-02,135	NXP	DIODE PIN 30V 100MA SOD523 Diode Type: PIN - Single Voltage - Peak Reverse (Max): 30V Current - Max: 100mA Capacitance @ Vr, F: 0.375pF @ 20V, 1MHz Resistance @ If, F: 350 mOhm @ 100mA, 100MHz Power Dissipation (Max): 715mW Operating Temperature: -65°C ~ 150°C (TJ) Package / Case: SC-79, SOD-523 Supplier Device Package: SOD-523	Package: SC-79, SOD-523	Stock4,480
MMPF0200F0AEPR2	NXP	IC PWR MGMT I.MX6 56QFN Applications: Converter, i.MX6 Voltage - Input: 2.8 V ~ 4.5 V Number of Outputs: 11 Voltage - Output: Multiple Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-QFN (8x8)	Package: 56-VFQFN Exposed Pad	Stock2,448
UBA2015AT/1,118	NXP	IC LAMP DVR FLUORES 600V 20-SOIC Type: CFL/TL Controller Frequency: - Voltage - Supply: 11.9 V ~ 13.8 V Current - Supply: 1.7mA Current - Output Source/Sink: - Dimming: Yes Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	Package: 20-SOIC (0.295", 7.50mm Width)	Stock19,206
74ABT240N,602	NXP	IC BUFF INVERT 5.5V 20DIP Logic Type: Buffer, Inverting Number of Elements: 2 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	Package: 20-DIP (0.300", 7.62mm)	Stock2,720
PCA9674PW,118	NXP	IC I/O EXPANDER I2C 8B 16TSSOP Number of I/O: 8 Interface: I2C Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 100µA, 25mA Clock Frequency: 1MHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	Package: 16-TSSOP (0.173", 4.40mm Width)	Stock23,778
NX3L2T384GT,115	NXP	IC ANALOG SWITCH SPDT XSON8 Switch Circuit: SPST - NC Multiplexer/Demultiplexer Circuit: 1:1 Number of Circuits: 2 On-State Resistance (Max): 750 mOhm Channel-to-Channel Matching (ΔRon): 20 mOhm Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V Voltage - Supply, Dual (V±): - Switch Time (Ton, Toff) (Max): 40ns, 15ns -3db Bandwidth: 60MHz Charge Injection: 6pC Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Crosstalk: -90dB @ 100kHz Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 8-XFDFN Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)	Package: 8-XFDFN	Stock3,104
MPC8535EAVTAKGA	NXP	IC MPU MPC85XX 600MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (1) USB: USB 2.0 (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 90°C (TA) Security Features: Cryptography Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock7,856
P1020PSE2FDB	NXP	IC MPU Q OR IQ 800MHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	Package: 689-BBGA Exposed Pad	Stock6,016
MPC8360ECZUAGDG	NXP	IC MPU MPC83XX 400MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	Package: 740-LBGA	Stock2,144
MPC8265AVVMHBC	NXP	IC MPU MPC82XX 266MHZ 408TBGA Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	Package: 480-LBGA	Stock4,240
MC9S12XD256VAA	NXP	IC MCU 16BIT 256KB FLASH 80QFP Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 14K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	Package: 80-QFP	Stock3,632
LPC11A02UK,118	NXP	IC MCU 32BIT 16KB FLASH 20WLCSP Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 18 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.6 V ~ 3.6 V Data Converters: A/D 8x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 20-UFBGA, WLCSP Supplier Device Package: -	Package: 20-UFBGA, WLCSP	Stock7,120
LPC1765FBD100,551	NXP	IC MCU 32BIT 256KB FLASH 100LQFP Core Processor: ARM? Cortex?-M3 Core Size: 32-Bit Speed: 100MHz Connectivity: CAN, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 8x12b, D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock119,520
MK02FN64VFM10	NXP	IC MCU 32BIT 64KB FLASH 32QFN Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM Number of I/O: 26 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 12x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN (5x5)	Package: 32-VFQFN Exposed Pad	Stock59,388
MF1SEP1001DUD/03V	NXP	MIFARE CLASSIC SMART CARD IC Type: RFID Transponder Frequency: 13.56MHz Standards: ISO 14443 Interface: UART Voltage - Supply: - Operating Temperature: -25°C ~ 70°C Package / Case: Die Supplier Device Package: Die	Package: Die	Stock6,516
ASC3101HVK	NXP	IC RF TXRX+MCU AISG 144-LQFP Type: TxRx + MCU RF Family/Standard: AISG Protocol: - Modulation: OOK Frequency: 2.176GHz, 4.352GHz, 6.528GHz Data Rate (Max): 38.4kbps Power - Output: 10dBm Sensitivity: - Memory Size: 128kB Flash, 16kB SRAM Serial Interfaces: I2C, SPI, UART GPIO: 44 Voltage - Supply: 1.8 V ~ 3.3 V Current - Receiving: - Current - Transmitting: - Operating Temperature: - Package / Case: 144-LQFP Exposed Pad	Package: 144-LQFP Exposed Pad	Stock3,006
1322XNSK-IAR	NXP	KIT STARTER 1322X IAR 256K Type: Transceiver; 802.15.4 (ZigBee?) Frequency: 2.4GHz For Use With/Related Products: MC1322x Supplied Contents: 4 Boards, Cables, Power Supply, Accessories	Package: -	Stock7,830
MW4IC2230MBR5	NXP	IC PWR AMP RF 28V 30W TO-272-16 Frequency: 1.6GHz ~ 2.4GHz P1dB: - Gain: 31dB Noise Figure: - RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA Voltage - Supply: 26V Current - Supply: 60mA Test Frequency: - Package / Case: TO-272-16 Variant, Flat Leads Supplier Device Package: TO-272 WB-16	Package: TO-272-16 Variant, Flat Leads	Stock3,276
S32G398AAAK1VUCT	NXP	3XM7 400MHZ, 8XA53 1GHZ, 525BG Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 2.5Gbps (3) SATA: - USB: USB 2.0 OTG (1) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security, TRNG Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	Package: -	Request a Quote
S9KEAZN16AMLHR	NXP	IC MCU 32BIT 16KB FLASH 64LQFP Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Speed: 40MHz Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 57 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: -	Request a Quote
MIMX8MN3CUCIZAA	NXP	NANO SOLOLITE I.MX 8M LFBGA486 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
FB32K116BFT0MFMT	NXP	S32K116, M0+, FLASH 128K, RAM 17 Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
S912ZVL64AMLCR	NXP	S12Z CPU, 64K FLASH Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
S912ZVCA64F0VLFR	NXP	IC MCU 16BIT 64KB FLASH 48LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 28 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Data Converters: A/D 10x12b; D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: -	Request a Quote
MVR5510AMBAHES	NXP	IC PMIC VR5510 ASIL-B Applications: - Current - Supply: 15mA Voltage - Supply: 2.7V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Package: -	Request a Quote