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NXP |
FET RF 2CH 110V 1.03GHZ NI1230H
- Transistor Type: LDMOS (Dual)
- Frequency: 1.03GHz
- Gain: 20dB
- Voltage - Test: 50V
- Current Rating: -
- Noise Figure: -
- Current - Test: 150mA
- Power - Output: 1000W
- Voltage - Rated: 110V
- Package / Case: NI-1230
- Supplier Device Package: NI-1230
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Package: NI-1230 |
Stock4,784 |
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NXP |
IC REG LINEAR 1.8V 300MA 4HXSON
- Output Configuration: Positive
- Output Type: Fixed
- Number of Regulators: 1
- Voltage - Input (Max): 5.5V
- Voltage - Output (Min/Fixed): 1.8V
- Voltage - Output (Max): -
- Voltage Dropout (Max): 0.24V @ 300mA (Typ)
- Current - Output: 300mA
- Current - Quiescent (Iq): -
- Current - Supply (Max): 75µA
- PSRR: 75dB (1kHz)
- Control Features: Enable
- Protection Features: Over Current, Over Temperature, Soft Start
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 4-XDFN Exposed Pad
- Supplier Device Package: 4-HXSON (1x1)
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Package: 4-XDFN Exposed Pad |
Stock5,968 |
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NXP |
IC LASER DRIVER 1.25GBPS 32-HBCC
- Type: Laser Diode Driver (Fiber Optic)
- Data Rate: 1.25Gbps
- Number of Channels: 1
- Voltage - Supply: 3.14 V ~ 3.47 V
- Current - Supply: 40mA
- Current - Modulation: 100mA
- Current - Bias: 100mA
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 32-HBCC
- Supplier Device Package: 32-HBCC (5x5)
- Mounting Type: Surface Mount
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Package: 32-HBCC |
Stock7,696 |
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NXP |
IC TMOS DRIVER DUAL HISIDE 8SOIC
- Driven Configuration: High-Side
- Channel Type: Synchronous
- Number of Drivers: 2
- Gate Type: N-Channel MOSFET
- Voltage - Supply: 7 V ~ 40 V
- Logic Voltage - VIL, VIH: 0.7V, 1.7V
- Current - Peak Output (Source, Sink): -
- Input Type: Non-Inverting
- High Side Voltage - Max (Bootstrap): -
- Rise / Fall Time (Typ): -
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SOIC
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock14,976 |
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NXP |
IC BATT CHARGER LI-ION 25WLCSP
- Battery Chemistry: Lithium-Ion/Polymer
- Number of Cells: 1
- Current - Charging: Constant - Programmable
- Programmable Features: Current
- Fault Protection: -
- Charge Current - Max: 2A
- Battery Pack Voltage: 4.475V (Max)
- Voltage - Supply (Max): 6.2V
- Interface: I2C
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 25-WFBGA, WLCSP
- Supplier Device Package: 25-WLCSP (2.27x2.17)
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Package: 25-WFBGA, WLCSP |
Stock53,724 |
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NXP |
IC GATE NAND 2CH 4-INP 14-DIP
- Logic Type: NAND Gate
- Number of Circuits: 2
- Number of Inputs: 4
- Features: -
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Max): -
- Current - Output High, Low: 1mA, 20mA
- Logic Level - Low: 0.8V
- Logic Level - High: 2V
- Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Through Hole
- Supplier Device Package: 14-DIP
- Package / Case: 14-DIP (0.300", 7.62mm)
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Package: 14-DIP (0.300", 7.62mm) |
Stock5,248 |
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NXP |
IC D-TYPE POS TRG DUAL 14DIP
- Function: Set(Preset) and Reset
- Type: D-Type
- Output Type: Differential
- Number of Elements: 2
- Number of Bits per Element: 1
- Clock Frequency: 125MHz
- Max Propagation Delay @ V, Max CL: 8ns @ 5V, 50pF
- Trigger Type: Positive Edge
- Current - Output High, Low: 1mA, 20mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Iq): 16mA
- Input Capacitance: -
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Through Hole
- Package / Case: 14-DIP (0.300", 7.62mm)
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Package: 14-DIP (0.300", 7.62mm) |
Stock2,912 |
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NXP |
IC BINARY COUNTER UP/DOWN 16DIP
- Logic Type: Binary Counter
- Direction: Up, Down
- Number of Elements: 1
- Number of Bits per Element: 4
- Reset: Asynchronous
- Timing: Synchronous
- Count Rate: 18MHz
- Trigger Type: Positive Edge
- Voltage - Supply: 4.5 V ~ 15.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Through Hole
- Package / Case: 16-DIP (0.300", 7.62mm)
- Supplier Device Package: 16-DIP
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Package: 16-DIP (0.300", 7.62mm) |
Stock6,928 |
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NXP |
IC TXRX NON-INV 3-ST 8BIT 24DIP
- Logic Type: Transceiver, Non-Inverting
- Number of Elements: 1
- Number of Bits per Element: 8
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 7.8mA, 7.8mA
- Voltage - Supply: 2 V ~ 6 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Through Hole
- Package / Case: 24-DIP (0.600", 15.24mm)
- Supplier Device Package: 24-DIP
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Package: 24-DIP (0.600", 15.24mm) |
Stock6,944 |
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NXP |
IC UART SINGLE W/FIFO 44-PLCC
- Features: -
- Number of Channels: 1, UART
- FIFO's: 32 Byte
- Protocol: -
- Data Rate (Max): 3Mbps
- Voltage - Supply: 2.5V, 3.3V, 5V
- With Auto Flow Control: Yes
- With IrDA Encoder/Decoder: Yes
- With False Start Bit Detection: Yes
- With Modem Control: Yes
- Mounting Type: Surface Mount
- Package / Case: 44-LCC (J-Lead)
- Supplier Device Package: 44-PLCC (16.59x16.59)
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Package: 44-LCC (J-Lead) |
Stock5,472 |
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NXP |
IC CAN/LIN FAIL-SAFE 32HTSSOP
- Applications: Networking
- Interface: CAN, LIN
- Voltage - Supply: 5.5 V ~ 52 V
- Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
- Supplier Device Package: 32-HTSSOP
- Mounting Type: Surface Mount
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Package: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad |
Stock3,456 |
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NXP |
IC MPU MPC85XX 667MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 667MHz
- Co-Processors/DSP: Security; SEC
- RAM Controllers: DDR, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: -
- Voltage - I/O: 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock5,600 |
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NXP |
IC PROCESSOR DUAL CORE
- Core Processor: ARM? Cortex?-A9
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.2GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: GbE (3)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (1), USB 3.0 + PHY
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: Secure Boot, TrustZone?
- Package / Case: 625-BFBGA, FCBGA
- Supplier Device Package: 625-FCBGA (21x21)
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Package: 625-BFBGA, FCBGA |
Stock6,592 |
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NXP |
IC MCU 32BIT 512KB FLASH 120CSP
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 79
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: -
- Package / Case: 120-UFBGA, WLCSP
- Supplier Device Package: 120-WLCSP (5.29x5.28)
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Package: 120-UFBGA, WLCSP |
Stock5,856 |
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NXP |
IC MCU 16BIT 128KB FLASH 52LQFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: EBI/EMI, SCI, SPI
- Peripherals: POR, PWM, WDT
- Number of I/O: 35
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 52-LQFP
- Supplier Device Package: 52-LQFP (10x10)
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Package: 52-LQFP |
Stock3,424 |
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NXP |
IC MCU 16BIT 256KB FLASH 144LQFP
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 80MHz
- Connectivity: CAN, EBI/EMI, I2C, LIN, SCI, SPI
- Peripherals: LCD, Motor control PWM, POR, PWM, WDT
- Number of I/O: 117
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
- Data Converters: A/D 16x8/10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock6,912 |
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NXP |
IC MCU 32BIT 512KB FLASH 100LQFP
- Core Processor: Coldfire V2
- Core Size: 32-Bit
- Speed: 80MHz
- Connectivity: CAN, Ethernet, I2C, QSPI, UART/USART, USB OTG
- Peripherals: DMA, LVD, POR, PWM, WDT
- Number of I/O: 56
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 8x12b
- Oscillator Type: Internal
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: 100-LQFP |
Stock13,860 |
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NXP |
IC HD RADIO PROCESSOR 144HLQFP
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 144-LQFP Exposed Pad
- Supplier Device Package: 144-HLQFP (20x20)
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Package: 144-LQFP Exposed Pad |
Stock2,928 |
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NXP |
PRESSURE SENSOR AXIAL PORT 8-SOP
- Pressure Type: Compound
- Operating Pressure: ±1.02 PSI (±7 kPa)
- Output Type: Analog Voltage
- Output: 0.5 V ~ 4.5 V
- Accuracy: ±5%
- Voltage - Supply: 4.75 V ~ 5.25 V
- Port Size: Male - 0.13" (3.17mm) Tube
- Port Style: Barbless
- Features: Temperature Compensated
- Termination Style: PCB
- Maximum Pressure: ±10.88 PSI (±75 kPa)
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-SMD, Gull Wing, Top Port
- Supplier Device Package: -
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Package: 8-SMD, Gull Wing, Top Port |
Stock8,550 |
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NXP |
IC RF TXRX ISM<1GHZ 32-VFQFN
- Type: TxRx Only
- RF Family/Standard: General ISM < 1GHz
- Protocol: -
- Modulation: FSK, OOK
- Frequency: 290MHz ~ 340MHz, 424MHz ~ 510MHz, 862MHz ~ 1.02GHz
- Data Rate (Max): 22.6kbps
- Power - Output: 7.25dBm
- Sensitivity: -106.5dBm
- Memory Size: -
- Serial Interfaces: SPI
- GPIO: -
- Voltage - Supply: 2.1 V ~ 3.6 V
- Current - Receiving: 10.3mA ~ 24mA
- Current - Transmitting: 6.1mA ~ 13.5mA
- Operating Temperature: -20°C ~ 85°C
- Package / Case: 32-VFQFN Exposed Pad
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Package: 32-VFQFN Exposed Pad |
Stock18,312 |
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NXP |
IC MMIC WIDEBAND AMPLIFER 6TSSOP
- Frequency: 2.7GHz
- P1dB: -7.9dBm (0.2mW)
- Gain: 22dB
- Noise Figure: 2.2dB
- RF Type: -
- Voltage - Supply: 4V
- Current - Supply: 10mA
- Test Frequency: 950MHz
- Package / Case: 6-TSSOP, SC-88, SOT-363
- Supplier Device Package: 6-TSSOP
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Package: 6-TSSOP, SC-88, SOT-363 |
Stock5,220 |
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NXP |
FS6500
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: -1.0 V ~ 40 V
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP Exposed Pad |
Stock3,248 |
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NXP |
NXP 32-BIT MCU 6MB FLASH 160MH
- Core Processor: e200z2, e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz/160MHz
- Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: 178
- Program Memory Size: 6MB (6M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 768K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 80x10b, 64x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 256-LBGA
- Supplier Device Package: 256-MAPPBGA (17x17)
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Package: 256-LBGA |
Stock5,024 |
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NXP |
16-BIT MCU S12X CORE 384KB FLA
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 91
- Program Memory Size: 384KB (384K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 24K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
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Package: 112-LQFP |
Stock4,528 |
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NXP |
S32K144 32-BIT MCU ARM CORTEX-M
- Core Processor: ARM® Cortex®-M4F
- Core Size: 32-Bit
- Speed: 64MHz
- Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b, D/A 1x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock3,120 |
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NXP |
SYSTEM BASIS CHIP, LINEAR 0.5A V
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: 1V ~ 5V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-HLQFP (7x7)
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Package: - |
Request a Quote |
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NXP |
S32K142 ARM CORTEX-M4F, 112 MHZ,
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
SYSTEM BASIS CHIP, DCDC 1.5A VCO
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: 1V ~ 5V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-HLQFP (7x7)
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Package: - |
Request a Quote |
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