Page 302 - NXP Products | Heisener Electronics

MRFE6S9046NR1
NXP

FET RF 66V 960MHZ TO-270-4

Package: TO-270AB

Stock5,392
MRF6VP3450HR5
NXP

FET RF 2CH 110V 860MHZ NI-1230

Package: NI-1230

Stock3,664
SI9936DY,518
NXP

MOSFET 2N-CH 30V 5A SOT96-1

Package: 8-SOIC (0.154", 3.90mm Width)

Stock3,248
MC33909Q3AD
NXP

SBC 3V 1CAN 0LIN 6SG HLQFP48

Package: -

Stock6,704
74HC258D,652
NXP

IC QUAD 2-IN MUX 3-ST INV 16SOIC

Package: 16-SOIC (0.154", 3.90mm Width)

Stock3,152
74ABT16373BDL,112
NXP

IC 16BIT D TYPE LATCH 48SSOP

Package: 48-BSSOP (0.295", 7.50mm Width)

Stock5,120
74LV377D,118
NXP

IC D-TYPE POS TRG SNGL 20SOIC

Package: 20-SOIC (0.295", 7.50mm Width)

Stock7,184
74HCT7541N,112
NXP

IC SCHMT TRIG BUFF/DVR 8B 20DIP

Package: 20-DIP (0.300", 7.62mm)

Stock3,120
SC16C652BIB48,151
NXP

IC UART DUAL W/FIFO 48-LQFP

Package: 48-LQFP

Stock8,544
UJA1075ATW/5V0,118
NXP

IC SBC CAN/LIN 5.0V HS 32HTSSOP

Package: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

Stock3,600
AU5783D,518
NXP

IC TXRX SAE/J1850 VPW 14SOIC

Package: 14-SOIC (0.154", 3.90mm Width)

Stock7,424
P1012PSE2HFB
NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

Package: 689-BBGA Exposed Pad

Stock5,344
MPC8377ECVRALG
NXP

IC MPU MPC83XX 667MHZ 689TEBGA

Package: 689-BBGA Exposed Pad

Stock5,648
KMPC875VR80
NXP

IC MPU MPC8XX 80MHZ 256BGA

Package: 256-BBGA

Stock5,088
MPC5200CBV400
NXP

IC MPU MPC52XX 400MHZ 272BGA

Package: 272-BBGA

Stock11,316
MPC8347EVVAJFB
NXP

IC MPU MPC83XX 533MHZ 672TBGA

Package: 672-LBGA

Stock8,736
MCIMX6U5DVM10AC
NXP

IC MPU I.MX6DL 1.0GHZ 624MAPBGA

Package: 624-LFBGA

Stock17,052
MK22DX256VMC5
NXP

IC MCU 32BIT 256KB FLASH 121BGA

Package: 121-LFBGA

Stock15,648
MK10DX32VMP5
NXP

IC MCU 32BIT 32KB FLASH 64MAPBGA

Package: 64-LFBGA

Stock9,156
MK10DX256VLH7
NXP

IC MCU 32BIT 256KB FLASH 64LQFP

Package: 64-LQFP

Stock7,500

Part Number	Manufacturer	Description	Package	Stock
MRFE6S9046NR1	NXP	FET RF 66V 960MHZ TO-270-4 Transistor Type: LDMOS Frequency: 960MHz Gain: 19dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 300mA Power - Output: 35.5W Voltage - Rated: 66V Package / Case: TO-270AB Supplier Device Package: TO-270 WB-4	Package: TO-270AB	Stock5,392
MRF6VP3450HR5	NXP	FET RF 2CH 110V 860MHZ NI-1230 Transistor Type: LDMOS (Dual) Frequency: 860MHz Gain: 22.5dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 1.4A Power - Output: 90W Voltage - Rated: 110V Package / Case: NI-1230 Supplier Device Package: NI-1230	Package: NI-1230	Stock3,664
SI9936DY,518	NXP	MOSFET 2N-CH 30V 5A SOT96-1 FET Type: 2 N-Channel (Dual) FET Feature: Logic Level Gate Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 5A Rds On (Max) @ Id, Vgs: 50 mOhm @ 5A, 10V Vgs(th) (Max) @ Id: 1V @ 250µA Gate Charge (Qg) (Max) @ Vgs: 35nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: - Power - Max: 900mW Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	Package: 8-SOIC (0.154", 3.90mm Width)	Stock3,248
MC33909Q3AD	NXP	SBC 3V 1CAN 0LIN 6SG HLQFP48 Applications: System Basis Chip Current - Supply: 7mA Voltage - Supply: 3.5 V ~ 28 V Operating Temperature: -40°C ~ 125°C Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock6,704
74HC258D,652	NXP	IC QUAD 2-IN MUX 3-ST INV 16SOIC Type: Multiplexer Circuit: 4 x 2:1 Independent Circuits: 1 Current - Output High, Low: 7.8mA, 7.8mA Voltage Supply Source: Single Supply Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	Package: 16-SOIC (0.154", 3.90mm Width)	Stock3,152
74ABT16373BDL,112	NXP	IC 16BIT D TYPE LATCH 48SSOP Logic Type: D-Type Transparent Latch Circuit: 8:8 Output Type: Tri-State Voltage - Supply: 4.5 V ~ 5.5 V Independent Circuits: 2 Delay Time - Propagation: 2ns Current - Output High, Low: 32mA, 64mA Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 48-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 48-SSOP	Package: 48-BSSOP (0.295", 7.50mm Width)	Stock5,120
74LV377D,118	NXP	IC D-TYPE POS TRG SNGL 20SOIC Function: Standard Type: D-Type Output Type: Non-Inverted Number of Elements: 1 Number of Bits per Element: 8 Clock Frequency: 70MHz Max Propagation Delay @ V, Max CL: 30ns @ 3.3V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 6mA, 6mA Voltage - Supply: 1 V ~ 3.6 V Current - Quiescent (Iq): 160µA Input Capacitance: 3.5pF Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width)	Package: 20-SOIC (0.295", 7.50mm Width)	Stock7,184
74HCT7541N,112	NXP	IC SCHMT TRIG BUFF/DVR 8B 20DIP Logic Type: Buffer, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: Schmitt Trigger Output Type: Push-Pull Current - Output High, Low: 6mA, 6mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	Package: 20-DIP (0.300", 7.62mm)	Stock3,120
SC16C652BIB48,151	NXP	IC UART DUAL W/FIFO 48-LQFP Features: - Number of Channels: 2, DUART FIFO's: 32 Byte Protocol: - Data Rate (Max): 5Mbps Voltage - Supply: 2.5V, 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock8,544
UJA1075ATW/5V0,118	NXP	IC SBC CAN/LIN 5.0V HS 32HTSSOP Applications: Automotive Interface: CAN, LIN Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	Package: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	Stock3,600
AU5783D,518	NXP	IC TXRX SAE/J1850 VPW 14SOIC Type: Transceiver Protocol: J1850 Number of Drivers/Receivers: 1/1 Duplex: Full Receiver Hysteresis: 500mV Data Rate: - Voltage - Supply: 5.5 V ~ 16 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	Package: 14-SOIC (0.154", 3.90mm Width)	Stock7,424
P1012PSE2HFB	NXP	IC MPU Q OR IQ 800MHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	Package: 689-BBGA Exposed Pad	Stock5,344
MPC8377ECVRALG	NXP	IC MPU MPC83XX 667MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Security; SEC 3.0 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	Package: 689-BBGA Exposed Pad	Stock5,648
KMPC875VR80	NXP	IC MPU MPC8XX 80MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1), 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23)	Package: 256-BBGA	Stock5,088
MPC5200CBV400	NXP	IC MPU MPC52XX 400MHZ 272BGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: - RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (1) SATA: - USB: USB 1.1 (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: - Package / Case: 272-BBGA Supplier Device Package: 272-PBGA (27x27)	Package: 272-BBGA	Stock11,316
MPC8347EVVAJFB	NXP	IC MPU MPC83XX 533MHZ 672TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 672-LBGA Supplier Device Package: 672-TBGA (35x35)	Package: 672-LBGA	Stock8,736
MCIMX6U5DVM10AC	NXP	IC MPU I.MX6DL 1.0GHZ 624MAPBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-LFBGA Supplier Device Package: 624-MAPBGA (21x21)	Package: 624-LFBGA	Stock17,052
MK22DX256VMC5	NXP	IC MCU 32BIT 256KB FLASH 121BGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 20x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 121-LFBGA Supplier Device Package: 121-MAPBGA (8x8)	Package: 121-LFBGA	Stock15,648
MK10DX32VMP5	NXP	IC MCU 32BIT 32KB FLASH 64MAPBGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 44 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 19x16b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LFBGA Supplier Device Package: 64-MAPBGA (5x5)	Package: 64-LFBGA	Stock9,156
MK10DX256VLH7	NXP	IC MCU 32BIT 256KB FLASH 64LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 72MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 44 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 26x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP	Stock7,500
MM908E625ACDWB	NXP	IC QUAD HALF BRDG MCU/LIN 54SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP	Package: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad	Stock5,216
MPXV5010GC7U	NXP	SENSOR INTEG SILICON PRESSURE Pressure Type: Vented Gauge Operating Pressure: 1.45 PSI (10 kPa) Output Type: Analog Voltage Output: 0.2 V ~ 4.7 V Accuracy: ±5% Voltage - Supply: 4.75 V ~ 5.25 V Port Size: Male - 0.13" (3.17mm) Tube Port Style: Barbless Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 5.8 PSI (40 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 8-DIP (0.550", 13.97mm), Top Port Supplier Device Package: 8-DIP	Package: 8-DIP (0.550", 13.97mm), Top Port	Stock13,338
MMA6851AKGWR2	NXP	ACCELEROMETER 10BIT SPI 16QFN Type: Digital Axis: X Acceleration Range: ±25g Sensitivity (LSB/g): 20.48 Sensitivity (mV/g): - Bandwidth: - Output Type: SPI Voltage - Supply: 3.135 V ~ 5.25 V Features: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN-EP (6x6)	Package: 16-QFN Exposed Pad	Stock6,192
MMA5112LW	NXP	ACCELEROMETER 120G PCM/SPI 16QFN Type: Digital Axis: Z Acceleration Range: ±120g Sensitivity (LSB/g): 4 Sensitivity (mV/g): - Bandwidth: - Output Type: PCM, SPI Voltage - Supply: 4.2 V ~ 17 V Features: Selectable Low Pass Filter Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN (6x6)	Package: 16-QFN Exposed Pad	Stock7,236
SPC5607BK0VLL6R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 77 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 7x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock5,088
FS32K142HFT0MLLT	NXP	S32K144 32-BIT MCU ARM Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock4,992
MC33PF8200DBES	NXP	IC POWER MANAGEMENT I.MX8QM Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Package: 56-VFQFN Exposed Pad	Stock4,672
S912ZVCA96F0MKHR	NXP	S12Z, 64LQFP-EP, 96K FLASH Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V Data Converters: A/D 16x12b SAR; D/A 1x8b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP (10x10)	Package: -	Stock4,500