Page 317 - NXP Products | Heisener Electronics

BUK6207-30C,118
NXP

MOSFET N-CH 30V 90A DPAK

Package: TO-252-3, DPak (2 Leads + Tab), SC-63

Stock6,400
BAS40-05/ZLVL
NXP

DIODE ARRAY SCHOTTKY 40V SOT23

Package: TO-236-3, SC-59, SOT-23-3

Stock6,416
LD6835K/22PX
NXP

IC REG LINEAR 2.2V 300MA 4HXSON

Package: 4-XDFN Exposed Pad

Stock5,664
LD6805K/185H,115
NXP

IC REG LINEAR 1.85V 150MA 4UDFN

Package: 4-UDFN Exposed Pad

Stock6,576
MC33HB2001FK
NXP

IC HALF-BRIDGE DRIVER SPI 32PQFN

Package: 32-PowerQFN

Stock5,552
HEF4515BT,653
NXP

IC DECODER/DEMUX 1OF16 24SOIC

Package: 24-SOIC (0.295", 7.50mm Width)

Stock7,456
74HC4514N,652
NXP

IC DECODR/DEMUX 4-16 LINE 24-DIP

Package: 24-DIP (0.600", 15.24mm)

Stock5,728
74AHC14PW/AUJ
NXP

IC HEX INV SCHMITT TRIG 14-TSSOP

Package: 14-TSSOP (0.173", 4.40mm Width)

Stock4,240
74LV04N,112
NXP

IC HEX INVERTER 14-DIP

Package: 14-DIP (0.300", 7.62mm)

Stock3,136
74ABT827D,602
NXP

IC BUFF DVR TRI-ST 10BIT 24SOIC

Package: 24-SOIC (0.295", 7.50mm Width)

Stock3,344
SAA6752HS/V104,557
NXP

IC AUD/VID ENCODER MPEG 208-SQFP

Package: 208-BFQFP

Stock2,464
MCIMX6S7CVM08AB
NXP

IC MPU I.MX6S 800MHZ 624MAPBGA

Package: 624-LFBGA

Stock6,912
SPC5643LFF0MLQ1
NXP

IC MCU 32BIT 1MB FLASH 144LQFP

Package: 144-LQFP

Stock3,792
PCF51JM128EVLK
NXP

IC MCU 32BIT 128KB FLASH 80LQFP

Package: 80-LQFP

Stock7,424
MC9S08DN32AMLF
NXP

IC MCU 8BIT 32KB FLASH 48LQFP

Package: 48-LQFP

Stock5,024
MC908QC8CDXE
NXP

IC MCU 8BIT 8KB FLASH 16SOIC

Package: 16-SOIC (0.295", 7.50mm Width)

Stock4,144
MC908LJ24CPKE
NXP

IC MCU 8BIT 24KB FLASH 80LQFP

Package: 80-LQFP

Stock3,472
MC68HC908QY4CPE
NXP

IC MCU 8BIT 4KB FLASH 16DIP

Package: 16-DIP (0.300", 7.62mm)

Stock48,300
MCF5482CVR166
NXP

IC MCU 32BIT ROMLESS 388PBGA

Package: 388-BBGA

Stock5,584
MPX2100GP
NXP

SENSOR GAUGE PRESS 14.5 PSI MAX

Package: 4-SIP Module

Stock5,058

Part Number	Manufacturer	Description	Package	Stock
BUK6207-30C,118	NXP	MOSFET N-CH 30V 90A DPAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 90A (Tc) Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs(th) (Max) @ Id: 2.8V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 54.8nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 3470pF @ 25V Vgs (Max): ±16V FET Feature: - Power Dissipation (Max): 128W (Tc) Rds On (Max) @ Id, Vgs: 5.2 mOhm @ 15A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Supplier Device Package: DPAK Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63	Package: TO-252-3, DPak (2 Leads + Tab), SC-63	Stock6,400
BAS40-05/ZLVL	NXP	DIODE ARRAY SCHOTTKY 40V SOT23 Diode Configuration: 1 Pair Common Cathode Diode Type: Schottky Voltage - DC Reverse (Vr) (Max): 40V Current - Average Rectified (Io) (per Diode): 120mA (DC) Voltage - Forward (Vf) (Max) @ If: 1V @ 40mA Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): - Current - Reverse Leakage @ Vr: 10µA @ 40V Operating Temperature - Junction: 150°C (Max) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	Package: TO-236-3, SC-59, SOT-23-3	Stock6,416
LD6835K/22PX	NXP	IC REG LINEAR 2.2V 300MA 4HXSON Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 2.2V Voltage - Output (Max): - Voltage Dropout (Max): 0.24V @ 300mA (Typ) Current - Output: 300mA Current - Quiescent (Iq): - Current - Supply (Max): 75µA PSRR: 75dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature, Soft Start Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 4-XDFN Exposed Pad Supplier Device Package: 4-HXSON (1x1)	Package: 4-XDFN Exposed Pad	Stock5,664
LD6805K/185H,115	NXP	IC REG LINEAR 1.85V 150MA 4UDFN Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 1.85V Voltage - Output (Max): - Voltage Dropout (Max): 0.25V @ 150mA Current - Output: 150mA Current - Quiescent (Iq): - Current - Supply (Max): 35µA ~ 150µA PSRR: 75dB (1kHz) Control Features: Enable Protection Features: Over Current, Transient Voltage Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 4-UDFN Exposed Pad Supplier Device Package: 4-UDFN (1.0x1.0)	Package: 4-UDFN Exposed Pad	Stock6,576
MC33HB2001FK	NXP	IC HALF-BRIDGE DRIVER SPI 32PQFN Output Configuration: Half Bridge (2) Applications: DC Motors, General Purpose Interface: SPI Load Type: Inductive Technology: Power MOSFET Rds On (Typ): 125 mOhm LS (Max), 125 mOhm HS (Max) Current - Output / Channel: - Current - Peak Output: - Voltage - Supply: 5 V ~ 28 V Voltage - Load: 5 V ~ 28 V Operating Temperature: -40°C ~ 150°C (TJ) Features: Slew Rate Controlled Fault Protection: Over Temperature, Over Voltage, UVLO Mounting Type: Surface Mount Package / Case: 32-PowerQFN Supplier Device Package: 32-PQFN (8x8)	Package: 32-PowerQFN	Stock5,552
HEF4515BT,653	NXP	IC DECODER/DEMUX 1OF16 24SOIC Type: Decoder/Demultiplexer Circuit: 1 x 4:16 Independent Circuits: 1 Current - Output High, Low: 3mA, 3mA Voltage Supply Source: Dual Supply Voltage - Supply: 4.5 V ~ 15.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	Package: 24-SOIC (0.295", 7.50mm Width)	Stock7,456
74HC4514N,652	NXP	IC DECODR/DEMUX 4-16 LINE 24-DIP Type: Decoder/Demultiplexer Circuit: 1 x 4:16 Independent Circuits: 1 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 24-DIP (0.600", 15.24mm) Supplier Device Package: 24-DIP	Package: 24-DIP (0.600", 15.24mm)	Stock5,728
74AHC14PW/AUJ	NXP	IC HEX INV SCHMITT TRIG 14-TSSOP Logic Type: Inverter Number of Circuits: 6 Number of Inputs: 6 Features: Schmitt Trigger Voltage - Supply: 2V ~ 5.5V Current - Quiescent (Max): 2µA Current - Output High, Low: 8mA, 8mA Logic Level - Low: - Logic Level - High: - Max Propagation Delay @ V, Max CL: 10.6ns @ 5V, 50pF Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Supplier Device Package: 14-TSSOP Package / Case: 14-TSSOP (0.173", 4.40mm Width)	Package: 14-TSSOP (0.173", 4.40mm Width)	Stock4,240
74LV04N,112	NXP	IC HEX INVERTER 14-DIP Logic Type: Inverter Number of Circuits: 6 Number of Inputs: 6 Features: - Voltage - Supply: 1 V ~ 5.5 V Current - Quiescent (Max): 40µA Current - Output High, Low: 12mA, 12mA Logic Level - Low: 0.3 V ~ 0.8 V Logic Level - High: 0.9 V ~ 2 V Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Supplier Device Package: 14-DIP Package / Case: 14-DIP (0.300", 7.62mm)	Package: 14-DIP (0.300", 7.62mm)	Stock3,136
74ABT827D,602	NXP	IC BUFF DVR TRI-ST 10BIT 24SOIC Logic Type: Buffer, Non-Inverting Number of Elements: 1 Number of Bits per Element: 10 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	Package: 24-SOIC (0.295", 7.50mm Width)	Stock3,344
SAA6752HS/V104,557	NXP	IC AUD/VID ENCODER MPEG 208-SQFP Type: Video Encoder Applications: DVD Voltage - Supply, Analog: 2.3 V ~ 2.7 V Voltage - Supply, Digital: 3 V ~ 3.6 V Mounting Type: Surface Mount Package / Case: 208-BFQFP Supplier Device Package: 208-SQFP (28x28)	Package: 208-BFQFP	Stock2,464
MCIMX6S7CVM08AB	NXP	IC MPU I.MX6S 800MHZ 624MAPBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-LFBGA Supplier Device Package: 624-MAPBGA (21x21)	Package: 624-LFBGA	Stock6,912
SPC5643LFF0MLQ1	NXP	IC MCU 32BIT 1MB FLASH 144LQFP Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 120MHz Connectivity: CAN, FlexRay, LIN, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 32x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	Package: 144-LQFP	Stock3,792
PCF51JM128EVLK	NXP	IC MCU 32BIT 128KB FLASH 80LQFP Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: CAN, I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Number of I/O: 66 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (14x14)	Package: 80-LQFP	Stock7,424
MC9S08DN32AMLF	NXP	IC MCU 8BIT 32KB FLASH 48LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 1.5K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock5,024
MC908QC8CDXE	NXP	IC MCU 8BIT 8KB FLASH 16SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 384 x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	Package: 16-SOIC (0.295", 7.50mm Width)	Stock4,144
MC908LJ24CPKE	NXP	IC MCU 8BIT 24KB FLASH 80LQFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: I2C, IRSCI, SPI Peripherals: LCD, LVD, POR, PWM Number of I/O: 48 Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12)	Package: 80-LQFP	Stock3,472
MC68HC908QY4CPE	NXP	IC MCU 8BIT 4KB FLASH 16DIP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	Package: 16-DIP (0.300", 7.62mm)	Stock48,300
MCF5482CVR166	NXP	IC MCU 32BIT ROMLESS 388PBGA Core Processor: Coldfire V4E Core Size: 32-Bit Speed: 166MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Number of I/O: 99 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.43 V ~ 1.58 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 388-BBGA Supplier Device Package: 388-PBGA (27x27)	Package: 388-BBGA	Stock5,584
MPX2100GP	NXP	SENSOR GAUGE PRESS 14.5 PSI MAX Pressure Type: Vented Gauge Operating Pressure: 14.5 PSI (100 kPa) Output Type: Wheatstone Bridge Output: 0 mV ~ 40 mV (10V) Accuracy: - Voltage - Supply: 10 V ~ 16 V Port Size: Male - 0.19" (4.93mm) Tube Port Style: Barbed Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 4-SIP Module Supplier Device Package: -	Package: 4-SIP Module	Stock5,058
BGU7008,115	NXP	IC AMP MMIC GPS LNA 6XSON Frequency: 1575.42MHz P1dB: -14dBm Gain: 19.5dB Noise Figure: 1.2dB RF Type: Galileo, GLONASS, GPS Voltage - Supply: 1.5 V ~ 2.85 V Current - Supply: 12.8mA Test Frequency: 1.559GHz ~ 1.61GHz Package / Case: 6-XFDFN Supplier Device Package: 6-XSON, SOT886 (1.45x1)	Package: 6-XFDFN	Stock46,350
MC35FS4503CAE	NXP	SYSTEM BASIS CHIP, LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP Exposed Pad	Stock7,296
SPC5602BF2VLH4R	NXP	32BIT 256KF 64LD 48MHZ Core Processor: e200z0h Core Size: 32-Bit Speed: 48MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 45 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP	Stock3,952
S9S12VR64AF0VLF	NXP	MAGNIV 16-BIT MCU S12 CORE 64K Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 28 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock6,096
MC9S08PA4MTGR	NXP	S08PA 8-BIT MCU S08 CORE 4KB F Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 14 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	Package: 16-TSSOP (0.173", 4.40mm Width)	Stock4,192
SPC5744PK1AMMM9R	NXP	IC MCU 32B 2.5MB FLASH 257MAPBGA Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz, 200MHz Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Number of I/O: - Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 257-LFBGA Supplier Device Package: 257-LFBGA (14x14)	Package: -	Request a Quote
PCA2003U-10AC-1Z	NXP	IC WATCH CIRCUIT DIE Type: Watch Circuit Applications: - Mounting Type: Surface Mount Package / Case: Die Supplier Device Package: Die	Package: -	Request a Quote
TJA1448ATK-S1Z	NXP	IC TRANSCEIVER HALF 2/2 14HVSON Type: Transceiver Protocol: CANbus Number of Drivers/Receivers: 2/2 Duplex: Half Receiver Hysteresis: 50 mV Data Rate: 5Mbps Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 14-VDFN Exposed Pad Supplier Device Package: 14-HVSON (3x4.5)	Package: -	Request a Quote