Page 548 - NXP Products | Heisener Electronics

ON5262,127
NXP

MOSFET RF TO220AB TO220AB

Package: TO-220-3

Stock3,216
MRF9045LR1
NXP

FET RF 65V 945MHZ NI-360

Package: NI-360

Stock5,376
BLF4G20LS-110B,112
NXP

FET RF 65V 1.99GHZ SOT502B

Package: SOT-502B

Stock7,136
MMRF1320NR1
NXP

TRANS 1.8--600MHZ 150W CW 50V

Package: TO-270-4

Stock5,152
BC327-25,112
NXP

TRANS PNP 45V 0.5A TO-92

Package: TO-226-3, TO-92-3 (TO-226AA)

Stock7,904
PZM20NB3,115
NXP

DIODE ZENER 20V 300MW SMT3

Package: TO-236-3, SC-59, SOT-23-3

Stock4,160
MC33908LAE
NXP

IC SYSTEM BASIS CHIP CAN 48LQFP

Package: 48-LQFP Exposed Pad

Stock5,984
LD6816CX4/27P,315
NXP

IC REG LINEAR 2.7V 150MA 4WLCSP

Package: 4-XFBGA, WLCSP

Stock7,504
MC34SB0800AER2
NXP

IC MOTOR DRIVER 36V 64LQFP

Package: 64-LQFP Exposed Pad

Stock27,156
PCA9685PW/Q900,118
NXP

IC LED DRVR LIN DIM 25MA 28TSSOP

Package: 28-TSSOP (0.173", 4.40mm Width)

Stock274,350
74LVT2952D,118
NXP

IC TRANSCEIVER 8BIT N-INV 24SOIC

Package: 24-SOIC (0.295", 7.50mm Width)

Stock5,968
TDF8599TD/N2,518
NXP

IC AMP AUDIO PWR 85W D 36HSOP

Package: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad

Stock2,512
SC16C750BIBS,151
NXP

IC UART SINGLE W/FIFO 32-HVQFN

Package: 32-VFQFN Exposed Pad

Stock2,848
PC33909AER2
NXP

SBC 5V 2CAN 4LIN 16SG 64HLQFP

Package: -

Stock3,184
PCA9534D,118
NXP

IC I/O EXPANDER I2C 8B 16SOIC

Package: 16-SOIC (0.295", 7.50mm Width)

Stock29,868
MC145423DT
NXP

IC TXRX UDLT/ISDN 28TSSOP

Package: 28-TSSOP (0.173", 4.40mm Width)

Stock15,348
P5010NSN1VNB
NXP

IC MPU Q OR IQ 2.0GHZ 1295FCBGA

Package: 1295-BBGA, FCBGA

Stock6,384
KMPC8378EVRALG
NXP

IC MPU MPC83XX 667MHZ 689TEBGA

Package: 689-BBGA Exposed Pad

Stock5,856
MCF5270VM100J
NXP

IC MCU 32BIT ROMLESS 196MAPBGA

Package: 196-LBGA

Stock2,416
MC68HC908LK24CFQ
NXP

IC MCU 8BIT 24KB FLASH 80QFP

Package: 80-QFP

Stock3,888

Part Number	Manufacturer	Description	Package	Stock
ON5262,127	NXP	MOSFET RF TO220AB TO220AB Transistor Type: - Frequency: - Gain: - Voltage - Test: - Current Rating: - Noise Figure: - Current - Test: - Power - Output: - Voltage - Rated: - Package / Case: TO-220-3 Supplier Device Package: TO-220AB	Package: TO-220-3	Stock3,216
MRF9045LR1	NXP	FET RF 65V 945MHZ NI-360 Transistor Type: LDMOS Frequency: 945MHz Gain: 18.8dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 350mA Power - Output: 45W Voltage - Rated: 65V Package / Case: NI-360 Supplier Device Package: NI-360	Package: NI-360	Stock5,376
BLF4G20LS-110B,112	NXP	FET RF 65V 1.99GHZ SOT502B Transistor Type: LDMOS Frequency: 1.93GHz ~ 1.99GHz Gain: 13.4dB Voltage - Test: 28V Current Rating: 12A Noise Figure: - Current - Test: 650mA Power - Output: 100W Voltage - Rated: 65V Package / Case: SOT-502B Supplier Device Package: SOT502B	Package: SOT-502B	Stock7,136
MMRF1320NR1	NXP	TRANS 1.8--600MHZ 150W CW 50V Transistor Type: LDMOS (Dual) Frequency: 230MHz Gain: 26.1dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 100mA Power - Output: 150W Voltage - Rated: 133V Package / Case: TO-270-4 Supplier Device Package: TO-270 WB-4	Package: TO-270-4	Stock5,152
BC327-25,112	NXP	TRANS PNP 45V 0.5A TO-92 Transistor Type: PNP Current - Collector (Ic) (Max): 500mA Voltage - Collector Emitter Breakdown (Max): 45V Vce Saturation (Max) @ Ib, Ic: 700mV @ 50mA, 500mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V Power - Max: 625mW Frequency - Transition: 80MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) Supplier Device Package: TO-92-3	Package: TO-226-3, TO-92-3 (TO-226AA)	Stock7,904
PZM20NB3,115	NXP	DIODE ZENER 20V 300MW SMT3 Voltage - Zener (Nom) (Vz): 20V Tolerance: ±2% Power - Max: 300mW Impedance (Max) (Zzt): 20 Ohms Current - Reverse Leakage @ Vr: 70nA @ 15V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	Package: TO-236-3, SC-59, SOT-23-3	Stock4,160
MC33908LAE	NXP	IC SYSTEM BASIS CHIP CAN 48LQFP Applications: Power Supply, Automotive Applications Voltage - Input: -1 V ~ 40 V Number of Outputs: 6 Voltage - Output: Multiple Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	Package: 48-LQFP Exposed Pad	Stock5,984
LD6816CX4/27P,315	NXP	IC REG LINEAR 2.7V 150MA 4WLCSP Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 2.7V Voltage - Output (Max): - Voltage Dropout (Max): 0.075V @ 150mA Current - Output: 150mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature, Transient Voltage Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 4-XFBGA, WLCSP Supplier Device Package: 4-WLCSP (0.76x0.76)	Package: 4-XFBGA, WLCSP	Stock7,504
MC34SB0800AER2	NXP	IC MOTOR DRIVER 36V 64LQFP Applications: Pump, Valve Controller Current - Supply: - Voltage - Supply: 6 V ~ 36 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	Package: 64-LQFP Exposed Pad	Stock27,156
PCA9685PW/Q900,118	NXP	IC LED DRVR LIN DIM 25MA 28TSSOP Type: Linear Topology: - Internal Switch(s): Yes Number of Outputs: 16 Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V Voltage - Output: 5.5V Current - Output / Channel: 25mA Frequency: - Dimming: PWM Applications: Backlight Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP	Package: 28-TSSOP (0.173", 4.40mm Width)	Stock274,350
74LVT2952D,118	NXP	IC TRANSCEIVER 8BIT N-INV 24SOIC Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	Package: 24-SOIC (0.295", 7.50mm Width)	Stock5,968
TDF8599TD/N2,518	NXP	IC AMP AUDIO PWR 85W D 36HSOP Type: Class D Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Max Output Power x Channels @ Load: 85W x 1 @ 1 Ohm; 70W x 2 @ 2 Ohm Voltage - Supply: 8 V ~ 18 V Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 36-HSOP Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad	Package: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad	Stock2,512
SC16C750BIBS,151	NXP	IC UART SINGLE W/FIFO 32-HVQFN Features: - Number of Channels: 1, UART FIFO's: 64 Byte Protocol: - Data Rate (Max): 3Mbps Voltage - Supply: 2.5V, 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: - With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	Package: 32-VFQFN Exposed Pad	Stock2,848
PC33909AER2	NXP	SBC 5V 2CAN 4LIN 16SG 64HLQFP Applications: - Interface: - Voltage - Supply: - Package / Case: - Supplier Device Package: - Mounting Type: -	Package: -	Stock3,184
PCA9534D,118	NXP	IC I/O EXPANDER I2C 8B 16SOIC Number of I/O: 8 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SO	Package: 16-SOIC (0.295", 7.50mm Width)	Stock29,868
MC145423DT	NXP	IC TXRX UDLT/ISDN 28TSSOP Type: Transceiver Protocol: - Number of Drivers/Receivers: - Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP	Package: 28-TSSOP (0.173", 4.40mm Width)	Stock15,348
P5010NSN1VNB	NXP	IC MPU Q OR IQ 2.0GHZ 1295FCBGA Core Processor: PowerPC e5500 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 2.0GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (5), 10 Gbps (1) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 1295-BBGA, FCBGA Supplier Device Package: 1295-FCPBGA (37.5x37.5)	Package: 1295-BBGA, FCBGA	Stock6,384
KMPC8378EVRALG	NXP	IC MPU MPC83XX 667MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Security; SEC 3.0 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	Package: 689-BBGA Exposed Pad	Stock5,856
MCF5270VM100J	NXP	IC MCU 32BIT ROMLESS 196MAPBGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 100MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, WDT Number of I/O: 61 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 196-LBGA Supplier Device Package: 196-MAPBGA (15x15)	Package: 196-LBGA	Stock2,416
MC68HC908LK24CFQ	NXP	IC MCU 8BIT 24KB FLASH 80QFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: I2C, IRSCI, SPI Peripherals: LCD, LVD, POR, PWM Number of I/O: 40 Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	Package: 80-QFP	Stock3,888
MKV44F64VLH16	NXP	IC MCU 32BIT 64KB FLASH 64LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 168MHz Connectivity: CAN, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 48 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 29x12b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP	Stock6,660
KMC8144TVT1000A	NXP	IC DSP 783FCBGA Type: SC3400 Core Interface: EBI/EMI, Ethernet, I2C, PCI, Serial RapidIO, SPI, TDM, UART, UTOPIA Clock Rate: 1GHz Non-Volatile Memory: ROM (96 kB) On-Chip RAM: 10.5MB Voltage - I/O: 3.30V Voltage - Core: 1.00V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock7,872
SPC5777CDK3MME4	NXP	POWER ARCH CORES 8MB FL Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BGA Supplier Device Package: 416-MAPBGA (27x27)	Package: 416-BGA	Stock3,792
MFS8416AMBP5ESR2	NXP	SAFETY POWER MANAGEMENT IC, QFN4 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	Package: -	Request a Quote
MKE12Z128VLF7	NXP	IC MCU 32BIT 128KB FLASH 48LQFP Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 72MHz Connectivity: FlexIO, I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 11x12b SAR; D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: -	Request a Quote
MIMX8UD7CVP08SC	NXP	I.MX8ULP, DUAL 800MHZ Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
TJA1448AT-0Z	NXP	IC TRANSCEIVER HALF 2/2 14SO Type: Transceiver Protocol: CANbus Number of Drivers/Receivers: 2/2 Duplex: Half Receiver Hysteresis: 50 mV Data Rate: 5Mbps Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	Package: -	Stock47,607
FB32K116BRT0VLFT	NXP	S32K116, M0+, FLASH 128K, RAM 17 Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote