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NXP |
TRANS PREBIAS NPN 500MW TO92-3
- Transistor Type: NPN - Pre-Biased
- Current - Collector (Ic) (Max): 100mA
- Voltage - Collector Emitter Breakdown (Max): 50V
- Resistor - Base (R1) (Ohms): 47k
- Resistor - Emitter Base (R2) (Ohms): -
- DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
- Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
- Current - Collector Cutoff (Max): 1µA
- Frequency - Transition: -
- Power - Max: 500mW
- Mounting Type: Through Hole
- Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
- Supplier Device Package: TO-92-3
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Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) |
Stock4,352 |
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NXP |
TRANS PREBIAS NPN 500MW TO92-3
- Transistor Type: NPN - Pre-Biased
- Current - Collector (Ic) (Max): 100mA
- Voltage - Collector Emitter Breakdown (Max): 50V
- Resistor - Base (R1) (Ohms): 100k
- Resistor - Emitter Base (R2) (Ohms): -
- DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
- Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
- Current - Collector Cutoff (Max): 1µA
- Frequency - Transition: -
- Power - Max: 500mW
- Mounting Type: Through Hole
- Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
- Supplier Device Package: TO-92-3
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Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) |
Stock3,488 |
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NXP |
DIODE GEN PURP 1.2KV 8A TO220F
- Diode Type: Standard
- Voltage - DC Reverse (Vr) (Max): 1200V
- Current - Average Rectified (Io): 8A
- Voltage - Forward (Vf) (Max) @ If: 1.85V @ 20A
- Speed: Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr): 145ns
- Current - Reverse Leakage @ Vr: 1mA @ 1000V
- Capacitance @ Vr, F: -
- Mounting Type: Through Hole
- Package / Case: TO-220-2 Full Pack, Isolated Tab
- Supplier Device Package: TO-220FP
- Operating Temperature - Junction: 150°C (Max)
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Package: TO-220-2 Full Pack, Isolated Tab |
Stock6,032 |
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NXP |
DIODE ARRAY GP 80V 215MA SMT3
- Diode Configuration: 1 Pair Common Cathode
- Diode Type: Standard
- Voltage - DC Reverse (Vr) (Max): 80V
- Current - Average Rectified (Io) (per Diode): 215mA (DC)
- Voltage - Forward (Vf) (Max) @ If: 1.2V @ 100mA
- Speed: Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr): 4ns
- Current - Reverse Leakage @ Vr: 500nA @ 80V
- Operating Temperature - Junction: 150°C (Max)
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: SMT3; MPAK
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock2,208 |
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NXP |
IC CTRLR PFC 8SOIC
- Mode: -
- Frequency - Switching: -
- Current - Startup: -
- Voltage - Supply: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock4,384 |
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NXP |
IC BUS SWITCH 10BIT 24TSSOP
- Type: Bus Switch
- Circuit: 5 x 1:1
- Independent Circuits: 2
- Current - Output High, Low: -
- Voltage Supply Source: Single Supply
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 24-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 24-TSSOP
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Package: 24-TSSOP (0.173", 4.40mm Width) |
Stock7,424 |
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NXP |
IC BUFF DVR TRI-ST 16BIT 48SSOP
- Logic Type: Buffer, Non-Inverting
- Number of Elements: 4
- Number of Bits per Element: 4
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 12mA, 12mA
- Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-BSSOP (0.295", 7.50mm Width)
- Supplier Device Package: 48-SSOP
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Package: 48-BSSOP (0.295", 7.50mm Width) |
Stock3,616 |
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NXP |
IC CAN/LIN FAIL-SAFE HS 32HTSSOP
- Applications: Networking
- Interface: SPI
- Voltage - Supply: 3.3 V ~ 5 V
- Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
- Supplier Device Package: 32-HTSSOP
- Mounting Type: Surface Mount
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Package: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad |
Stock7,152 |
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NXP |
IC DUAL UART 64BYTE 32HVQFN
- Protocol: RS232, RS485
- Function: Controller
- Interface: I2C, SPI, UART
- Standards: -
- Voltage - Supply: 2.5V, 3.3V
- Current - Supply: 2mA
- Operating Temperature: -40°C ~ 95°C
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-HVQFN (5x5)
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Package: 32-VFQFN Exposed Pad |
Stock2,560 |
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NXP |
IC MPU Q OR IQ 1.067GHZ 689TBGA
- Core Processor: PowerPC e500v2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.067GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: LCD
- Ethernet: 10/100/1000 Mbps (2)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 689-BBGA Exposed Pad
- Supplier Device Package: 689-TEPBGA II (31x31)
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Package: 689-BBGA Exposed Pad |
Stock3,072 |
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NXP |
IC MPU MPC85XX 1.333GHZ 783BGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.333GHz
- Co-Processors/DSP: Signal Processing; SPE
- RAM Controllers: DDR, DDR2, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock3,360 |
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NXP |
IC MPU MPC7XX 350MHZ 360FCBGA
- Core Processor: PowerPC
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 350MHz
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 360-BBGA, FCCBGA
- Supplier Device Package: 360-FCPBGA (25x25)
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Package: 360-BBGA, FCCBGA |
Stock6,768 |
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NXP |
IC MPU MPC52XX 266MHZ 272BGA
- Core Processor: PowerPC G2_LE
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 266MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (1)
- SATA: -
- USB: USB 1.1 (2)
- Voltage - I/O: 2.5V, 3.3V
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: -
- Package / Case: 272-BBGA
- Supplier Device Package: 272-PBGA (27x27)
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Package: 272-BBGA |
Stock5,904 |
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NXP |
IC MPU Q OR IQ 800MHZ 689TEBGA
- Core Processor: PowerPC e500v2
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 3.3
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (3)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 689-BBGA Exposed Pad
- Supplier Device Package: 689-TEPBGA II (31x31)
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Package: 689-BBGA Exposed Pad |
Stock5,328 |
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NXP |
IC MCU 16BIT 128KB FLASH 80QFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, I2C, SCI, SPI
- Peripherals: PWM, WDT
- Number of I/O: 59
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
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Package: 80-QFP |
Stock4,768 |
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NXP |
IC MCU 32BIT ROMLESS 196MAPBGA
- Core Processor: Coldfire V2
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
- Peripherals: DMA, WDT
- Number of I/O: 61
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: -
- Package / Case: 196-LBGA
- Supplier Device Package: 196-MAPBGA (15x15)
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Package: 196-LBGA |
Stock4,640 |
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NXP |
DSP 16BIT QUAD CORE 431FCBGA
- Type: SC140 Core
- Interface: DSI, Ethernet, RS-232
- Clock Rate: 400MHz
- Non-Volatile Memory: External
- On-Chip RAM: 1.436MB
- Voltage - I/O: 3.30V
- Voltage - Core: 1.20V
- Operating Temperature: -40°C ~ 105°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 431-BFBGA, FCBGA
- Supplier Device Package: 431-FCPBGA (20x20)
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Package: 431-BFBGA, FCBGA |
Stock5,872 |
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NXP |
IC BAROMETER SPI DGTL MINI 8LGA
- Pressure Type: Absolute
- Operating Pressure: 7.25 PSI ~ 16.68 PSI (50 kPa ~ 115 kPa)
- Output Type: SPI
- Output: 10 b
- Accuracy: ±0.145 PSI (±1 kPa)
- Voltage - Supply: 2.375 V ~ 5.5 V
- Port Size: -
- Port Style: No Port
- Features: Shutdown Mode, Standby Mode
- Termination Style: PCB
- Maximum Pressure: 145.04 PSI (1000 kPa)
- Operating Temperature: -40°C ~ 105°C
- Package / Case: 8-TLGA
- Supplier Device Package: 8-LGA
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Package: 8-TLGA |
Stock6,642 |
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NXP |
IC WIRELESS PWR TX 32HVQFN
- Frequency: 110kHz ~ 205kHz
- Applications: General Purpose
- Modulation or Protocol: -
- Data Rate (Max): -
- Power - Output: -
- Current - Transmitting: 20mA
- Data Interface: I2C
- Antenna Connector: -
- Memory Size: -
- Features: -
- Voltage - Supply: 1.8V
- Operating Temperature: -20°C ~ 85°C
- Package / Case: 32-VFQFN Exposed Pad
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Package: 32-VFQFN Exposed Pad |
Stock7,866 |
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NXP |
IC RF TXRX+MCU 802.15.4 48-VFQFN
- Type: TxRx + MCU
- RF Family/Standard: 802.15.4
- Protocol: Zigbee?
- Modulation: O-QPSK
- Frequency: 2.4GHz
- Data Rate (Max): 250kbps
- Power - Output: 2dBm
- Sensitivity: -94dBm
- Memory Size: 82kB Flash, 5kB RAM
- Serial Interfaces: I2C, SPI, UART
- GPIO: 32
- Voltage - Supply: 1.8 V ~ 3.6 V
- Current - Receiving: 22.3mA ~ 34.2mA
- Current - Transmitting: 26.6mA
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 48-VFQFN Exposed Pad
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Package: 48-VFQFN Exposed Pad |
Stock6,426 |
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NXP |
DGTL ISOLATOR 5KV 2CH CAN 16SO
- Technology: Capacitive Coupling
- Type: CAN
- Isolated Power: No
- Number of Channels: 2
- Inputs - Side 1/Side 2: 1/1
- Channel Type: Unidirectional
- Voltage - Isolation: 5000Vrms
- Common Mode Transient Immunity (Min): 20kV/µs
- Data Rate: 2Mbps
- Propagation Delay tpLH / tpHL (Max): -
- Pulse Width Distortion (Max): -
- Rise / Fall Time (Typ): -
- Voltage - Supply: 3 V ~ 5.25 V
- Operating Temperature: -40°C ~ 105°C
- Package / Case: 16-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 16-SO
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Package: 16-SOIC (0.295", 7.50mm Width) |
Stock8,442 |
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NXP |
16-BIT MCU S12X CORE 384KB FLA
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 91
- Program Memory Size: 384KB (384K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 24K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
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Package: 112-LQFP |
Stock6,448 |
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NXP |
MAGNIV 16-BIT MCU S12Z CORE 12
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: CANbus, I²C, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 42
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
- Data Converters: A/D 16x10b, D/A 1x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP Exposed Pad
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP Exposed Pad |
Stock2,768 |
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NXP |
32-BIT DSC 56800EX CORE 48KB F
- Core Processor: 56800EX
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: I²C, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 26
- Program Memory Size: 48KB (24K x 16)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 4K x 16
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
- Data Converters: A/D 6x12b; D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-QFN (5x5)
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Package: 32-VFQFN Exposed Pad |
Stock7,472 |
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NXP |
IC MCU 16BIT 48KB FLASH 32LQFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: IrDA, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 16
- Program Memory Size: 48KB (48K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
- Data Converters: A/D 2x10b
- Oscillator Type: External, Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: - |
Request a Quote |
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NXP |
SOFTWARE DEFINED RADIO
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
IC MCU 8BIT 8KB FLASH 20TSSOP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: I2C, LINbus, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 18
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
- Data Converters: A/D 12x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 20-TSSOP
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Package: - |
Stock2,325 |
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NXP |
IC MCU 32BIT 1MB FLASH 100LQFP
- Core Processor: ARM® Cortex®-M4F
- Core Size: 32-Bit Single-Core
- Speed: 80MHz
- Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: 89
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
- Data Converters: A/D 24x12b SAR; D/A1x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: - |
Request a Quote |
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