Page 621 - NXP Products | Heisener Electronics

PDTD123YS,126
NXP

TRANS PREBIAS NPN 500MW TO92-3

Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

Stock7,888
PDTB123TK,115
NXP

TRANS PREBIAS PNP 250MW SMT3

Package: TO-236-3, SC-59, SOT-23-3

Stock4,816
BZX284-B11,115
NXP

DIODE ZENER 11V 400MW SOD2

Package: SOD-110

Stock5,776
N74F158AD,602
NXP

IC DATA SELECTOR/MUX 2IN 16SOIC

Package: 16-SOIC (0.154", 3.90mm Width)

Stock6,112
N74F02N,602
NXP

IC GATE NOR 4CH 2-INP 14-DIP

Package: 14-DIP (0.300", 7.62mm)

Stock2,016
HEF40374BP,652
NXP

IC D-TYPE POS TRG SNGL 20DIP

Package: 20-DIP (0.300", 7.62mm)

Stock3,968
TDA9995HL/C1,518
NXP

HDMI SW 3:1 EQUALIZER 100LQFP

Package: 100-LQFP

Stock4,064
SC16C750BIA44,518
NXP

IC UART SINGLE W/FIFO 44-PLCC

Package: 44-LCC (J-Lead)

Stock2,512
SC16C654BIBM,128
NXP

IC QUAD UART 64BYTE 64LQFP

Package: 64-LQFP

Stock2,832
MPC8313VRAFFB
NXP

IC MPU MPC83XX 333MHZ 516BGA

Package: 516-BBGA Exposed Pad

Stock15,168
MC7448HX1000NC
NXP

IC MPU MPC74XX 1.0GHZ 360FCCBGA

Package: 360-BCBGA, FCCBGA

Stock5,952
MPC8323VRADDCA
NXP

IC MPU MPC83XX 266MHZ 516BGA

Package: 516-BBGA

Stock2,112
PK60N512VLL100
NXP

IC MCU 32BIT 512KB FLASH 100LQFP

Package: 100-LQFP

Stock7,936
MCF5282CVM80J
NXP

IC MCU 32BIT 512KB FLASH 256BGA

Package: 256-LBGA

Stock4,800
MC56F8247MLH
NXP

IC MCU 16BIT 48KB FLASH 64LQFP

Package: 64-LQFP

Stock7,824
MC9S08SL8CTL
NXP

IC MCU 8BIT 8KB FLASH 28TSSOP

Package: 28-TSSOP (0.173", 4.40mm Width)

Stock5,616
MKL13Z64VLH4
NXP

IC MCU 32BIT 64KB FLASH 64LQFP

Package: 64-LQFP

Stock7,392
MC9RS08KA8CPG
NXP

IC MCU 8BIT 8KB FLASH 16DIP

Package: 16-DIP (0.300", 7.62mm)

Stock4,608
PCT2075TP,147
NXP

SENSOR TEMP I2C/SMBUS 8HWSON

Package: 8-WFDFN Exposed Pad

Stock91,482
NCF2971ETT/T0E080J
NXP

IC REMOTE KEYLESS ENTRY 38TSSOP

Package: -

Stock4,122

Part Number	Manufacturer	Description	Package	Stock
PDTD123YS,126	NXP	TRANS PREBIAS NPN 500MW TO92-3 Transistor Type: NPN - Pre-Biased Current - Collector (Ic) (Max): 500mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 2.2k Resistor - Emitter Base (R2) (Ohms): 10k DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 50mA, 5V Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA Current - Collector Cutoff (Max): 500nA Frequency - Transition: - Power - Max: 500mW Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	Stock7,888
PDTB123TK,115	NXP	TRANS PREBIAS PNP 250MW SMT3 Transistor Type: PNP - Pre-Biased Current - Collector (Ic) (Max): 500mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 2.2k Resistor - Emitter Base (R2) (Ohms): - DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 50mA, 5V Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA Current - Collector Cutoff (Max): 500nA Frequency - Transition: - Power - Max: 250mW Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	Package: TO-236-3, SC-59, SOT-23-3	Stock4,816
BZX284-B11,115	NXP	DIODE ZENER 11V 400MW SOD2 Voltage - Zener (Nom) (Vz): 11V Tolerance: ±2% Power - Max: 400mW Impedance (Max) (Zzt): 10 Ohms Current - Reverse Leakage @ Vr: 100nA @ 8V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: SOD-110 Supplier Device Package: SOD110	Package: SOD-110	Stock5,776
N74F158AD,602	NXP	IC DATA SELECTOR/MUX 2IN 16SOIC Type: Multiplexer Circuit: 4 x 2:1 Independent Circuits: 1 Current - Output High, Low: 1mA, 20mA Voltage Supply Source: Single Supply Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	Package: 16-SOIC (0.154", 3.90mm Width)	Stock6,112
N74F02N,602	NXP	IC GATE NOR 4CH 2-INP 14-DIP Logic Type: NOR Gate Number of Circuits: 4 Number of Inputs: 2 Features: - Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Max): - Current - Output High, Low: 1mA, 20mA Logic Level - Low: 0.8V Logic Level - High: 2V Max Propagation Delay @ V, Max CL: 5.5ns @ 5V, 50pF Operating Temperature: 0°C ~ 70°C Mounting Type: Through Hole Supplier Device Package: 14-DIP Package / Case: 14-DIP (0.300", 7.62mm)	Package: 14-DIP (0.300", 7.62mm)	Stock2,016
HEF40374BP,652	NXP	IC D-TYPE POS TRG SNGL 20DIP Function: Standard Type: D-Type Output Type: Tri-State, Non-Inverted Number of Elements: 1 Number of Bits per Element: 8 Clock Frequency: 17MHz Max Propagation Delay @ V, Max CL: 80ns @ 15V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 50mA, 62mA Voltage - Supply: 3 V ~ 15 V Current - Quiescent (Iq): - Input Capacitance: - Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm)	Package: 20-DIP (0.300", 7.62mm)	Stock3,968
TDA9995HL/C1,518	NXP	HDMI SW 3:1 EQUALIZER 100LQFP Type: HDMI 1.3 Smart Switch Applications: TV Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock4,064
SC16C750BIA44,518	NXP	IC UART SINGLE W/FIFO 44-PLCC Features: - Number of Channels: 1, UART FIFO's: 64 Byte Protocol: - Data Rate (Max): 3Mbps Voltage - Supply: 2.5V, 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: - With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	Package: 44-LCC (J-Lead)	Stock2,512
SC16C654BIBM,128	NXP	IC QUAD UART 64BYTE 64LQFP Features: - Number of Channels: 4, QUART FIFO's: 64 Byte Protocol: - Data Rate (Max): 5Mbps Voltage - Supply: 2.5V, 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (7x7)	Package: 64-LQFP	Stock2,832
MPC8313VRAFFB	NXP	IC MPU MPC83XX 333MHZ 516BGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27x27)	Package: 516-BBGA Exposed Pad	Stock15,168
MC7448HX1000NC	NXP	IC MPU MPC74XX 1.0GHZ 360FCCBGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25x25)	Package: 360-BCBGA, FCCBGA	Stock5,952
MPC8323VRADDCA	NXP	IC MPU MPC83XX 266MHZ 516BGA Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	Package: 516-BBGA	Stock2,112
PK60N512VLL100	NXP	IC MCU 32BIT 512KB FLASH 100LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 66 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 19x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock7,936
MCF5282CVM80J	NXP	IC MCU 32BIT 512KB FLASH 256BGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 80MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 150 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA	Package: 256-LBGA	Stock4,800
MC56F8247MLH	NXP	IC MCU 16BIT 48KB FLASH 64LQFP Core Processor: 56800E Core Size: 16-Bit Speed: 60MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 48KB (24K x 16) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 16 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 16x12b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP	Stock7,824
MC9S08SL8CTL	NXP	IC MCU 8BIT 8KB FLASH 28TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 22 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP	Package: 28-TSSOP (0.173", 4.40mm Width)	Stock5,616
MKL13Z64VLH4	NXP	IC MCU 32BIT 64KB FLASH 64LQFP Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: FlexIO, I2C, IrDA, SPI, UART/USART Peripherals: DMA, PWM, WDT Number of I/O: 54 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 20x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP	Stock7,392
MC9RS08KA8CPG	NXP	IC MCU 8BIT 8KB FLASH 16DIP Core Processor: RS08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C Peripherals: LVD, POR, PWM, WDT Number of I/O: 14 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 254 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	Package: 16-DIP (0.300", 7.62mm)	Stock4,608
PCT2075TP,147	NXP	SENSOR TEMP I2C/SMBUS 8HWSON Sensor Type: Digital, Local Sensing Temperature - Local: -55°C ~ 125°C Sensing Temperature - Remote: - Output Type: I2C/SMBus Voltage - Supply: 2.7 V ~ 5.5 V Resolution: 10 b Features: Output Switch, Programmable Limit Accuracy - Highest (Lowest): ±1°C (±2°C) Test Condition: -25°C ~ 100°C (-55°C ~ 125°C) Operating Temperature: -55°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-WFDFN Exposed Pad Supplier Device Package: 8-HWSON (2x3)	Package: 8-WFDFN Exposed Pad	Stock91,482
NCF2971ETT/T0E080J	NXP	IC REMOTE KEYLESS ENTRY 38TSSOP Type: - Frequency: - Standards: - Interface: - Voltage - Supply: - Operating Temperature: - Package / Case: - Supplier Device Package: -	Package: -	Stock4,122
SPC5603BK0CLL4	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 48MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 28K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 28x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock7,344
S9S12GA128AMLF	NXP	12-BIT ADC SPE TST SCREE Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock5,760
S9S12ZVL8F0CLF	NXP	MAGNIV 16-BIT MCU S12Z CORE 8K Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: I²C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock5,040
SAF7755HV/N205K	NXP	DSP AUDIO MULTI-TUNER Type: Audio, Car Signal Processor Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-HLQFP (24x24)	Package: 176-LQFP Exposed Pad	Stock7,968
TJR1462BTK-0Z	NXP	IC 8HVSON Type: - Protocol: - Number of Drivers/Receivers: - Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Supplier Device Package: 8-HVSON (3x3)	Package: -	Request a Quote
SAF4000EL-101Z43AK	NXP	SAF4000EL Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
FS32V234CON2VUBR	NXP	IC MPU FS32V23 1GHZ 621FCPBGA Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE SATA: - USB: - Voltage - I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17x17)	Package: -	Request a Quote
MC33GD3100B3EK	NXP	GATE DRIVERS HV ISOLATED GATE DR Driven Configuration: Half-Bridge Channel Type: Single Number of Drivers: 1 Gate Type: IGBT, N-Channel MOSFET Voltage - Supply: 3.3V Logic Voltage - VIL, VIH: - Current - Peak Output (Source, Sink): 15A, 15A Input Type: - High Side Voltage - Max (Bootstrap): - Rise / Fall Time (Typ): - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 32-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 32-SOIC	Package: -	Stock126