Page 64 - NXP Products | Heisener Electronics

MRF6S24140HSR3
NXP

FET RF 68V 2.39GHZ NI-88OS

Package: NI-880S

Stock2,992
BZX284-B68,115
NXP

DIODE ZENER 68V 400MW SOD2

Package: SOD-110

Stock3,456
UBA2211BP/N1,112
NXP

IC CFL DRIVER 8DIP

Package: 8-DIP (0.300", 7.62mm)

Stock4,528
HEF4024BT,652
NXP

IC 7STAGE BINARY COUNTER 14SOIC

Package: 14-SOIC (0.154", 3.90mm Width)

Stock4,320
74ABT648D,623
NXP

IC TRANSCEIVER 8BIT INV 24SOIC

Package: 24-SOIC (0.295", 7.50mm Width)

Stock7,104
PC33663BSEFR2
NXP

DUAL LINCELL 14SOIC

Package: -

Stock5,312
SL3FCS1001FV/DH,11
NXP

IC I-CODE SLI FCP2

Package: 2-FlipChip

Stock2,944
P5020NXN1QMB
NXP

IC MPU Q OR IQ 2.0GHZ 1295FCBGA

Package: 1295-BBGA, FCBGA

Stock4,512
MPC8545VTAQGD
NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Package: 783-BBGA, FCBGA

Stock7,520
XPC850SRZT66BU
NXP

IC MPU MPC8XX 66MHZ 256BGA

Package: 256-BGA

Stock3,888
MC860SRCVR50D4R2
NXP

IC MPU MPC8XX 50MHZ 357BGA

Package: 357-BBGA

Stock4,704
MCHC711KS2CFNE4
NXP

IC MCU 8BIT 32KB OTP 68PLCC

Package: 68-LCC (J-Lead)

Stock5,328
MC912DG128AVPVE
NXP

IC MCU 16BIT 128KB FLASH 112LQFP

Package: 112-LQFP

Stock6,960
S9S12XS256J0CAL
NXP

IC MCU 16BIT 256KB FLASH 112LQFP

Package: 112-LQFP

Stock3,536
MC9S08PA8VWJ
NXP

IC MCU 8BIT 8KB FLASH 20SOIC

Package: 20-SOIC (0.295", 7.50mm Width)

Stock6,560
SAC57D54HCVMO
NXP

IC MCU 32BIT 4MB FLASH 516MAPBGA

Package: 516-BGA

Stock10,728
MPX4100AP1
NXP

PRESSURE SENSOR ABSOLUTE 6-SIP

Package: 6-SIP Module

Stock5,346
MMA5206NDIKGCWR2
NXP

ACCELEROMETER PSI5 16QFN

Package: -

Stock5,346
MMA6805AKW
NXP

ACCELEROMETER 16QFN

Package: 16-QFN Exposed Pad

Stock8,838
TEA6843HL/V1,518
NXP

IC CAR RADIO TUNER 80-LQFP

Package: 80-LQFP

Stock5,508

Part Number	Manufacturer	Description	Package	Stock
MRF6S24140HSR3	NXP	FET RF 68V 2.39GHZ NI-88OS Transistor Type: LDMOS Frequency: 2.39GHz Gain: 15.2dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.3A Power - Output: 28W Voltage - Rated: 68V Package / Case: NI-880S Supplier Device Package: NI-880S	Package: NI-880S	Stock2,992
BZX284-B68,115	NXP	DIODE ZENER 68V 400MW SOD2 Voltage - Zener (Nom) (Vz): 68V Tolerance: ±2% Power - Max: 400mW Impedance (Max) (Zzt): 160 Ohms Current - Reverse Leakage @ Vr: 50nA @ 47.6V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: SOD-110 Supplier Device Package: SOD110	Package: SOD-110	Stock3,456
UBA2211BP/N1,112	NXP	IC CFL DRIVER 8DIP Type: CFL/TL Driver Frequency: 40.05kHz ~ 42.68kHz Voltage - Supply: 10.7 V ~ 13.8 V Current - Supply: - Current - Output Source/Sink: 1.35A Dimming: No Operating Temperature: -40°C ~ 150°C Mounting Type: Through Hole Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-DIP	Package: 8-DIP (0.300", 7.62mm)	Stock4,528
HEF4024BT,652	NXP	IC 7STAGE BINARY COUNTER 14SOIC Logic Type: Binary Counter Direction: Up Number of Elements: 1 Number of Bits per Element: 7 Reset: Asynchronous Timing: - Count Rate: 35MHz Trigger Type: Negative Edge Voltage - Supply: 4.5 V ~ 15.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	Package: 14-SOIC (0.154", 3.90mm Width)	Stock4,320
74ABT648D,623	NXP	IC TRANSCEIVER 8BIT INV 24SOIC Logic Type: Transceiver, Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	Package: 24-SOIC (0.295", 7.50mm Width)	Stock7,104
PC33663BSEFR2	NXP	DUAL LINCELL 14SOIC Applications: - Interface: - Voltage - Supply: - Package / Case: - Supplier Device Package: - Mounting Type: -	Package: -	Stock5,312
SL3FCS1001FV/DH,11	NXP	IC I-CODE SLI FCP2 Applications: - Interface: - Voltage - Supply: - Package / Case: 2-FlipChip Supplier Device Package: FCP2 Mounting Type: Surface Mount	Package: 2-FlipChip	Stock2,944
P5020NXN1QMB	NXP	IC MPU Q OR IQ 2.0GHZ 1295FCBGA Core Processor: PowerPC e5500 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 2.0GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (5), 10 Gbps (1) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 1295-BBGA, FCBGA Supplier Device Package: 1295-FCPBGA (37.5x37.5)	Package: 1295-BBGA, FCBGA	Stock4,512
MPC8545VTAQGD	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock7,520
XPC850SRZT66BU	NXP	IC MPU MPC8XX 66MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 256-BGA Supplier Device Package: 256-PBGA (23x23)	Package: 256-BGA	Stock3,888
MC860SRCVR50D4R2	NXP	IC MPU MPC8XX 50MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (4) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	Package: 357-BBGA	Stock4,704
MCHC711KS2CFNE4	NXP	IC MCU 8BIT 32KB OTP 68PLCC Core Processor: HC11 Core Size: 8-Bit Speed: 4MHz Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 51 Program Memory Size: 32KB (32K x 8) Program Memory Type: OTP EEPROM Size: 640 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (25x25)	Package: 68-LCC (J-Lead)	Stock5,328
MC912DG128AVPVE	NXP	IC MCU 16BIT 128KB FLASH 112LQFP Core Processor: CPU12 Core Size: 16-Bit Speed: 8MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 69 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 16x8/10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	Package: 112-LQFP	Stock6,960
S9S12XS256J0CAL	NXP	IC MCU 16BIT 256KB FLASH 112LQFP Core Processor: HCS12X Core Size: 16-Bit Speed: 40MHz Connectivity: CAN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	Package: 112-LQFP	Stock3,536
MC9S08PA8VWJ	NXP	IC MCU 8BIT 8KB FLASH 20SOIC Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LIN, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 18 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SOIC	Package: 20-SOIC (0.295", 7.50mm Width)	Stock6,560
SAC57D54HCVMO	NXP	IC MCU 32BIT 4MB FLASH 516MAPBGA Core Processor: ARM? Cortex?-A5, -M4, -M0+ Core Size: 32-Bit Tri-Core Speed: 80MHz, 160MHz, 320MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, LIN, SPI Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT Number of I/O: - Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2.3M x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 516-BGA Supplier Device Package: 516-MAPBGA (27x27)	Package: 516-BGA	Stock10,728
MPX4100AP1	NXP	PRESSURE SENSOR ABSOLUTE 6-SIP Pressure Type: Absolute Operating Pressure: 2.9 PSI ~ 15.23 PSI (20 kPa ~ 105 kPa) Output Type: Analog Voltage Output: 0.3 V ~ 4.9 V Accuracy: ±1.8% Voltage - Supply: 4.85 V ~ 5.35 V Port Size: Male - 0.19" (4.93mm) Tube Port Style: Barbed Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 6-SIP Module Supplier Device Package: -	Package: 6-SIP Module	Stock5,346
MMA5206NDIKGCWR2	NXP	ACCELEROMETER PSI5 16QFN Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock5,346
MMA6805AKW	NXP	ACCELEROMETER 16QFN Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN-EP (6x6)	Package: 16-QFN Exposed Pad	Stock8,838
TEA6843HL/V1,518	NXP	IC CAR RADIO TUNER 80-LQFP Frequency: AM, FM, WB Sensitivity: - Data Rate (Max): - Modulation or Protocol: AM, FM Applications: AM/FM Radio Receiver Current - Receiving: 90mA Data Interface: PCB, Surface Mount Memory Size: - Antenna Connector: PCB, Surface Mount Features: - Voltage - Supply: 2.5 V ~ 12 V Operating Temperature: -40°C ~ 85°C Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12)	Package: 80-LQFP	Stock5,508
MC13821-1575EVK	NXP	KIT EVALUATION MC13821-1575 Type: Amplifier Frequency: 1575.42MHz For Use With/Related Products: - Supplied Contents: -	Package: -	Stock2,898
MWE6IC9080NBR1	NXP	RF AMP LDMOS TO-272 960MHZ Frequency: 865MHz ~ 960MHz P1dB: 90W Gain: 28.8dB Noise Figure: - RF Type: GSM, EDGE Voltage - Supply: 28V Current - Supply: - Test Frequency: - Package / Case: TO-272-14 Variant, Flat Leads Supplier Device Package: TO-272 WB-14	Package: TO-272-14 Variant, Flat Leads	Stock8,586
MC35FS4500CAER2	NXP	FS4500 Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP Exposed Pad	Stock5,136
MC07XSF517BEK	NXP	IC SWITCH 54SOIC Switch Type: General Purpose Number of Outputs: 6 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 18V (Max) Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Current - Output (Max): 5.5A, 11A Rds On (Typ): 7 mOhm, 17 mOhm Input Type: - Features: Internal PWM Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-HSOP	Package: 54-SSOP (0.295", 7.50mm Width) Exposed Pad	Stock7,712
LS1020AXE7MQB	NXP	LS1 32BIT ARM SOC 1.2GHZ DDR3/ Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: GbE (3) SATA: SATA 3Gbps (1) USB: USB 2.0 (1), USB 3.0 + PHY Voltage - I/O: - Operating Temperature: -40°C ~ 105°C Security Features: - Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	Package: 525-FBGA, FCBGA	Stock5,168
SPC5674KAVMS2	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z7d Core Size: 32-Bit Dual-Core Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V Data Converters: A/D 34x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19x19)	Package: 473-LFBGA	Stock4,992
LPC5504JBD64K	NXP	IC MCU 32BIT 128KB FLASH 64HTQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 96MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 45 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 9x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-TQFP Exposed Pad Supplier Device Package: 64-HTQFP (10x10)	Package: -	Request a Quote
MC33FS6505KAER2	NXP	SYSTEM BASIS CHIP, DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	Package: -	Request a Quote