|
|
NXP |
FET RF 65V 2.3GHZ NI-1230-4LS2L
- Transistor Type: LDMOS
- Frequency: 2.3GHz
- Gain: 14.9dB
- Voltage - Test: 28V
- Current Rating: -
- Noise Figure: -
- Current - Test: 750mA
- Power - Output: 66W
- Voltage - Rated: 65V
- Package / Case: NI-1230-4LS2L
- Supplier Device Package: NI-1230-4LS2L
|
Package: NI-1230-4LS2L |
Stock2,624 |
|
|
|
NXP |
DIODE PIN 50V 100MA SOT-23
- Diode Type: PIN - 1 Pair Common Cathode
- Voltage - Peak Reverse (Max): 50V
- Current - Max: 100mA
- Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
- Resistance @ If, F: 1.9 Ohm @ 100mA, 100MHz
- Power Dissipation (Max): 250mW
- Operating Temperature: -65°C ~ 150°C (TJ)
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: TO-236AB (SOT23)
|
Package: TO-236-3, SC-59, SOT-23-3 |
Stock7,600 |
|
|
|
NXP |
IC SWITCH HIGH SIDE QUAD 24PQFN
- Switch Type: General Purpose
- Number of Outputs: 4
- Ratio - Input:Output: 1:1
- Output Configuration: High Side
- Output Type: N-Channel
- Interface: SPI
- Voltage - Load: 6 V ~ 20 V
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Current - Output (Max): 6A
- Rds On (Typ): 10 mOhm (Max), 35 mOhm (Max)
- Input Type: -
- Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
- Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
- Operating Temperature: -40°C ~ 150°C (TJ)
- Package / Case: 24-PowerQFN
- Supplier Device Package: 24-PQFN (12x12)
|
Package: 24-PowerQFN |
Stock2,608 |
|
|
|
NXP |
IC CTLR SMPS GREEN CHIP 8SOIC
- Output Isolation: Isolated
- Internal Switch(s): Yes
- Voltage - Breakdown: 650V
- Topology: Flyback
- Voltage - Start Up: 16V
- Voltage - Supply (Vcc/Vdd): 12 V ~ 24 V
- Duty Cycle: 66%
- Frequency - Switching: 20kHz ~ 50kHz
- Power (Watts): 3W
- Fault Protection: Current Limiting, Over Temperature, Over Voltage
- Control Features: -
- Operating Temperature: -10°C ~ 70°C (TA)
- Package / Case: 8-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 8-SO
- Mounting Type: Surface Mount
|
Package: 8-SOIC (0.295", 7.50mm Width) |
Stock5,936 |
|
|
|
NXP |
IC OCTAL TRANSP LTCH 3ST 20TSSOP
- Logic Type: D-Type Transparent Latch
- Circuit: 8:8
- Output Type: Tri-State
- Voltage - Supply: 4.5 V ~ 5.5 V
- Independent Circuits: 1
- Delay Time - Propagation: 3.6ns
- Current - Output High, Low: 32mA, 64mA
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 20-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 20-TSSOP
|
Package: 20-TSSOP (0.173", 4.40mm Width) |
Stock6,880 |
|
|
|
NXP |
IC D-TYPE POS TRG SNGL 20TSSOP
- Function: Standard
- Type: D-Type
- Output Type: Tri-State, Non-Inverted
- Number of Elements: 1
- Number of Bits per Element: 8
- Clock Frequency: 150MHz
- Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
- Trigger Type: Positive Edge
- Current - Output High, Low: 32mA, 64mA
- Voltage - Supply: 2.7 V ~ 3.6 V
- Current - Quiescent (Iq): 190µA
- Input Capacitance: 4pF
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-TSSOP (0.173", 4.40mm Width)
|
Package: 20-TSSOP (0.173", 4.40mm Width) |
Stock6,992 |
|
|
|
NXP |
IC UART SINGLE W/FIFO 36-TFBGA
- Features: -
- Number of Channels: 1, UART
- FIFO's: 128 Byte
- Protocol: RS485
- Data Rate (Max): 5Mbps
- Voltage - Supply: 2.5 V ~ 3.3 V
- With Auto Flow Control: Yes
- With IrDA Encoder/Decoder: Yes
- With False Start Bit Detection: Yes
- With Modem Control: Yes
- Mounting Type: Surface Mount
- Package / Case: 36-TFBGA
- Supplier Device Package: 36-TFBGA (3.5x3.5)
|
Package: 36-TFBGA |
Stock2,100 |
|
|
|
NXP |
IC I/O EXPANDER I2C 8B 16SOIC
- Number of I/O: 8
- Interface: I2C, SMBus
- Interrupt Output: No
- Features: POR
- Output Type: Open Drain, Push-Pull
- Current - Output Source/Sink: 10mA, 20mA
- Clock Frequency: 400kHz
- Voltage - Supply: 2.3 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 16-SO
|
Package: 16-SOIC (0.154", 3.90mm Width) |
Stock10,740 |
|
|
|
NXP |
IC I/O EXPANDER 16BIT 24UFBGA
- Number of I/O: 16
- Interface: I2C, SMBus
- Interrupt Output: Yes
- Features: POR
- Output Type: Open Drain, Push-Pull
- Current - Output Source/Sink: 10mA, 25mA
- Clock Frequency: 400kHz
- Voltage - Supply: 1.65 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 24-UFBGA
- Supplier Device Package: 24-UFBGA (2x2)
|
Package: 24-UFBGA |
Stock5,488 |
|
|
|
NXP |
IC STAND-ALONE CAN CTRLR 28-SOIC
- Protocol: CAN
- Function: Controller
- Interface: Parallel
- Standards: CAN 2.0
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Supply: 15mA
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 28-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 28-SO
|
Package: 28-SOIC (0.295", 7.50mm Width) |
Stock4,560 |
|
|
|
NXP |
IC MPU MPC8XX 80MHZ 357BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 80MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (2), 10/100 Mbps (2)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
|
Package: 357-BBGA |
Stock6,624 |
|
|
|
NXP |
IC MPU MPC82XX 266MHZ 352TBGA
- Core Processor: PowerPC 603e
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 266MHz
- Co-Processors/DSP: -
- RAM Controllers: SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 352-LBGA
- Supplier Device Package: 352-TBGA (35x35)
|
Package: 352-LBGA |
Stock15,984 |
|
|
|
NXP |
IC MCU 8BIT 32KB OTP 68PLCC
- Core Processor: HC11
- Core Size: 8-Bit
- Speed: 3MHz
- Connectivity: SCI, SPI
- Peripherals: POR, PWM, WDT
- Number of I/O: 51
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: OTP
- EEPROM Size: 640 x 8
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 8x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 68-LCC (J-Lead)
- Supplier Device Package: 68-PLCC (25x25)
|
Package: 68-LCC (J-Lead) |
Stock10,284 |
|
|
|
NXP |
IC MCU 8BIT 4.5KB OTP 28SOIC
- Core Processor: HC05
- Core Size: 8-Bit
- Speed: 2.1MHz
- Connectivity: SIO
- Peripherals: POR, WDT
- Number of I/O: 21
- Program Memory Size: 4.5KB (4.5K x 8)
- Program Memory Type: OTP
- EEPROM Size: -
- RAM Size: 176 x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 4x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 28-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 28-SOIC
|
Package: 28-SOIC (0.295", 7.50mm Width) |
Stock137,796 |
|
|
|
NXP |
IC MCU 32BIT 1MB FLASH 144MAPBGA
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 150MHz
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 95
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 53x16b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 144-LFBGA
- Supplier Device Package: 144-MAPBGA (13x13)
|
Package: 144-LFBGA |
Stock5,312 |
|
|
|
NXP |
IC MCU 32BIT ROMLESS 208TFBGA
- Core Processor: ARM7?
- Core Size: 16/32-Bit
- Speed: 72MHz
- Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
- Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O: 160
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 82K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 8x10b; D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 208-TFBGA
- Supplier Device Package: 208-TFBGA (15x15)
|
Package: 208-TFBGA |
Stock6,360 |
|
|
|
NXP |
IC MCU 32BIT 512KB FLASH 208BGA
- Core Processor: ARM7?
- Core Size: 16/32-Bit
- Speed: 72MHz
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
- Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O: 160
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 98K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 8x10b; D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 208-TFBGA
- Supplier Device Package: 208-TFBGA (15x15)
|
Package: 208-TFBGA |
Stock5,232 |
|
|
|
NXP |
IC MCU 32BIT 24KB FLASH 48LQFP
- Core Processor: ARM? Cortex?-M0
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, WDT
- Number of I/O: 42
- Program Memory Size: 24KB (24K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
|
Package: 48-LQFP |
Stock28,926 |
|
|
|
NXP |
IC MCU RISC 28TSSOP
- Frequency: -
- Applications: -
- Modulation or Protocol: -
- Data Rate (Max): -
- Power - Output: -
- Current - Transmitting: -
- Data Interface: -
- Antenna Connector: -
- Memory Size: -
- Features: -
- Voltage - Supply: -
- Operating Temperature: -
- Package / Case: -
|
Package: - |
Stock5,580 |
|
|
|
NXP |
IC FM IF SYSTEM LOW PWR 16-SOIC
- Function: FM IF System
- Frequency: -
- RF Type: Cellular, FSK, ASK
- Secondary Attributes: RSSI Equipped
- Package / Case: 16-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 16-SO
|
Package: 16-SOIC (0.154", 3.90mm Width) |
Stock16,362 |
|
|
|
NXP |
QORIQ 64B POWER 24X 1.67GHZ TH
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Stock7,056 |
|
|
|
NXP |
QORIQ64B POWER ARCH8X 1.5GHZ T
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Stock2,224 |
|
|
|
NXP |
S08AC 8-BIT MCU S08 CORE 128KB
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I²C, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 54
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 64-QFP
- Supplier Device Package: 64-QFP (14x14)
|
Package: 64-QFP |
Stock7,392 |
|
|
|
NXP |
16-BIT MCU S12 CORE 240KB FLAS
- Core Processor: 12V1
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CANbus, IrDA, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 54
- Program Memory Size: 240KB (240K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 11K x 8
- Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
|
Package: 64-LQFP |
Stock7,664 |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QXP
- Applications: High Performance i.MX 8, S32x Processor Based
- Current - Supply: -
- Voltage - Supply: 2.5V ~ 5.5V
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-HVQFN (8x8)
|
Package: 56-VFQFN Exposed Pad |
Stock5,088 |
|
|
|
NXP |
MWCT2016S,MAXQFP100
- Applications: -
- Current - Supply: -
- Voltage - Supply: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Request a Quote |
|
|
|
NXP |
IC TXRX FULL/HALF 1/1 36HVQFN
- Type: Transceiver
- Protocol: Ethernet
- Number of Drivers/Receivers: 1/1
- Duplex: Full, Half
- Receiver Hysteresis: 500 mV
- Data Rate: 100Mbps
- Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 36-VFQFN Exposed Pad
- Supplier Device Package: 36-HVQFN (6x6)
|
Package: - |
Stock33,111 |
|
|
|
NXP |
DIODE SCHOTTKY 40V 3A SOD123W
- Diode Type: -
- Voltage - DC Reverse (Vr) (Max): -
- Current - Average Rectified (Io): -
- Voltage - Forward (Vf) (Max) @ If: -
- Speed: -
- Reverse Recovery Time (trr): -
- Current - Reverse Leakage @ Vr: -
- Capacitance @ Vr, F: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
- Operating Temperature - Junction: -
|
Package: - |
Request a Quote |
|