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NXP |
FET RF 133V 512MHZ TO-270-2
- Transistor Type: LDMOS
- Frequency: 512MHz
- Gain: 25.4dB
- Voltage - Test: 50V
- Current Rating: -
- Noise Figure: -
- Current - Test: 10mA
- Power - Output: 25W
- Voltage - Rated: 133V
- Package / Case: TO-270-2 Gull Wing
- Supplier Device Package: TO-270-2 GULL
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Package: TO-270-2 Gull Wing |
Stock9,036 |
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NXP |
JFET N-CH 20V 30MA SOT23
- Transistor Type: N-Channel JFET
- Frequency: 100MHz
- Gain: -
- Voltage - Test: 10V
- Current Rating: 30mA
- Noise Figure: 1.5dB
- Current - Test: 5mA
- Power - Output: -
- Voltage - Rated: 20V
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: TO-236AB (SOT23)
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock7,168 |
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NXP |
TRANS PREBIAS PNP 500MW TO92-3
- Transistor Type: PNP - Pre-Biased
- Current - Collector (Ic) (Max): 20mA
- Voltage - Collector Emitter Breakdown (Max): 50V
- Resistor - Base (R1) (Ohms): 100k
- Resistor - Emitter Base (R2) (Ohms): 100k
- DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
- Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
- Current - Collector Cutoff (Max): 1µA
- Frequency - Transition: -
- Power - Max: 500mW
- Mounting Type: Through Hole
- Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
- Supplier Device Package: TO-92-3
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Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) |
Stock2,912 |
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NXP |
IC GATE AND 3CH 3-INP 14-TSSOP
- Logic Type: AND Gate
- Number of Circuits: 3
- Number of Inputs: 3
- Features: -
- Voltage - Supply: 1.65 V ~ 3.6 V
- Current - Quiescent (Max): 10µA
- Current - Output High, Low: 24mA, 24mA
- Logic Level - Low: 0.12 V ~ 0.8 V
- Logic Level - High: 1.08 V ~ 2 V
- Max Propagation Delay @ V, Max CL: 6.2ns @ 3.3V, 50pF
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Supplier Device Package: 14-TSSOP
- Package / Case: 14-TSSOP (0.173", 4.40mm Width)
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Package: 14-TSSOP (0.173", 4.40mm Width) |
Stock7,824 |
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NXP |
IC D-TYPE POS TRG SNGL 20TSSOP
- Function: Standard
- Type: D-Type
- Output Type: Tri-State, Non-Inverted
- Number of Elements: 1
- Number of Bits per Element: 8
- Clock Frequency: 150MHz
- Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
- Trigger Type: Positive Edge
- Current - Output High, Low: 32mA, 64mA
- Voltage - Supply: 2.7 V ~ 3.6 V
- Current - Quiescent (Iq): 190µA
- Input Capacitance: 4pF
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-TSSOP (0.173", 4.40mm Width)
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Package: 20-TSSOP (0.173", 4.40mm Width) |
Stock5,040 |
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NXP |
IC BUFFER/DVR 16BIT 3ST 60HUQFN
- Logic Type: Buffer, Non-Inverting
- Number of Elements: 4
- Number of Bits per Element: 4
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 32mA, 64mA
- Voltage - Supply: 2.7 V ~ 3.6 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 60-UFQFN Dual Rows, Exposed Pad
- Supplier Device Package: 60-HUQFN (4x6)
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Package: 60-UFQFN Dual Rows, Exposed Pad |
Stock4,160 |
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NXP |
IC VGA SWITCH 1OF2 DUAL 24HVQFN
- Type: VGA
- Applications: Notebook Computer
- Mounting Type: Surface Mount
- Package / Case: 24-VFQFN Exposed Pad
- Supplier Device Package: 24-HVQFN (4x4)
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Package: 24-VFQFN Exposed Pad |
Stock2,736 |
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NXP |
IC DUART 3.3V-5.0V 56-TSSOP
- Features: Configurable GPIO, Internal Oscillator, Timer/Counter
- Number of Channels: 1, UART
- FIFO's: 256 Byte
- Protocol: RS485
- Data Rate (Max): 3.125Mbps
- Voltage - Supply: 3.3V, 5V
- With Auto Flow Control: Yes
- With IrDA Encoder/Decoder: -
- With False Start Bit Detection: Yes
- With Modem Control: Yes
- Mounting Type: Surface Mount
- Package / Case: 56-TFSOP (0.240", 6.10mm Width)
- Supplier Device Package: 56-TSSOP
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Package: 56-TFSOP (0.240", 6.10mm Width) |
Stock3,920 |
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NXP |
IC MULTIPLE SWITCH DETECT 32SOIC
- Applications: -
- Interface: SPI
- Voltage - Supply: 5.5 V ~ 26 V
- Package / Case: 32-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 32-SOIC
- Mounting Type: Surface Mount
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Package: 32-SOIC (0.295", 7.50mm Width) |
Stock5,264 |
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NXP |
IC I2C 2:1 SELECTOR 16-TSSOP
- Applications: 2-Channel I2C Multiplexer
- Interface: I2C, SMBus
- Voltage - Supply: 2.3 V ~ 5.5 V
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
- Mounting Type: Surface Mount
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Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock13,284 |
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NXP |
IC MPU MPC85XX 667MHZ 783FCBGA
- Core Processor: PowerPC e500v2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 667MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 90°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock3,712 |
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NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Signal Processing; SPE
- RAM Controllers: DDR, DDR2, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock4,896 |
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NXP |
IC MPU MPC83XX 533MHZ 672TBGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 533MHz
- Co-Processors/DSP: Security; SEC
- RAM Controllers: DDR
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 672-LBGA
- Supplier Device Package: 672-TBGA (35x35)
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Package: 672-LBGA |
Stock6,636 |
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NXP |
IC MCU 8BIT 16KB FLASH 44TQFP
- Core Processor: 8051
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: 36
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 44-TQFP
- Supplier Device Package: 44-TQFP (10x10)
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Package: 44-TQFP |
Stock5,488 |
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NXP |
IC MCU 32BIT 1MB FLASH 208MAPBGA
- Core Processor: e200z0, e200z1
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz
- Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 144
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
- Data Converters: A/D 40x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 208-BGA
- Supplier Device Package: 208-MAPBGA (17x17)
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Package: 208-BGA |
Stock3,024 |
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NXP |
IC MCU 32BIT 1.5MB FLASH 144LQFP
- Core Processor: e200z3
- Core Size: 32-Bit
- Speed: 80MHz
- Connectivity: CAN, EBI/EMI, LIN, SCI, SPI, UART/USART
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 80
- Program Memory Size: 1.5MB (1.5M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 94K x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
- Data Converters: A/D 32x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock6,064 |
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NXP |
IC MCU 32BIT ROMLESS 208LQFP
- Core Processor: ARM7?
- Core Size: 16/32-Bit
- Speed: 72MHz
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
- Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O: 160
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 96K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 8x10b; D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 208-LQFP
- Supplier Device Package: 208-LQFP (28x28)
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Package: 208-LQFP |
Stock7,376 |
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NXP |
IC MCU 8BIT 8KB FLASH 20TSSOP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I2C, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 16
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 20-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 20-TSSOP
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Package: 20-TSSOP (0.173", 4.40mm Width) |
Stock17,172 |
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NXP |
IC RTC CLK/CALENDAR I2C 10-HVSON
- Type: Clock/Calendar
- Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
- Memory Size: -
- Time Format: HH:MM:SS (24 hr)
- Date Format: YY-MM-DD-dd
- Interface: I2C, 2-Wire Serial
- Voltage - Supply: 1.8 V ~ 5.5 V
- Voltage - Supply, Battery: -
- Current - Timekeeping (Max): 1.2µA ~ 5µA @ 2V ~ 5V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 10-VFDFN Exposed Pad
- Supplier Device Package: 10-HVSON (3x3)
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Package: 10-VFDFN Exposed Pad |
Stock2,336 |
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NXP |
IC RFID NFC 13.56MHZ 8XQFN
- Type: RFID Transponder
- Frequency: 13.56MHz
- Standards: ISO 14443
- Interface: I2C
- Voltage - Supply: 3.6V
- Operating Temperature: -40°C ~ 105°C
- Package / Case: 8-XFQFN Exposed Pad
- Supplier Device Package: 8-XQFN (1.6x1.6)
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Package: 8-XFQFN Exposed Pad |
Stock4,878 |
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NXP |
FS6500
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: -1.0 V ~ 40 V
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP Exposed Pad |
Stock4,240 |
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NXP |
POWER MANAGEMENT IC I.MX7 PRE-
- Applications: i.MX Processors
- Current - Supply: -
- Voltage - Supply: 2.8 V ~ 5.5 V
- Operating Temperature: -40°C ~ 105°C
- Mounting Type: Surface Mount
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN (7x7)
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Package: 48-VFQFN Exposed Pad |
Stock6,736 |
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NXP |
HIGH-SIDE SWITCH 12V PENTA 17M
- Switch Type: -
- Number of Outputs: -
- Ratio - Input:Output: -
- Output Configuration: -
- Output Type: -
- Interface: -
- Voltage - Load: -
- Voltage - Supply (Vcc/Vdd): -
- Current - Output (Max): -
- Rds On (Typ): -
- Input Type: -
- Features: -
- Fault Protection: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock2,608 |
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NXP |
S12Z CORE64K FLASHCAN64LQFP
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CANbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 31
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
- Data Converters: A/D 9x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP Exposed Pad
- Supplier Device Package: 64-LQFP-EP (10x10)
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Package: 64-LQFP Exposed Pad |
Stock7,776 |
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NXP |
SAFETY POWER MANAGEMENT IC, QFN5
- Applications: System Basis Chip
- Current - Supply: 15mA
- Voltage - Supply: 60V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-HVQFN (8x8)
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Package: - |
Request a Quote |
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NXP |
IC MPU QORIQ 800MHZ 448FBGA
- Core Processor: ARM® Cortex®-A72
- Number of Cores/Bus Width: 2 Core, 64-Bit
- Speed: 800MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: 1Gbps (1), 2.5Gbps (5)
- SATA: SATA 6Gbps (1)
- USB: -
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 448-BFBGA
- Supplier Device Package: 448-FBGA (17x17)
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Package: - |
Request a Quote |
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NXP |
IC MCU 16BIT 64KB FLASH 32LQFP
- Core Processor: S12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CANbus, IrDA, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 26
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: - |
Request a Quote |
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NXP |
RF MOSFET LDMOS 28V OM400-8
- Transistor Type: LDMOS (Dual)
- Frequency: 2.3GHz ~ 2.7GHz
- Gain: 28.8dB @ 2.59GHz
- Voltage - Test: 28 V
- Current Rating: 10µA
- Noise Figure: -
- Current - Test: 130 mA
- Power - Output: 5.6W
- Voltage - Rated: 65 V
- Package / Case: OM-400-8
- Supplier Device Package: OM-400-8
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Package: - |
Request a Quote |
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