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NXP |
FET RF 65V 3.5GHZ NI-400S-240
- Transistor Type: LDMOS
- Frequency: 3.1GHz ~ 3.5GHz
- Gain: 16dB
- Voltage - Test: 32V
- Current Rating: -
- Noise Figure: -
- Current - Test: 50mA
- Power - Output: 15W
- Voltage - Rated: 65V
- Package / Case: NI-400S-240
- Supplier Device Package: NI-400S-240
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Package: NI-400S-240 |
Stock7,680 |
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NXP |
IC REG BCK PROG 0.5A SYNC 6WLCSP
- Function: Step-Down
- Output Configuration: Positive
- Topology: Buck
- Output Type: Programmable
- Number of Outputs: 1
- Voltage - Input (Min): 2.3V
- Voltage - Input (Max): 5.5V
- Voltage - Output (Min/Fixed): 1.2V, 1.8V
- Voltage - Output (Max): -
- Current - Output: 500mA
- Frequency - Switching: 6MHz
- Synchronous Rectifier: Yes
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 6-XFBGA, WLCSP
- Supplier Device Package: 6-WLCSP (1.36x0.96)
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Package: 6-XFBGA, WLCSP |
Stock4,656 |
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NXP |
IC BUS I2C 8HWSON
- Function: -
- Sensor Type: -
- Sensing Temperature: -
- Accuracy: -
- Topology: -
- Output Type: -
- Output Alarm: -
- Output Fan: -
- Voltage - Supply: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock2,848 |
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NXP |
TOPFET LOGIC LVL 50V D2PAK
- Switch Type: General Purpose
- Number of Outputs: 1
- Ratio - Input:Output: 1:1
- Output Configuration: Low Side
- Output Type: N-Channel
- Interface: On/Off
- Voltage - Load: 50V (Max)
- Voltage - Supply (Vcc/Vdd): 5V
- Current - Output (Max): 50A
- Rds On (Typ): 22 mOhm
- Input Type: Non-Inverting
- Features: Status Flag
- Fault Protection: Over Temperature, Over Voltage
- Operating Temperature: 150°C (TJ)
- Package / Case: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB
- Supplier Device Package: SOT-426
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Package: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB |
Stock4,288 |
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NXP |
TOPFET LOGIC LVL 50V TO220AB
- Switch Type: General Purpose
- Number of Outputs: 1
- Ratio - Input:Output: 1:1
- Output Configuration: Low Side
- Output Type: N-Channel
- Interface: On/Off
- Voltage - Load: 50V (Max)
- Voltage - Supply (Vcc/Vdd): Not Required
- Current - Output (Max): 26A
- Rds On (Typ): 45 mOhm
- Input Type: Non-Inverting
- Features: -
- Fault Protection: Over Temperature, Over Voltage
- Operating Temperature: 150°C (TJ)
- Package / Case: TO-220-3
- Supplier Device Package: TO-220AB
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Package: TO-220-3 |
Stock5,904 |
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NXP |
IC BUS SWITCH 20BIT 48TSSOP
- Type: Bus Switch
- Circuit: 10 x 1:1
- Independent Circuits: 2
- Current - Output High, Low: -
- Voltage Supply Source: Single Supply
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 48-TFSOP (0.240", 6.10mm Width)
- Supplier Device Package: 48-TSSOP
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Package: 48-TFSOP (0.240", 6.10mm Width) |
Stock6,576 |
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NXP |
IC BUFF INVERT 5.5V 20SSOP
- Logic Type: Buffer, Inverting
- Number of Elements: 2
- Number of Bits per Element: 4
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 32mA, 64mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-SSOP (0.209", 5.30mm Width)
- Supplier Device Package: 20-SSOP
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Package: 20-SSOP (0.209", 5.30mm Width) |
Stock4,544 |
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NXP |
IC AMP AUD CLASS D 2X15W 32SO
- Type: Class D
- Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
- Max Output Power x Channels @ Load: 55W x 1 @ 8 Ohm; 26.5W x 2 @ 4 Ohm
- Voltage - Supply: 10 V ~ 36 V, ±5 V ~ 18 V
- Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Supplier Device Package: 32-SO
- Package / Case: 32-SOIC (0.295", 7.50mm Width)
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Package: 32-SOIC (0.295", 7.50mm Width) |
Stock7,572 |
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NXP |
IC MPU MPC8XX 50MHZ 256BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 50MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (1)
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 256-BGA
- Supplier Device Package: 256-PBGA (23x23)
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Package: 256-BGA |
Stock24,768 |
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NXP |
IC MPU MPC8XX 75MHZ 256BGA
- Core Processor: PowerPC
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 75MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: LCD, Video
- Ethernet: 10 Mbps (1)
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 256-BBGA
- Supplier Device Package: 256-PBGA (23x23)
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Package: 256-BBGA |
Stock3,184 |
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NXP |
IC MPU I.MX6Q 852MHZ 624FCBGA
- Core Processor: ARM? Cortex?-A9
- Number of Cores/Bus Width: 4 Core, 32-Bit
- Speed: 852MHZ
- Co-Processors/DSP: Multimedia; NEON? SIMD
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100/1000 Mbps (1)
- SATA: SATA 3Gbps (1)
- USB: USB 2.0 + PHY (4)
- Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature: -40°C ~ 125°C (TJ)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 624-FBGA, FCBGA
- Supplier Device Package: 624-FCBGA (21x21)
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Package: 624-FBGA, FCBGA |
Stock7,088 |
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NXP |
IC MPU I.MX28 454MHZ 289MAPBGA
- Core Processor: ARM926EJ-S
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 454MHz
- Co-Processors/DSP: Data; DCP
- RAM Controllers: LVDDR, LVDDR2, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: Keypad
- Ethernet: 10/100 Mbps (1)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: 1.8V, 3.3V
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: Boot Security, Cryptography, Hardware ID
- Package / Case: 289-LFBGA
- Supplier Device Package: 289-MAPBGA (14x14)
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Package: 289-LFBGA |
Stock2,928 |
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NXP |
IC MCU 16BIT 32KB FLASH 44LQFP
- Core Processor: 56800E
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: I2C, LIN, SCI, SPI
- Peripherals: POR, PWM, WDT
- Number of I/O: 35
- Program Memory Size: 32KB (16K x 16)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2K x 16
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 8x12b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 44-LQFP
- Supplier Device Package: 44-LQFP (10x10)
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Package: 44-LQFP |
Stock7,744 |
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NXP |
IC MCU 8BIT 60KB FLASH 64QFP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: SCI, SPI
- Peripherals: LVD, POR, PWM
- Number of I/O: 53
- Program Memory Size: 60KB (60K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 24x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-QFP
- Supplier Device Package: 64-QFP (14x14)
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Package: 64-QFP |
Stock5,248 |
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NXP |
IC MCU 8BIT 16KB FLASH 32LQFP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: LIN, SCI, SPI
- Peripherals: POR, PWM
- Number of I/O: 24
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock15,240 |
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NXP |
IC MCU 32BIT 32KB FLASH 33HVQFN
- Core Processor: ARM? Cortex?-M0
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, WDT
- Number of I/O: 28
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 32-VQFN Exposed Pad
- Supplier Device Package: 32-HVQFN (7x7)
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Package: 32-VQFN Exposed Pad |
Stock15,120 |
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NXP |
IC PROCESSOR 1-CORE 783FCBGA
- Type: SC3850 Single Core
- Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
- Clock Rate: 1GHz
- Non-Volatile Memory: ROM (96 kB)
- On-Chip RAM: 576kB
- Voltage - I/O: 2.50V
- Voltage - Core: 1.00V
- Operating Temperature: 0°C ~ 105°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock5,264 |
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NXP |
ACCELEROMETER 10G ANALOG 16SOIC
- Type: Analog
- Axis: X
- Acceleration Range: ±10g
- Sensitivity (LSB/g): -
- Sensitivity (mV/g): 200
- Bandwidth: 400Hz
- Output Type: Analog Voltage
- Voltage - Supply: 4.75 V ~ 5.25 V
- Features: -
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 16-SOIC
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Package: 16-SOIC (0.295", 7.50mm Width) |
Stock7,128 |
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NXP |
MOD ATOP AUTO TELEMATIC
- Function: -
- Frequency: -
- RF Type: -
- Secondary Attributes: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock4,158 |
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NXP |
IC MPU I.MX6DP ENHAN 624FCBGA
- Core Processor: ARM® Cortex®-A9
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: LPDDR2, DDR3L, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
- Ethernet: 10/100/1000 Mbps (1)
- SATA: SATA 3Gbps (1)
- USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
- Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature: -40°C ~ 125°C (TJ)
- Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
- Package / Case: 624-FBGA, FCBGA
- Supplier Device Package: 624-FCBGA (21x21)
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Package: 624-FBGA, FCBGA |
Stock4,912 |
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NXP |
LS1012A XT 600MHZ RV2
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock7,440 |
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NXP |
MAGNIV 16-BIT MCU S12Z CORE 32
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: I²C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 19
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 128 x 8
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V
- Data Converters: A/D 6x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-QFN-EP (5x5)
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Package: 32-VFQFN Exposed Pad |
Stock11,616 |
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NXP |
16-BIT MCU S12 CORE 128KB FLAS
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: CANbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 49
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 6K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 10x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock3,056 |
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NXP |
CAR DSP
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
TEA1721A3T/N1/S1J
- Applications: -
- Voltage - Input: -
- Voltage - Supply: -
- Current - Supply: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
IC MCU 32BIT 3MB FLASH 252MAPBGA
- Core Processor: e200z424
- Core Size: 32-Bit Tri-Core
- Speed: 200MHz
- Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI, UART/USART
- Peripherals: DMA, LVD, POR, Zipwire
- Number of I/O: -
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 256K x 8
- Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 252-LFBGA
- Supplier Device Package: 252-MAPBGA (17x17)
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Package: - |
Request a Quote |
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NXP |
SAFETY POWER MANAGEMENT IC, QFN4
- Applications: System Basis Chip
- Current - Supply: 15mA
- Voltage - Supply: 60V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-HVQFN (7x7)
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Package: - |
Request a Quote |
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NXP |
S32K324 ARM CORTEX-M7, 160 MHZ,
- Core Processor: ARM® Cortex®-M7
- Core Size: 32-Bit Dual-Core
- Speed: 160MHz
- Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
- Peripherals: DMA, I2S, Serial Audio, WDT
- Number of I/O: 218
- Program Memory Size: 4MB (4M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
- Data Converters: A/D 24x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C
- Mounting Type: Surface Mount
- Package / Case: 257-LFBGA
- Supplier Device Package: 257-LFBGA (14x14)
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Package: - |
Request a Quote |
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