Page 702 - NXP Products | Heisener Electronics

MRF21045LR3
NXP

FET RF 65V 2.17GHZ NI-400

Package: NI-400

Stock2,144
SSTV16857DGG,512
NXP

IC REG DRIVER 14BIT 48TSSOP

Package: 48-TFSOP (0.240", 6.10mm Width)

Stock2,736
74LVT162245BDGG:51
NXP

IC TRANSCVR TRI-ST 16BIT 48TSSOP

Package: 48-TFSOP (0.240", 6.10mm Width)

Stock6,464
NX3L2267GM,132
NXP

IC ANALOG SWITCH SPDT 10XQFN

Package: 10-XFQFN

Stock6,048
MPC8347CZUAJFB
NXP

IC MPU MPC83XX 533MHZ 672TBGA

Package: 672-LBGA

Stock5,040
MPC859DSLCVR66A
NXP

IC MPU MPC8XX 66MHZ 357BGA

Package: 357-BBGA

Stock2,240
MPC860ENZQ50D4
NXP

IC MPU MPC8XX 50MHZ 357BGA

Package: 357-BBGA

Stock7,520
P89LPC915FN,112
NXP

IC MCU 8BIT 2KB FLASH 14DIP

Package: 14-DIP (0.300", 7.62mm)

Stock7,408
S9S12G128F0VLL
NXP

IC MCU 16BIT 128KB FLASH 100LQFP

Package: 100-LQFP

Stock7,152
MSC8256TVT800B
NXP

IC PROCESSOR 6-CORE 783FCBGA

Package: 783-BBGA, FCBGA

Stock4,800
FSA95601AHR2
NXP

IC AMP 6CH CLASS D DGTL

Package: -

Stock4,800
X3G-OH047,005
NXP

IC MAGN FIELD SENSOR DBL DIE

Package: -

Stock7,038
MMA2702WR2
NXP

ACCELEROMETER 25G PCM/SPI 16QFN

Package: 16-QFN Exposed Pad

Stock6,102
MMA5148KW
NXP

ACCELEROMETER 480G PCM/SPI 16QFN

Package: 16-QFN Exposed Pad

Stock4,122
MF3D2201DUF/00V
NXP

MIFARE DESFIRE EV2

Package: Die

Stock2,052
MF1PLUS8031DUD/03,
NXP

IC SMART CARD 4KB FFC UNCASED

Package: -

Stock7,236
MKW41Z512VHT4
NXP

KINETIS L 32-BIT MCU ARM CORTEX-

Package: 48-VFQFN

Stock7,260
13192RFC-A00
NXP

BOARD DAUGHTER FOR MC13192

Package: -

Stock2,862
MBC13916T1
NXP

IC RF CASCODE AMP SOT-343R

Package: SC-82A, SOT-343

Stock11,364
MC35FS6503CAE
NXP

FS6500

Package: 48-LQFP Exposed Pad

Stock6,768

Part Number	Manufacturer	Description	Package	Stock
MRF21045LR3	NXP	FET RF 65V 2.17GHZ NI-400 Transistor Type: LDMOS Frequency: 2.17GHz Gain: 15dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 500mA Power - Output: 10W Voltage - Rated: 65V Package / Case: NI-400 Supplier Device Package: NI-400-240	Package: NI-400	Stock2,144
SSTV16857DGG,512	NXP	IC REG DRIVER 14BIT 48TSSOP Logic Type: Registered Buffer with SSTL_2 Compatible I/O for DDR Supply Voltage: 2.3 V ~ 2.7 V Number of Bits: 14 Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 48-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 48-TSSOP	Package: 48-TFSOP (0.240", 6.10mm Width)	Stock2,736
74LVT162245BDGG:51	NXP	IC TRANSCVR TRI-ST 16BIT 48TSSOP Logic Type: Transceiver, Non-Inverting Number of Elements: 2 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 12mA, 12mA Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 48-TSSOP	Package: 48-TFSOP (0.240", 6.10mm Width)	Stock6,464
NX3L2267GM,132	NXP	IC ANALOG SWITCH SPDT 10XQFN Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Number of Circuits: 2 On-State Resistance (Max): 750 mOhm Channel-to-Channel Matching (ΔRon): 90 mOhm Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V Voltage - Supply, Dual (V±): - Switch Time (Ton, Toff) (Max): 40ns, 20ns -3db Bandwidth: 60MHz Charge Injection: 37pC Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Crosstalk: -90dB @ 100kHz Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 10-XFQFN Supplier Device Package: 10-XQFN (1.55x2)	Package: 10-XFQFN	Stock6,048
MPC8347CZUAJFB	NXP	IC MPU MPC83XX 533MHZ 672TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: - RAM Controllers: DDR Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 672-LBGA Supplier Device Package: 672-TBGA (35x35)	Package: 672-LBGA	Stock5,040
MPC859DSLCVR66A	NXP	IC MPU MPC8XX 66MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 100°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	Package: 357-BBGA	Stock2,240
MPC860ENZQ50D4	NXP	IC MPU MPC8XX 50MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (4) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	Package: 357-BBGA	Stock7,520
P89LPC915FN,112	NXP	IC MCU 8BIT 2KB FLASH 14DIP Core Processor: 8051 Core Size: 8-Bit Speed: 18MHz Connectivity: I2C, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 2KB (2K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 4x8b; D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 14-DIP (0.300", 7.62mm) Supplier Device Package: 14-DIP	Package: 14-DIP (0.300", 7.62mm)	Stock7,408
S9S12G128F0VLL	NXP	IC MCU 16BIT 128KB FLASH 100LQFP Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 86 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock7,152
MSC8256TVT800B	NXP	IC PROCESSOR 6-CORE 783FCBGA Type: SC3850 Six Core Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Clock Rate: 800MHz Non-Volatile Memory: ROM (96 kB) On-Chip RAM: 576kB Voltage - I/O: 2.50V Voltage - Core: 1.00V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock4,800
FSA95601AHR2	NXP	IC AMP 6CH CLASS D DGTL Function: - Applications: - Number of Channels: - Interface: - Voltage - Supply: - Operating Temperature: - Specifications: - Package / Case: - Supplier Device Package: -	Package: -	Stock4,800
X3G-OH047,005	NXP	IC MAGN FIELD SENSOR DBL DIE For Measuring: Angle Technology: Magnetoresistive Rotation Angle - Electrical, Mechanical: - Linear Range: - Output: Wheatstone Bridge Output Signal: - Actuator Type: External Magnet Not Included Linearity: - Resistance: 3.7 kOhms Resistance Tolerance: - Voltage - Supply: 5 V ~ 9 V Mounting Type: Bare Die Termination Style: - Operating Temperature: -40°C ~ 150°C	Package: -	Stock7,038
MMA2702WR2	NXP	ACCELEROMETER 25G PCM/SPI 16QFN Type: Digital Axis: X Acceleration Range: ±25g Sensitivity (LSB/g): 20.48 Sensitivity (mV/g): - Bandwidth: - Output Type: PCM, SPI Voltage - Supply: 4 V ~ 20 V Features: Selectable Low Pass Filter Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN-EP (6x6)	Package: 16-QFN Exposed Pad	Stock6,102
MMA5148KW	NXP	ACCELEROMETER 480G PCM/SPI 16QFN Type: Digital Axis: Z Acceleration Range: ±480g Sensitivity (LSB/g): 1 Sensitivity (mV/g): - Bandwidth: - Output Type: PCM, SPI Voltage - Supply: 4.2 V ~ 17 V Features: Selectable Low Pass Filter Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN (6x6)	Package: 16-QFN Exposed Pad	Stock4,122
MF3D2201DUF/00V	NXP	MIFARE DESFIRE EV2 Type: RFID Transponder Frequency: 13.56MHz Standards: ISO 14443 Interface: - Voltage - Supply: - Operating Temperature: -25°C ~ 70°C Package / Case: Die Supplier Device Package: Die	Package: Die	Stock2,052
MF1PLUS8031DUD/03,	NXP	IC SMART CARD 4KB FFC UNCASED Type: - Frequency: - Standards: - Interface: - Voltage - Supply: - Operating Temperature: - Package / Case: - Supplier Device Package: -	Package: -	Stock7,236
MKW41Z512VHT4	NXP	KINETIS L 32-BIT MCU ARM CORTEX- Type: TxRx + MCU RF Family/Standard: Bluetooth Protocol: Bluetooth v4.2 Modulation: - Frequency: 2.4GHz Data Rate (Max): - Power - Output: 4dBm Sensitivity: -102dBm Memory Size: 512kB Flash, 128kB RAM Serial Interfaces: I2C, SPI, UART GPIO: - Voltage - Supply: 1.71 V ~ 3.6 V Current - Receiving: 6.2mA Current - Transmitting: 6mA Operating Temperature: - Package / Case: 48-VFQFN	Package: 48-VFQFN	Stock7,260
13192RFC-A00	NXP	BOARD DAUGHTER FOR MC13192 Type: 802.15.4/Zigbee Frequency: 2.4GHz For Use With/Related Products: MC13192 Supplied Contents: Board	Package: -	Stock2,862
MBC13916T1	NXP	IC RF CASCODE AMP SOT-343R Frequency: 100MHz ~ 2.5GHz P1dB: 2.5dBm (1.8mW) Gain: 19dB Noise Figure: - RF Type: - Voltage - Supply: 2.7 V ~ 5 V Current - Supply: 4.7mA Test Frequency: 900MHz Package / Case: SC-82A, SOT-343 Supplier Device Package: SOT-343R	Package: SC-82A, SOT-343	Stock11,364
MC35FS6503CAE	NXP	FS6500 Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP Exposed Pad	Stock6,768
SPC5674FAMVY3	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z7 Core Size: 32-Bit Speed: 264MHz Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Number of I/O: 32 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V Data Converters: A/D 64x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	Package: 516-BBGA	Stock6,544
SP5748GSK0AMMJ6R	NXP	TRIPLE CORE 6M FLASH 768K RAM Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPPBGA (17x17)	Package: 256-LBGA	Stock2,096
S912XEG384BMAL	NXP	16-BIT MCU S12X CORE 384KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	Package: 112-LQFP	Stock3,088
MKL27Z64VDA4R	NXP	KINETIS L 32-BIT MCU ARM CORTEX Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I²C, FlexIO, SPI, UART/USART, USB Peripherals: DMA, I²S, PWM, WDT Number of I/O: 30 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 14x16b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 36-XFBGA Supplier Device Package: 36-XFBGA (3.5x3.5)	Package: 36-XFBGA	Stock6,416
TJA1051TK-3-2Z	NXP	IC TRANSCEIVER HALF 1/1 8HVSON Type: Transceiver Protocol: CANbus Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 120 mV Data Rate: 5Mbps Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Supplier Device Package: 8-HVSON (3x3)	Package: -	Request a Quote
PMEG3010BEA-ZLF	NXP	DIODE SCHOTTKY SOD323 Diode Type: - Voltage - DC Reverse (Vr) (Max): - Current - Average Rectified (Io): - Voltage - Forward (Vf) (Max) @ If: - Speed: - Reverse Recovery Time (trr): - Current - Reverse Leakage @ Vr: - Capacitance @ Vr, F: - Mounting Type: - Package / Case: - Supplier Device Package: - Operating Temperature - Junction: -	Package: -	Request a Quote
FC32K142HFT0MLLT	NXP	S32K142 32-BIT MCU, ARM CORTEX-M Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
MC34PF1550A8EP	NXP	POWER MANAGEMENT IC 3 BUCK REGS Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Current - Supply: - Voltage - Supply: 4.1V ~ 6V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (5x5)	Package: -	Request a Quote