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BUK7609-55A,118
NXP

MOSFET N-CH 55V 75A D2PAK

Package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

Stock5,840
AFT20P140-4WGNR3
NXP

FET RF 2CH 65V 1.91GHZ OM780-4GW

Package: OM-780G-4L

Stock4,256
BAP64-06,215
NXP

DIODE PIN 175V 100MA SOT-23

Package: TO-236-3, SC-59, SOT-23-3

Stock6,624
LD6806CX4/33P,315
NXP

IC REG LINEAR 3.3V 200MA 4WLCSP

Package: 4-XFBGA, WLCSP

Stock4,816
NX1117C285Z,115
NXP

IC REG LINEAR 2.85V 1A SOT223

Package: TO-261-4, TO-261AA

Stock5,168
PIP3119-P,127
NXP

TOPFET LOGIC LVL 50V TO220AB

Package: TO-220-3

Stock5,904
HEF4093BP,652
NXP

IC GATE NAND 4CH 2-INP 14-DIP

Package: 14-DIP (0.300", 7.62mm)

Stock7,280
UDA1338H/N1,518
NXP

IC AUDIO CODER/DECODER 44QFP

Package: 44-QFP

Stock6,704
MPC8547EPXATGB
NXP

IC MPU MPC85XX 1.2GHZ 783FCBGA

Package: 783-BBGA, FCBGA

Stock7,840
MPC862TZQ66B
NXP

IC MPU MPC8XX 66MHZ 357BGA

Package: 357-BBGA

Stock6,992
MPC8271ZQPIEA
NXP

IC MPU MPC82XX 300MHZ 516BGA

Package: 516-BBGA

Stock5,328
MCIMX6QP7CVT8AA
NXP

IC MPU I.MX6QP 800MHZ 624FCBGA

Package: 624-FBGA, FCBGA

Stock6,144
MC56F82748MLH
NXP

IC MCU 32BIT 64KB FLASH 64LQFP

Package: 64-LQFP

Stock4,304
P80C554SBBD,157
NXP

IC MCU 8BIT ROMLESS 64LQFP

Package: 64-LQFP

Stock4,816
MC9S12XD256CAL
NXP

IC MCU 16BIT 256KB FLASH 112LQFP

Package: 112-LQFP

Stock8,568
SL3S1013FTB0,115
NXP

IC UCODE G2IM TRANSPONDER 6XSON

Package: -

Stock41,124
MMG1001NT1
NXP

IC CATV AMP MOD 132CHAN 16-PFP

Package: 16-SOP (0.276", 7.00mm Width)

Stock8,442
SPC5646CCK0VMJ1R
NXP

NXP 32-BIT MCU DUAL POWER ARCH

Package: 256-LBGA

Stock4,688
SPC5645CF0VLT1R
NXP

2M FLASH,256K RAM,120MHZ

Package: 208-LQFP

Stock3,952
S912XEG128J1MAA
NXP

16-BIT MCU S12X CORE 128KB FLA

Package: 80-QFP

Stock7,620

Part Number	Manufacturer	Description	Package	Stock
BUK7609-55A,118	NXP	MOSFET N-CH 55V 75A D2PAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 55V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 62nC @ 0V Input Capacitance (Ciss) (Max) @ Vds: 3271pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 211W (Tc) Rds On (Max) @ Id, Vgs: 9 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Supplier Device Package: D2PAK Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	Package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	Stock5,840
AFT20P140-4WGNR3	NXP	FET RF 2CH 65V 1.91GHZ OM780-4GW Transistor Type: LDMOS (Dual) Frequency: 1.88GHz ~ 1.91GHz Gain: 17.8dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 500mA Power - Output: 24W Voltage - Rated: 65V Package / Case: OM-780G-4L Supplier Device Package: OM-780G-4L	Package: OM-780G-4L	Stock4,256
BAP64-06,215	NXP	DIODE PIN 175V 100MA SOT-23 Diode Type: PIN - 1 Pair Common Anode Voltage - Peak Reverse (Max): 175V Current - Max: 100mA Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz Resistance @ If, F: 1.35 Ohm @ 100mA, 100MHz Power Dissipation (Max): 250mW Operating Temperature: -65°C ~ 150°C (TJ) Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	Package: TO-236-3, SC-59, SOT-23-3	Stock6,624
LD6806CX4/33P,315	NXP	IC REG LINEAR 3.3V 200MA 4WLCSP Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 3.3V Voltage - Output (Max): - Voltage Dropout (Max): 0.1V @ 200mA Current - Output: 200mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 4-XFBGA, WLCSP Supplier Device Package: 4-WLCSP (0.76x0.76)	Package: 4-XFBGA, WLCSP	Stock4,816
NX1117C285Z,115	NXP	IC REG LINEAR 2.85V 1A SOT223 Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 20V Voltage - Output (Min/Fixed): 2.85V Voltage - Output (Max): - Voltage Dropout (Max): 1.2V @ 800mA Current - Output: 1A Current - Quiescent (Iq): - Current - Supply (Max): 6mA PSRR: 63dB (120Hz) Control Features: - Protection Features: Over Current, Over Temperature Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: TO-261-4, TO-261AA Supplier Device Package: SOT-223	Package: TO-261-4, TO-261AA	Stock5,168
PIP3119-P,127	NXP	TOPFET LOGIC LVL 50V TO220AB Switch Type: General Purpose Number of Outputs: 1 Ratio - Input:Output: 1:1 Output Configuration: Low Side Output Type: N-Channel Interface: On/Off Voltage - Load: 50V (Max) Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 20A Rds On (Typ): 22 mOhm Input Type: Non-Inverting Features: - Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage Operating Temperature: - Package / Case: TO-220-3 Supplier Device Package: TO-220AB	Package: TO-220-3	Stock5,904
HEF4093BP,652	NXP	IC GATE NAND 4CH 2-INP 14-DIP Logic Type: NAND Gate Number of Circuits: 4 Number of Inputs: 2 Features: Schmitt Trigger Voltage - Supply: 3 V ~ 15 V Current - Quiescent (Max): 1µA Current - Output High, Low: 3.4mA, 3.4mA Logic Level - Low: 1.5 V ~ 4 V Logic Level - High: 3.5 V ~ 11 V Max Propagation Delay @ V, Max CL: 60ns @ 15V, 50pF Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Supplier Device Package: 14-DIP Package / Case: 14-DIP (0.300", 7.62mm)	Package: 14-DIP (0.300", 7.62mm)	Stock7,280
UDA1338H/N1,518	NXP	IC AUDIO CODER/DECODER 44QFP Type: Stereo Audio Data Interface: Serial Resolution (Bits): 24 b Number of ADCs / DACs: 5 / 6 Sigma Delta: No S/N Ratio, ADCs / DACs (db) Typ: 100 / 114 Dynamic Range, ADCs / DACs (db) Typ: - Voltage - Supply, Analog: 2.7 V ~ 3.6 V Voltage - Supply, Digital: 2.7 V ~ 3.6 V Operating Temperature: -20°C ~ 85°C Mounting Type: Surface Mount Package / Case: 44-QFP Supplier Device Package: 44-PQFP (10x10)	Package: 44-QFP	Stock6,704
MPC8547EPXATGB	NXP	IC MPU MPC85XX 1.2GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock7,840
MPC862TZQ66B	NXP	IC MPU MPC8XX 66MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (4), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	Package: 357-BBGA	Stock6,992
MPC8271ZQPIEA	NXP	IC MPU MPC82XX 300MHZ 516BGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	Package: 516-BBGA	Stock5,328
MCIMX6QP7CVT8AA	NXP	IC MPU I.MX6QP 800MHZ 624FCBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	Package: 624-FBGA, FCBGA	Stock6,144
MC56F82748MLH	NXP	IC MCU 32BIT 64KB FLASH 64LQFP Core Processor: 56800EX Core Size: 32-Bit Speed: 100MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V Data Converters: A/D 16x12b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP	Stock4,304
P80C554SBBD,157	NXP	IC MCU 8BIT ROMLESS 64LQFP Core Processor: 8051 Core Size: 8-Bit Speed: 16MHz Connectivity: EBI/EMI, I2C, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 40 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 7x10b Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP	Stock4,816
MC9S12XD256CAL	NXP	IC MCU 16BIT 256KB FLASH 112LQFP Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 14K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	Package: 112-LQFP	Stock8,568
SL3S1013FTB0,115	NXP	IC UCODE G2IM TRANSPONDER 6XSON Style: Inlay Technology: Passive Frequency: 840MHz ~ 960MHz Memory Type: Read/Write Writable Memory: 256b (EPC) Standards: EPC Operating Temperature: -40°C ~ 85°C Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)	Package: -	Stock41,124
MMG1001NT1	NXP	IC CATV AMP MOD 132CHAN 16-PFP Frequency: 40MHz ~ 870MHz P1dB: - Gain: 19dB Noise Figure: - RF Type: CATV Voltage - Supply: 12V or 24V Current - Supply: 250mA or 210mA Test Frequency: - Package / Case: 16-SOP (0.276", 7.00mm Width) Supplier Device Package: 16-PFP	Package: 16-SOP (0.276", 7.00mm Width)	Stock8,442
SPC5646CCK0VMJ1R	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Speed: 80MHz/120MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 199 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 33x10b, 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA	Package: 256-LBGA	Stock4,688
SPC5645CF0VLT1R	NXP	2M FLASH,256K RAM,120MHZ Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Speed: 80MHz/120MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 177 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 33x10b, 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 208-LQFP Supplier Device Package: 208-TQFP (28x28)	Package: 208-LQFP	Stock3,952
S912XEG128J1MAA	NXP	16-BIT MCU S12X CORE 128KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	Package: 80-QFP	Stock7,620
FS32K144MFT0CLLT	NXP	S32K144 32-BIT MCU, ARM Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock5,744
MKL27Z128VFM4R	NXP	KINETIS L 32-BIT MCU ARM CORTEX Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I²C, SPI, UART/USART, USB Peripherals: DMA, I²S, LVD, POR, PWM, WDT Number of I/O: 23 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 16x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-UFQFN Exposed Pad Supplier Device Package: 32-QFN (5x5)	Package: 32-UFQFN Exposed Pad	Stock6,800
MFS8622BMDA0ESR2	NXP	SAFETY SYSTEM BASIS CHIP FOR DOM Applications: Camera Current - Supply: - Voltage - Supply: 36V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	Package: -	Request a Quote
SPC5607BAMLQ6	NXP	IC MCU 32BIT 1.5MB FLASH 144LQFP Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 149 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 34x10b, 24x12b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	Package: -	Request a Quote
SAF4000EL-101S23EK	NXP	SOFTWARE DEFINED RADIO Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
MC33FS8430G2ES	NXP	SYSTEM BASIS CHIP FS8430 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
MFS8601BMDA0ES	NXP	IC FS86 SYSTEM BASIS CHIP ASIL Applications: Camera Current - Supply: - Voltage - Supply: 4.5V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	Package: -	Request a Quote
FS32V234CTN1VUB	NXP	IC MPU FS32V23 1GHZ 621FCPBGA Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE SATA: - USB: - Voltage - I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17x17)	Package: -	Request a Quote