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MPS3906,126
NXP

TRANS PNP 40V 0.1A TO92

Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

Stock3,536
LD6805K/25H,115
NXP

IC REG LIN 2.5V 150MA DFN1010C-4

Package: 4-UDFN Exposed Pad

Stock7,520
TEA1610P/N5,112
NXP

IC RESONANT CONVERTR CTRLR 16DIP

Package: 16-DIP (0.300", 7.62mm)

Stock2,096
HEF4021BP,652
NXP

IC REGISTER STATIC 8BIT 16-DIP

Package: 16-DIP (0.300", 7.62mm)

Stock4,576
74ALVT16245DL,112
NXP

IC 16BIT TXRX 3-ST 48-SSOP

Package: 48-BSSOP (0.295", 7.50mm Width)

Stock7,728
CGD1042HI,112
NXP

IC PWR DOUBLER 1GHZ 22DB SOT115

Package: SOT-115J

Stock7,984
MPC8572EPXAVNB
NXP

IC MPU MPC85XX 1.5GHZ 1023FCBGA

Package: 1023-BFBGA, FCBGA

Stock3,728
KMPC8555VTALF
NXP

IC MPU MPC85XX 667MHZ 783FCBGA

Package: 783-BBGA, FCBGA

Stock6,512
MC7448VU1000ND
NXP

IC MPU MPC74XX 1.0GHZ 360FCCBGA

Package: 360-CBGA, FCCBGA

Stock4,160
P89LPC982FDH,529
NXP

IC MCU 8BIT 8KB FLASH 28TSSOP

Package: 28-TSSOP (0.173", 4.40mm Width)

Stock4,240
MC9S12C32MPBE16
NXP

IC MCU 16BIT 32KB FLASH 52LQFP

Package: 52-LQFP

Stock6,032
MC68HC908QY2CPE
NXP

IC MCU 8BIT 1.5KB FLASH 16DIP

Package: 16-DIP (0.300", 7.62mm)

Stock5,920
LPC1823JBD144E
NXP

IC MCU 32BIT 512KB FLASH 144LQFP

Package: 144-LQFP

Stock5,280
MC9S08DZ128CLL
NXP

IC MCU 8BIT 128KB FLASH 100LQFP

Package: 100-LQFP

Stock6,880
S9S12G96F0CLH
NXP

IC MCU 16BIT 96KB FLASH 64LQFP

Package: 64-LQFP

Stock4,448
MKE06Z128VLD4
NXP

IC MCU 32BIT 128KB FLASH 44QFP

Package: 44-LQFP

Stock17,616
ADC1012D105HN/C1:5
NXP

IC ADC 105MHZ SOT804-3

Package: -

Stock4,752
KTY81/210,116
NXP

IC TEMPERATURE SENSOR SOD-70

Package: TO-226-2, TO-92-2 (TO-226AC) (Formed Leads)

Stock2,790
NCF29A1VHN/0500IJ
NXP

IC REMOTE KEYLESS ENTRY 32HVQFN

Package: -

Stock7,956
BGU8051,118
NXP

IC AMP LNA 5V 900MHZ 8HWSON

Package: 8-WFDFN Exposed Pad

Stock6,066

Part Number	Manufacturer	Description	Package	Stock
MPS3906,126	NXP	TRANS PNP 40V 0.1A TO92 Transistor Type: PNP Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 40V Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 50mA Current - Collector Cutoff (Max): 50nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V Power - Max: 500mW Frequency - Transition: 150MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	Stock3,536
LD6805K/25H,115	NXP	IC REG LIN 2.5V 150MA DFN1010C-4 Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 2.5V Voltage - Output (Max): - Voltage Dropout (Max): 0.25V @ 150mA Current - Output: 150mA Current - Quiescent (Iq): - Current - Supply (Max): 35µA ~ 150µA PSRR: 75dB (1kHz) Control Features: Enable Protection Features: Over Current, Transient Voltage Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 4-UDFN Exposed Pad Supplier Device Package: DFN1010C-4	Package: 4-UDFN Exposed Pad	Stock7,520
TEA1610P/N5,112	NXP	IC RESONANT CONVERTR CTRLR 16DIP Applications: Resonant Converter Controller Voltage - Input: - Voltage - Supply: 0 V ~ 15 V Current - Supply: 2.4mA Operating Temperature: -25°C ~ 70°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	Package: 16-DIP (0.300", 7.62mm)	Stock2,096
HEF4021BP,652	NXP	IC REGISTER STATIC 8BIT 16-DIP Logic Type: Shift Register Output Type: Push-Pull Number of Elements: 1 Number of Bits per Element: 8 Function: Parallel or Serial to Serial Voltage - Supply: 3 V ~ 15 V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	Package: 16-DIP (0.300", 7.62mm)	Stock4,576
74ALVT16245DL,112	NXP	IC 16BIT TXRX 3-ST 48-SSOP Logic Type: Transceiver, Non-Inverting Number of Elements: 2 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 48-SSOP	Package: 48-BSSOP (0.295", 7.50mm Width)	Stock7,728
CGD1042HI,112	NXP	IC PWR DOUBLER 1GHZ 22DB SOT115 Applications: CATV Output Type: - Number of Circuits: 1 -3db Bandwidth: - Slew Rate: - Current - Supply: 440mA Current - Output / Channel: - Voltage - Supply, Single/Dual (±): - Mounting Type: Chassis Mount Package / Case: SOT-115J Supplier Device Package: SOT115J	Package: SOT-115J	Stock7,984
MPC8572EPXAVNB	NXP	IC MPU MPC85XX 1.5GHZ 1023FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.5GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 1023-BFBGA, FCBGA Supplier Device Package: 1023-FCPBGA (33x33)	Package: 1023-BFBGA, FCBGA	Stock3,728
KMPC8555VTALF	NXP	IC MPU MPC85XX 667MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock6,512
MC7448VU1000ND	NXP	IC MPU MPC74XX 1.0GHZ 360FCCBGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-CBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25x25)	Package: 360-CBGA, FCCBGA	Stock4,160
P89LPC982FDH,529	NXP	IC MCU 8BIT 8KB FLASH 28TSSOP Core Processor: 8051 Core Size: 8-Bit Speed: 18MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP	Package: 28-TSSOP (0.173", 4.40mm Width)	Stock4,240
MC9S12C32MPBE16	NXP	IC MCU 16BIT 32KB FLASH 52LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 16MHz Connectivity: CAN, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 35 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 52-LQFP Supplier Device Package: 52-LQFP (10x10)	Package: 52-LQFP	Stock6,032
MC68HC908QY2CPE	NXP	IC MCU 8BIT 1.5KB FLASH 16DIP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 1.5KB (1.5K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	Package: 16-DIP (0.300", 7.62mm)	Stock5,920
LPC1823JBD144E	NXP	IC MCU 32BIT 512KB FLASH 144LQFP Core Processor: ARM? Cortex?-M3 Core Size: 32-Bit Speed: 180MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 83 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 16K x 8 RAM Size: 104K x 8 Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V Data Converters: A/D 8x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	Package: 144-LQFP	Stock5,280
MC9S08DZ128CLL	NXP	IC MCU 8BIT 128KB FLASH 100LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 87 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock6,880
S9S12G96F0CLH	NXP	IC MCU 16BIT 96KB FLASH 64LQFP Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: 3K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP	Stock4,448
MKE06Z128VLD4	NXP	IC MCU 32BIT 128KB FLASH 44QFP Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: CAN, I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Number of I/O: 38 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b, D/A 2x6b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 44-LQFP Supplier Device Package: 44-QFP (10x10)	Package: 44-LQFP	Stock17,616
ADC1012D105HN/C1:5	NXP	IC ADC 105MHZ SOT804-3 Number of Bits: - Sampling Rate (Per Second): - Number of Inputs: - Input Type: - Data Interface: - Configuration: - Ratio - S/H:ADC: - Number of A/D Converters: - Architecture: - Reference Type: - Voltage - Supply, Analog: - Voltage - Supply, Digital: - Features: - Operating Temperature: - Package / Case: - Supplier Device Package: - Mounting Type: -	Package: -	Stock4,752
KTY81/210,116	NXP	IC TEMPERATURE SENSOR SOD-70 Resistance in Ohms @ 25°C: 2k Resistance Tolerance: - Operating Temperature: -55°C ~ 150°C Power - Max: - Mounting Type: Through Hole Package / Case: TO-226-2, TO-92-2 (TO-226AC) (Formed Leads) Supplier Device Package: PBCYT2	Package: TO-226-2, TO-92-2 (TO-226AC) (Formed Leads)	Stock2,790
NCF29A1VHN/0500IJ	NXP	IC REMOTE KEYLESS ENTRY 32HVQFN Type: - Frequency: - Standards: - Interface: - Voltage - Supply: - Operating Temperature: - Package / Case: - Supplier Device Package: -	Package: -	Stock7,956
BGU8051,118	NXP	IC AMP LNA 5V 900MHZ 8HWSON Frequency: 300MHz ~ 1.5GHz P1dB: 19dBm Gain: 18.3dB Noise Figure: 0.43dB RF Type: GSM, LTE, W-CDMA Voltage - Supply: 4.75 V ~ 5.25 V Current - Supply: 48mA Test Frequency: 900MHz Package / Case: 8-WFDFN Exposed Pad Supplier Device Package: 8-HWSON (2x2)	Package: 8-WFDFN Exposed Pad	Stock6,066
SPC5606BK0CLL6	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 77 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 7x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock4,800
MKE14Z128VLL7	NXP	KINETIS KE14Z: 72MHZ CORTEX-M0+ Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 72MHz Connectivity: FlexIO, I²C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Number of I/O: 89 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 34K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock4,272
SAF4000EL-101S430Y	NXP	SOFTWARE DEFINED RADIO Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
LS1018AXE7KQA	NXP	IC MPU QORIQ LAYER 1GHZ 448FBGA Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1GHz Co-Processors/DSP: - RAM Controllers: DDR3L SDRAM, DDR4 SDRAM Graphics Acceleration: - Display & Interface Controllers: - Ethernet: 1Gbps (1), 2.5Gbps (5) SATA: SATA 6Gbps (1) USB: - Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 448-BFBGA Supplier Device Package: 448-FBGA (17x17)	Package: -	Request a Quote
A3G23H500W17SR3	NXP	RF MOSFET GAN 48V NI780 Transistor Type: GaN Frequency: 2.3GHz ~ 2.4GHz Gain: 14.3dB Voltage - Test: 48 V Current Rating: - Noise Figure: - Current - Test: 300 mA Power - Output: 80W Voltage - Rated: 125 V Package / Case: NI-780-4S2S Supplier Device Package: NI-780-4S2S	Package: -	Request a Quote
LPC55S16JBD64K	NXP	IC MCU 32BIT 256KB FLASH 64TQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 36 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-TQFP Exposed Pad Supplier Device Package: 64-HTQFP (10x10)	Package: -	Request a Quote
S32K312NHT0VPBST	NXP	S32K312, 2MB FLASH, ARM M7 Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART Peripherals: DMA, Serial Audio, WDT Number of I/O: 143 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 128K x 8 RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 172-QFP Supplier Device Package: 172-QFP (16x16)	Package: -	Request a Quote
LX2080SE72029B	NXP	IC MPU QORLQ LX2 2GHZ 1517FCPBGA Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 8 Core, 64-Bit Speed: 2GHz Co-Processors/DSP: - RAM Controllers: DDR4 Graphics Acceleration: Yes Display & Interface Controllers: - Ethernet: 100Gbps (2) SATA: SATA 3.0 (4) USB: USB 3.0 (2) + PHY (2) Voltage - I/O: 1.2V, 1.8V, 3.3V Operating Temperature: 0°C ~ 105°C (TJ) Security Features: Secure Boot, TrustZone® Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCPBGA (40x40)	Package: -	Request a Quote