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NXP |
MOSFET N-CH 55V 75A D2PAK
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 55V
- Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
- Vgs(th) (Max) @ Id: 2V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 45nC @ 5V
- Input Capacitance (Ciss) (Max) @ Vds: 3960pF @ 25V
- Vgs (Max): ±15V
- FET Feature: -
- Power Dissipation (Max): 200W (Tc)
- Rds On (Max) @ Id, Vgs: 7 mOhm @ 25A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Surface Mount
- Supplier Device Package: D2PAK
- Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
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Package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
Stock5,872 |
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NXP |
TRANS PNP 45V 0.5A TO-92
- Transistor Type: PNP
- Current - Collector (Ic) (Max): 500mA
- Voltage - Collector Emitter Breakdown (Max): 45V
- Vce Saturation (Max) @ Ib, Ic: 700mV @ 50mA, 500mA
- Current - Collector Cutoff (Max): 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 1V
- Power - Max: 625mW
- Frequency - Transition: 80MHz
- Operating Temperature: 150°C (TJ)
- Mounting Type: Through Hole
- Package / Case: TO-226-3, TO-92-3 (TO-226AA)
- Supplier Device Package: TO-92-3
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Package: TO-226-3, TO-92-3 (TO-226AA) |
Stock6,320 |
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NXP |
TRANS PREBIAS NPN 250MW SMT3
- Transistor Type: NPN - Pre-Biased
- Current - Collector (Ic) (Max): 100mA
- Voltage - Collector Emitter Breakdown (Max): 50V
- Resistor - Base (R1) (Ohms): 4.7k
- Resistor - Emitter Base (R2) (Ohms): -
- DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
- Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
- Current - Collector Cutoff (Max): 1µA
- Frequency - Transition: -
- Power - Max: 250mW
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: SMT3; MPAK
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock7,328 |
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NXP |
IC MOTOR DRIVER PAR 44HSOP
- Motor Type - Stepper: -
- Motor Type - AC, DC: Brushed DC
- Function: Driver - Fully Integrated, Control and Power Stage
- Output Configuration: Half Bridge (4)
- Interface: Parallel
- Technology: CMOS
- Step Resolution: -
- Applications: Automotive
- Current - Output: 5A
- Voltage - Supply: 5 V ~ 28 V
- Voltage - Load: 5 V ~ 28 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
- Supplier Device Package: 44-HSOP
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Package: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad |
Stock16,800 |
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NXP |
IC LED DRIVER LIN 25MA 24TSSOP
- Type: Power Switch
- Topology: -
- Internal Switch(s): Yes
- Number of Outputs: 16
- Voltage - Supply (Min): 2.3V
- Voltage - Supply (Max): 5.5V
- Voltage - Output: -
- Current - Output / Channel: 25mA
- Frequency: -
- Dimming: I2C
- Applications: Backlight
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 24-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 24-TSSOP
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Package: 24-TSSOP (0.173", 4.40mm Width) |
Stock90,384 |
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NXP |
IC TRANSLATOR BIDIR VOLT XSON8U
- Translator Type: Voltage Level
- Channel Type: Bidirectional
- Number of Circuits: 1
- Channels per Circuit: 2
- Voltage - VCCA: 1V ~ 3.6V
- Voltage - VCCB: 1.8V ~ 5.5V
- Input Signal: -
- Output Signal: -
- Output Type: Open Drain, Push-Pull
- Data Rate: -
- Operating Temperature: -40°C ~ 85°C (TA)
- Features: Auto-Direction Sensing
- Mounting Type: Surface Mount
- Package / Case: 8-XFDFN
- Supplier Device Package: 8-XSON, SOT996-2 (2x3)
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Package: 8-XFDFN |
Stock6,272 |
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NXP |
IC TXRX 4BIT LVTTL/GTL 14TSSOP
- Translator Type: Mixed Signal
- Channel Type: Bidirectional
- Number of Circuits: 1
- Channels per Circuit: 4
- Voltage - VCCA: -
- Voltage - VCCB: -
- Input Signal: LVTTL
- Output Signal: GTL
- Output Type: Open Drain
- Data Rate: -
- Operating Temperature: -40°C ~ 85°C (TA)
- Features: -
- Mounting Type: Surface Mount
- Package / Case: 14-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 14-TSSOP
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Package: 14-TSSOP (0.173", 4.40mm Width) |
Stock45,372 |
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NXP |
IC BUS SWITCH 10BIT 24SSOP
- Type: Bus Switch
- Circuit: 5 x 1:1
- Independent Circuits: 2
- Current - Output High, Low: -
- Voltage Supply Source: Single Supply
- Voltage - Supply: 3 V ~ 3.6 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 24-SSOP (0.154", 3.90mm Width)
- Supplier Device Package: 24-SSOP
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Package: 24-SSOP (0.154", 3.90mm Width) |
Stock5,936 |
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NXP |
IC 4X4 REGISTER FILE 3ST 16-SSOP
- Logic Type: Register File
- Output Type: Tri-State
- Number of Elements: 1
- Number of Bits per Element: 4
- Function: Universal
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 16-SSOP (0.209", 5.30mm Width)
- Supplier Device Package: 16-SSOP
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Package: 16-SSOP (0.209", 5.30mm Width) |
Stock4,048 |
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NXP |
IC BUFF DVR TRI-ST HEX 16SOIC
- Logic Type: Buffer, Non-Inverting
- Number of Elements: 2
- Number of Bits per Element: 2, 4 (Hex)
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 8mA, 8mA
- Voltage - Supply: 1 V ~ 3.6 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 16-SO
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Package: 16-SOIC (0.154", 3.90mm Width) |
Stock2,896 |
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NXP |
IC AMP AUDIO 3W STER AB 8SOIC
- Type: Class AB
- Output Type: Headphones, 2-Channel (Stereo)
- Max Output Power x Channels @ Load: 80mW x 2 @ 32 Ohm
- Voltage - Supply: 3 V ~ 7 V, ±1.5 V ~ 3.5 V
- Features: Depop, Short-Circuit Protection
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Supplier Device Package: 8-SO
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock7,232 |
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NXP |
IC SBC CAN/LIN 3.3V HS 32HTSSOP
- Applications: Automotive
- Interface: SPI Serial
- Voltage - Supply: 4.5 V ~ 28 V
- Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
- Supplier Device Package: 32-HTSSOP
- Mounting Type: Surface Mount
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Package: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad |
Stock6,672 |
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NXP |
IC MPU MPC86XX 1.067GHZ 994BGA
- Core Processor: PowerPC e600
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.067GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 994-BCBGA, FCCBGA
- Supplier Device Package: 994-FCCBGA (33x33)
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Package: 994-BCBGA, FCCBGA |
Stock4,704 |
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NXP |
IC SOC 2CORE 1200MHZ 780FCBGA
- Core Processor: PowerPC e5500
- Number of Cores/Bus Width: 2 Core, 64-Bit
- Speed: 1.4GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3L/4
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 1 Gbps (5)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
- Package / Case: 780-FBGA, FCBGA
- Supplier Device Package: 780-FCPBGA (23x23)
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Package: 780-FBGA, FCBGA |
Stock2,112 |
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NXP |
IC MCU 32BIT 512KB FLASH 121BGA
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 90
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 42x16b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 121-LFBGA
- Supplier Device Package: 121-MAPBGA (8x8)
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Package: 121-LFBGA |
Stock3,552 |
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NXP |
IC MCU 8BIT 16KB FLASH 32LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I2C, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 22
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 6x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock4,544 |
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NXP |
IC MCU 32BIT 64KB FLASH 32QFN
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: I2C, IrDA, SPI, UART/USART
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 24
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 10x16b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-QFN (5x5)
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Package: 32-VFQFN Exposed Pad |
Stock11,532 |
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NXP |
ACCELEROMETER 4-16G ANALOG 12QFN
- Type: Analog
- Axis: X, Y, Z
- Acceleration Range: ±4g, 16g
- Sensitivity (LSB/g): -
- Sensitivity (mV/g): 114.5 (±4g) ~ 28.62 (±16g)
- Bandwidth: 1.1kHz (X,Y), 600Hz (Z)
- Output Type: Analog Voltage
- Voltage - Supply: 1.71 V ~ 3.6 V
- Features: Selectable Scale
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 12-VQFN Exposed Pad
- Supplier Device Package: 12-QFN (3x3)
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Package: 12-VQFN Exposed Pad |
Stock3,580 |
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NXP |
IC REMOTE KEYLESS ENTRY 32HVQFN
- Type: -
- Frequency: -
- Standards: -
- Interface: -
- Voltage - Supply: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock7,524 |
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NXP |
BOARD EVAL ZIGBEE FOR MCF5282
- Type: 802.15.4/Zigbee
- Frequency: -
- For Use With/Related Products: MCF5282
- Supplied Contents: -
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Package: - |
Stock8,352 |
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NXP |
RF PWR AMP 2GHZ 40W TO270
- Frequency: 1.4GHz ~ 2.2GHz
- P1dB: -
- Gain: 35dB
- Noise Figure: -
- RF Type: W-CDMA
- Voltage - Supply: 28V
- Current - Supply: -
- Test Frequency: 2.2GHz
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock4,032 |
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NXP |
SINGLE CORE 3M FLASH 384K RAM
- Core Processor: e200z4
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
- Peripherals: DMA, I²S, POR, WDT
- Number of I/O: 129
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 384K x 8
- Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
- Data Converters: A/D 36x10b, 16x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP Exposed Pad
- Supplier Device Package: 176-LQFP (24x24)
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Package: 176-LQFP Exposed Pad |
Stock4,512 |
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NXP |
M74K MASK ONLY - AUTO
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I²C, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 39
- Program Memory Size: 48KB (48K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 1.5K x 8
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock2,112 |
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NXP |
16-BIT MCU S12 CORE 64KB FLASH
- Core Processor: 12V1
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CANbus, IrDA, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 26
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock2,560 |
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NXP |
16-BIT MCU S12 CORE 96KB FLASH
- Core Processor: 12V1
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CANbus, IrDA, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 54
- Program Memory Size: 96KB (96K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 3K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock2,064 |
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NXP |
SYSTEM BASIS CHIP, DCDC 0.8A VCO
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: 1V ~ 5V
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-HLQFP (7x7)
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Package: - |
Request a Quote |
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NXP |
SOFTWARE DEFINED RADIO
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
IC MCU 32BIT EXT MEM 289LFBGA
- Core Processor: ARM® Cortex®-M4, Cortex®-M7
- Core Size: 32-Bit Dual-Core
- Speed: 400MHz, 800MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
- Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
- Number of I/O: 13
- Program Memory Size: -
- Program Memory Type: External Program Memory
- EEPROM Size: -
- RAM Size: 2M x 8
- Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
- Data Converters: A/D 20x12b SAR; D/A 1x12b
- Oscillator Type: External, Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 289-LFBGA
- Supplier Device Package: 289-LFBGA (14x14)
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Package: - |
Stock4,209 |
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