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NXP |
MOSFET N-CH 25V 75A DPAK
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 25V
- Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
- Vgs(th) (Max) @ Id: 2V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 60nC @ 5V
- Input Capacitance (Ciss) (Max) @ Vds: 3500pF @ 20V
- Vgs (Max): ±15V
- FET Feature: -
- Power Dissipation (Max): 125W (Tc)
- Rds On (Max) @ Id, Vgs: 5.8 mOhm @ 25A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Surface Mount
- Supplier Device Package: DPAK
- Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
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Package: TO-252-3, DPak (2 Leads + Tab), SC-63 |
Stock5,024 |
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NXP |
MOSFET N-CH 30V 120A TO220AB
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 30V
- Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
- Vgs(th) (Max) @ Id: 2.8V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 168nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds: 10918pF @ 25V
- Vgs (Max): ±16V
- FET Feature: -
- Power Dissipation (Max): 263W (Tc)
- Rds On (Max) @ Id, Vgs: 2.4 mOhm @ 25A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Through Hole
- Supplier Device Package: TO-220AB
- Package / Case: TO-220-3
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Package: TO-220-3 |
Stock5,504 |
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NXP |
FET RF 2CH 65V 1.99GHZ NI1230-8
- Transistor Type: LDMOS (Dual)
- Frequency: 1.99GHz
- Gain: 18.2dB
- Voltage - Test: 30V
- Current Rating: -
- Noise Figure: -
- Current - Test: 1.6A
- Power - Output: 74W
- Voltage - Rated: 65V
- Package / Case: SOT-1110A
- Supplier Device Package: NI1230-8
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Package: SOT-1110A |
Stock7,472 |
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NXP |
TRANS PREBIAS NPN 250MW SMT3
- Transistor Type: NPN - Pre-Biased
- Current - Collector (Ic) (Max): 100mA
- Voltage - Collector Emitter Breakdown (Max): 50V
- Resistor - Base (R1) (Ohms): 2.2k
- Resistor - Emitter Base (R2) (Ohms): 47k
- DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 5V
- Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
- Current - Collector Cutoff (Max): 1µA
- Frequency - Transition: -
- Power - Max: 250mW
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: SMT3; MPAK
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock6,400 |
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NXP |
DIODE ZENER 5.1V 400MW SOD2
- Voltage - Zener (Nom) (Vz): 5.1V
- Tolerance: ±5%
- Power - Max: 400mW
- Impedance (Max) (Zzt): 60 Ohms
- Current - Reverse Leakage @ Vr: 2µA @ 2V
- Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
- Operating Temperature: -65°C ~ 150°C
- Mounting Type: Surface Mount
- Package / Case: SOD-110
- Supplier Device Package: SOD110
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Package: SOD-110 |
Stock3,168 |
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NXP |
IC REG LIN 2V 150MA DFN1010C-4
- Output Configuration: Positive
- Output Type: Fixed
- Number of Regulators: 1
- Voltage - Input (Max): 5.5V
- Voltage - Output (Min/Fixed): 2V
- Voltage - Output (Max): -
- Voltage Dropout (Max): 0.25V @ 150mA
- Current - Output: 150mA
- Current - Quiescent (Iq): -
- Current - Supply (Max): 35µA ~ 150µA
- PSRR: 75dB (1kHz)
- Control Features: Enable
- Protection Features: Over Current, Transient Voltage
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 4-UDFN Exposed Pad
- Supplier Device Package: DFN1010C-4
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Package: 4-UDFN Exposed Pad |
Stock4,480 |
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NXP |
IC FET PRE-DRIVER 3PH 54-SOIC
- Motor Type - Stepper: -
- Motor Type - AC, DC: -
- Function: Controller - Commutation, Direction Management
- Output Configuration: Pre-Driver - Half Bridge (3)
- Interface: SPI
- Technology: Power MOSFET
- Step Resolution: -
- Applications: -
- Current - Output: -
- Voltage - Supply: 8 V ~ 40 V
- Voltage - Load: -
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
- Supplier Device Package: 54-SOICW-EP
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Package: 54-SSOP (0.295", 7.50mm Width) Exposed Pad |
Stock6,960 |
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NXP |
IC GATE NOR 3CH 3-INP 14-SO
- Logic Type: NOR Gate
- Number of Circuits: 3
- Number of Inputs: 3
- Features: -
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Max): -
- Current - Output High, Low: 1mA, 20mA
- Logic Level - Low: 0.8V
- Logic Level - High: 2V
- Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Supplier Device Package: 14-SO
- Package / Case: 14-SOIC (0.154", 3.90mm Width)
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Package: 14-SOIC (0.154", 3.90mm Width) |
Stock5,456 |
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NXP |
IC OPAMP GP 2.5MHZ RRO 8SO
- Amplifier Type: General Purpose
- Number of Circuits: 2
- Output Type: Rail-to-Rail
- Slew Rate: 0.8 V/µs
- Gain Bandwidth Product: -
- -3db Bandwidth: 2.5MHz
- Current - Input Bias: 90nA
- Voltage - Input Offset: 200µV
- Current - Supply: 1.4mA
- Current - Output / Channel: 12mA
- Voltage - Supply, Single/Dual (±): 2 V ~ 5.5 V, ±1 V ~ 2.75 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock4,240 |
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NXP |
IC SMART CARD INTERFACE 32-HVQFN
- Applications: -
- Interface: Analog
- Voltage - Supply: 1.2V, 1.8V, 3V
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-HVQFN (5x5)
- Mounting Type: Surface Mount
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Package: 32-VFQFN Exposed Pad |
Stock4,368 |
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NXP |
IC MPU MPC85XX 1.2GHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.2GHz
- Co-Processors/DSP: Signal Processing; SPE
- RAM Controllers: DDR, DDR2, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock3,040 |
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NXP |
IC MPU MPC85XX 667MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 667MHz
- Co-Processors/DSP: Signal Processing; SPE, Security; SEC
- RAM Controllers: DDR, DDR2, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock4,368 |
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NXP |
IC MCU 32BIT ROMLESS 388PBGA
- Core Processor: Coldfire V4E
- Core Size: 32-Bit
- Speed: 266MHz
- Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
- Peripherals: DMA, PWM, WDT
- Number of I/O: 99
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.43 V ~ 1.58 V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: -
- Package / Case: 388-BBGA
- Supplier Device Package: 388-PBGA (27x27)
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Package: 388-BBGA |
Stock16,068 |
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NXP |
IC MCU 32BIT 8KB FLASH 24QFN
- Core Processor: ARM? Cortex?-M0+
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: I2C, LIN, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 22
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 12x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 24-VFQFN Exposed Pad
- Supplier Device Package: 24-QFN (4x4)
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Package: 24-VFQFN Exposed Pad |
Stock32,076 |
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NXP |
IC DSP QUAD 16B 500MHZ 431FCBGA
- Type: SC140 Core
- Interface: DSI, Ethernet, RS-232
- Clock Rate: 500MHz
- Non-Volatile Memory: External
- On-Chip RAM: 1.436MB
- Voltage - I/O: 3.30V
- Voltage - Core: 1.20V
- Operating Temperature: 0°C ~ 90°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 431-BFBGA, FCBGA
- Supplier Device Package: 431-FCPBGA (20x20)
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Package: 431-BFBGA, FCBGA |
Stock3,856 |
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NXP |
IC INTERFACE ANLG-DGTL 48-LQFP
- Type: CCD (Charged Coupled Device)
- Number of Channels: -
- Resolution (Bits): 10 b
- Sampling Rate (Per Second): 18M
- Data Interface: Parallel
- Voltage Supply Source: Analog and Digital
- Voltage - Supply: 2.7 V ~ 3.6 V
- Operating Temperature: -20°C ~ 75°C
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock5,840 |
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NXP |
ACCELEROMETER 10BIT SPI 16QFN
- Type: -
- Axis: -
- Acceleration Range: -
- Sensitivity (LSB/g): -
- Sensitivity (mV/g): -
- Bandwidth: -
- Output Type: -
- Voltage - Supply: -
- Features: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock7,308 |
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NXP |
ACCELEROMETER 4-12G ANALOG 14LGA
- Type: Analog
- Axis: X, Y, Z
- Acceleration Range: ±4g, 12g
- Sensitivity (LSB/g): -
- Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g)
- Bandwidth: 400Hz (X,Y), 300Hz (Z)
- Output Type: Analog Voltage
- Voltage - Supply: 2.2 V ~ 3.6 V
- Features: Selectable Scale, Sleep Mode
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 14-VFLGA
- Supplier Device Package: 14-LGA (3x5)
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Package: 14-VFLGA |
Stock4,680 |
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NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: -1.0 V ~ 40 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP Exposed Pad |
Stock3,936 |
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NXP |
NXP 32-BIT MCU DUAL POWER ARCH
- Core Processor: e200z7d
- Core Size: 32-Bit Dual-Core
- Speed: 180MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
- Data Converters: A/D 34x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 473-LFBGA
- Supplier Device Package: 473-MAPBGA (19x19)
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Package: 473-LFBGA |
Stock7,120 |
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NXP |
NXP 32-BIT MCU POWER ARCH CORE
- Core Processor: e200z4d
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 147
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 192K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 27x10b, 5x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
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Package: 176-LQFP |
Stock3,568 |
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NXP |
16-BIT MCU S12X CORE 128KB FLA
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 91
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 12K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
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Package: 112-LQFP |
Stock6,624 |
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NXP |
GATE DRIVERS GATE DRIVER, HV ISO
- Driven Configuration: Half-Bridge
- Channel Type: Single
- Number of Drivers: 1
- Gate Type: IGBT, N-Channel MOSFET
- Voltage - Supply: 5V
- Logic Voltage - VIL, VIH: -
- Current - Peak Output (Source, Sink): 15A, 15A
- Input Type: -
- High Side Voltage - Max (Bootstrap): -
- Rise / Fall Time (Typ): -
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 32-BSSOP (0.295", 7.50mm Width)
- Supplier Device Package: 32-SOIC
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Package: - |
Request a Quote |
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NXP |
IC DSC 64KB/12KB LQPF48
- Type: -
- Interface: I2C, SCI, SPI
- Clock Rate: 100MHz
- Non-Volatile Memory: FLASH (64kB)
- On-Chip RAM: 12kB
- Voltage - I/O: 3.30V
- Voltage - Core: 3.30V
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: - |
Request a Quote |
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NXP |
IC MPU FS32V23 800MHZ 621FCPBGA
- Core Processor: ARM® Cortex®-A53
- Number of Cores/Bus Width: 4 Core, 32/64-Bit
- Speed: 800MHz
- Co-Processors/DSP: ARM® Cortex®-M4
- RAM Controllers: DDR3, DDR3L, LPDDR2
- Graphics Acceleration: No
- Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
- Ethernet: GbE
- SATA: -
- USB: -
- Voltage - I/O: 1V, 1.8V, 3.3V
- Operating Temperature: -40°C ~ 125°C (TJ)
- Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
- Package / Case: 621-FBGA, FCBGA
- Supplier Device Package: 621-FCPBGA (17x17)
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Package: - |
Request a Quote |
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NXP |
IC AMPLIFIER CLASS D 100HLQFP
- Type: Class D
- Output Type: 4-Channel (Quad)
- Max Output Power x Channels @ Load: 80W x 4 @ 2Ohm
- Voltage - Supply: 5.5V ~ 25V
- Features: -
- Mounting Type: Surface Mount
- Operating Temperature: -
- Supplier Device Package: 100-HLQFP (14x14)
- Package / Case: 100-FQFP Exposed Pad
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Package: - |
Request a Quote |
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NXP |
IC PMIC VR5510 ASIL-D
- Applications: -
- Current - Supply: 15mA
- Voltage - Supply: 2.7V ~ 60V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-HVQFN (8x8)
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Package: - |
Request a Quote |
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NXP |
AUTO SBC
- Applications: -
- Current - Supply: 30µA
- Voltage - Supply: 3.2V ~ 40V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP-EP (7x7)
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Package: - |
Request a Quote |
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