NXP Products

MOSFET 2N-CH 30V 2.4A HUSON6

• FET Type: 2 N-Channel (Dual)
• FET Feature: Logic Level Gate
• Drain to Source Voltage (Vdss): 30V
• Current - Continuous Drain (Id) @ 25°C: 2.4A
• Rds On (Max) @ Id, Vgs: 120 mOhm @ 2A, 4.5V
• Vgs(th) (Max) @ Id: 1.5V @ 250µA
• Gate Charge (Qg) (Max) @ Vgs: 2.5nC @ 4.5V
• Input Capacitance (Ciss) (Max) @ Vds: 143pF @ 15V
• Power - Max: 475mW
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 6-UDFN Exposed Pad
• Supplier Device Package: DFN2020-6

DIODE ZENER 2.7V 300MW SMT3

• Voltage - Zener (Nom) (Vz): 2.7V
• Tolerance: ±2%
• Power - Max: 300mW
• Impedance (Max) (Zzt): 100 Ohms
• Current - Reverse Leakage @ Vr: 20µA @ 1V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

DIODE VAR CAP 10V 20MA SOD523

• Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
• Capacitance Ratio: 5.2
• Capacitance Ratio Condition: C1/C7.5
• Voltage - Peak Reverse (Max): 10V
• Diode Type: Single
• Q @ Vr, F: -
• Operating Temperature: -55°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SC-79, SOD-523
• Supplier Device Package: SOD-523

IC AUDIO/VIDEO MODULATOR 16-SOIC

• Type: NTSC/PAL Modulator
• Applications: Audio/Video, VCR's, Set-Top Boxes
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SOIC

IC CONVERTER DDR 24QFN

• Applications: Converter, DDR
• Voltage - Input: 3 V ~ 6 V
• Number of Outputs: 1
• Voltage - Output: 0.7 V ~ 1.35 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-QFN-EP (4x4)

IC CTLR SMPS SW MODE 14SOIC

• Output Isolation: Isolated
• Internal Switch(s): No
• Voltage - Breakdown: 650V
• Topology: Flyback
• Voltage - Start Up: 11V
• Voltage - Supply (Vcc/Vdd): 8.7 V ~ 20 V
• Duty Cycle: -
• Frequency - Switching: 25kHz ~ 175kHz
• Power (Watts): 250W
• Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
• Control Features: -
• Operating Temperature: -20°C ~ 145°C (TJ)
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO
• Mounting Type: Surface Mount

IC BUFFER/LDRIVER OCTAL 24SOIC

• Logic Type: Buffer/Driver with Parity
• Supply Voltage: 4.5 V ~ 5.5 V
• Number of Bits: 8
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SO

IC BUS SWITCH 10BIT 24SOIC

• Type: Bus Switch
• Circuit: 5 x 1:1
• Independent Circuits: 2
• Current - Output High, Low: -
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SO

IC AMP AUDIO BTL RDBS27P

• Type: Class AB
• Output Type: 4-Channel (Quad)
• Max Output Power x Channels @ Load: 25W x 4 @ 4 Ohm
• Voltage - Supply: 6 V ~ 18 V
• Features: Depop, Short-Circuit and Thermal Protection
• Mounting Type: Surface Mount
• Operating Temperature: -
• Supplier Device Package: 27-RDBS
• Package / Case: 27-SIP, Formed Leads

IC DUART 44PLCC

• Features: Configurable GPIO, Internal Oscillator, Timer/Counter
• Number of Channels: 2, DUART
• FIFO's: 8 Byte
• Protocol: -
• Data Rate (Max): 1Mbps
• Voltage - Supply: 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

IC I2C MUX 4CH 20-HVQFN

• Applications: Translating Switch
• Interface: I2C, SMBus
• Voltage - Supply: 2.3 V ~ 3.6 V, 4.5 V ~ 5.5 V
• Package / Case: 20-VQFN Exposed Pad
• Supplier Device Package: 20-HVQFN (5x5)
• Mounting Type: Surface Mount

IC I/O EXPANDER 8BIT 16-HVQFN

• Number of I/O: 8
• Interface: I2C
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 100µA, 25mA
• Clock Frequency: 1MHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-VFQFN Exposed Pad
• Supplier Device Package: 16-HVQFN (3x3)

IC MPU M680X0 25MHZ 132CQFP

• Core Processor: 68030
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 25MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: -
• Package / Case: 132-BCQFP
• Supplier Device Package: 132-CQFP (24x24)

IC MPU M680X0 33MHZ 114PGA

• Core Processor: 68020
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 33MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 114-BPGA
• Supplier Device Package: 114-PGA (34.54x34.54)

IC MCU 16BIT 128KB FLASH 112LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

IC MCU 8BIT 1.5KB FLASH 20DIP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LED, LVD, POR, PWM
• Number of I/O: 15
• Program Memory Size: 1.5KB (1.5K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V
• Data Converters: A/D 12x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-DIP

IC MCU 32BIT 256KB FLASH 80LQFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LCD, LVD, PWM, WDT
• Number of I/O: 56
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 12x16b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (14x14)

IC MCU 16BIT 128KB FLASH 80QFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: CAN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 64
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 6K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

IC MCU 8BIT 8KB FLASH 16TSSOP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: LIN, SCI
• Peripherals: LVD, PWM, WDT
• Number of I/O: 12
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

IC DSP 24BIT 150MHZ 52-LQFP

• Type: Audio Processor
• Interface: Host Interface, I2C, SAI, SPI
• Clock Rate: 150MHz
• Non-Volatile Memory: ROM (84 kB)
• On-Chip RAM: 54kB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.25V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 52-LQFP
• Supplier Device Package: 52-LQFP (10x10)

IC CLOCK DIST CHIP 1:18 32-TQFP

• PLL: No
• Main Purpose: Intel CPU Servers
• Input: LVCMOS, LVTTL
• Output: LVCMOS
• Number of Circuits: 1
• Ratio - Input:Output: 1:18
• Differential - Input:Output: No/No
• Frequency - Max: 250MHz
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

TVS DIODE 5.5VWM 10TSSOP

• Type: Steering (Rail to Rail)
• Unidirectional Channels: 8
• Bidirectional Channels: -
• Voltage - Reverse Standoff (Typ): 5.5V (Max)
• Voltage - Breakdown (Min): 6V
• Voltage - Clamping (Max) @ Ipp: -
• Current - Peak Pulse (10/1000µs): -
• Power - Peak Pulse: -
• Power Line Protection: Yes
• Applications: General Purpose
• Capacitance @ Frequency: 1pF @ 1MHz
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 10-TSSOP

IC KEYLINK LIGHT 38TSSOP

• Type: -
• Frequency: -
• Standards: -
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

IC AMPLIFIER MMIC LNA 6TSSOP

• Frequency: 40MHz ~ 1GHz
• P1dB: 14dBm (25.1mW)
• Gain: 10dB
• Noise Figure: 4.5dB
• RF Type: General Purpose
• Voltage - Supply: 4.75 V ~ 5.25 V
• Current - Supply: 43mA
• Test Frequency: 1GHz
• Package / Case: 6-TSSOP, SC-88, SOT-363
• Supplier Device Package: 6-TSSOP

NXP 32-BIT MCU DUAL POWER ARCH

• Core Processor: e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 200MHz
• Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI, UART/USART
• Peripherals: DMA, LVD, POR, Zipwire
• Number of I/O: -
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 3.5 V ~ 5.5 V
• Data Converters: A/D 12b SAR, 16b Sigma-Delta
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

IC

• Applications: System Basis Chip
• Current - Supply: 30µA
• Voltage - Supply: 5.5V ~ 40V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-HVQFN (7x7)

IC MCU 32BIT 96KB ROM 196LFBGA

• Core Processor: ARM® Cortex®-M7
• Core Size: 32-Bit
• Speed: 528MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 127
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: ROM
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
• Data Converters: A/D 20x12b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 196-LFBGA
• Supplier Device Package: 196-LFBGA (12x12)

IC MCU 16BIT 192KB FLASH 48LQFP

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: CANbus, I2C, SCI, SPI
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 192KB (192K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
• Data Converters: A/D 10x10b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)