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NXP |
IC TRANS RF LDMOS
- Transistor Type: LDMOS (Dual)
- Frequency: 2.69GHz
- Gain: 31.9dB
- Voltage - Test: 28V
- Current Rating: -
- Noise Figure: -
- Current - Test: 59mA
- Power - Output: 3.2W
- Voltage - Rated: 65V
- Package / Case: TO-270-17 Variant, Flat Leads
- Supplier Device Package: TO-270WB-17
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Package: TO-270-17 Variant, Flat Leads |
Stock3,168 |
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NXP |
DIODE PIN GP 50V 50MA SOT323
- Diode Type: PIN - 1 Pair Common Anode
- Voltage - Peak Reverse (Max): 50V
- Current - Max: 50mA
- Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
- Resistance @ If, F: 2.5 Ohm @ 10mA, 100MHz
- Power Dissipation (Max): 240mW
- Operating Temperature: -65°C ~ 150°C (TJ)
- Package / Case: SC-70, SOT-323
- Supplier Device Package: SOT-323-3
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Package: SC-70, SOT-323 |
Stock23,382 |
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NXP |
IC REG LINEAR 2.8V 200MA 6-XSON
- Output Configuration: Positive
- Output Type: Fixed
- Number of Regulators: 1
- Voltage - Input (Max): 5.5V
- Voltage - Output (Min/Fixed): 2.8V
- Voltage - Output (Max): -
- Voltage Dropout (Max): 0.13V @ 200mA
- Current - Output: 200mA
- Current - Quiescent (Iq): -
- Current - Supply (Max): 100µA ~ 250µA
- PSRR: 55dB (1kHz)
- Control Features: Enable
- Protection Features: Over Current, Over Temperature
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 6-XFDFN
- Supplier Device Package: 6-XSON, SOT886 (1.45x1)
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Package: 6-XFDFN |
Stock2,816 |
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NXP |
IC SWITCH HIGH SIDE 23PQFN
- Switch Type: General Purpose
- Number of Outputs: 2
- Ratio - Input:Output: -
- Output Configuration: High Side
- Output Type: -
- Interface: SPI
- Voltage - Load: 8 V ~ 36 V
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Current - Output (Max): 6A
- Rds On (Typ): 10 mOhm
- Input Type: -
- Features: -
- Fault Protection: Open Load Detect, Over Temperature, Over Voltage
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: 23-PowerQFN
- Supplier Device Package: 23-PQFN (12x12)
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Package: 23-PowerQFN |
Stock5,184 |
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NXP |
IC GATE NOR 4CH 2-INP 14-TSSOP
- Logic Type: NOR Gate
- Number of Circuits: 4
- Number of Inputs: 2
- Features: -
- Voltage - Supply: 1.65 V ~ 3.6 V
- Current - Quiescent (Max): 10µA
- Current - Output High, Low: 24mA, 24mA
- Logic Level - Low: 0.12 V ~ 0.8 V
- Logic Level - High: 1.08 V ~ 2 V
- Max Propagation Delay @ V, Max CL: 4.4ns @ 3.3V, 50pF
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Supplier Device Package: 14-TSSOP
- Package / Case: 14-TSSOP (0.173", 4.40mm Width)
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Package: 14-TSSOP (0.173", 4.40mm Width) |
Stock5,184 |
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NXP |
IC REDRIVER I2C 5CH 16TSSOP
- Type: Buffer, ReDriver
- Applications: I2C
- Input: 2-Wire Bus
- Output: 2-Wire Bus
- Data Rate (Max): 400kHz
- Number of Channels: 5
- Delay Time: -
- Signal Conditioning: -
- Capacitance - Input: 6pF
- Voltage - Supply: 3 V ~ 3.6 V
- Current - Supply: 5mA
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: -
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
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Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock4,896 |
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NXP |
IC I/O EXPANDER 16BIT 24HWQFN
- Number of I/O: 16
- Interface: I2C
- Interrupt Output: Yes
- Features: POR
- Output Type: Open Drain, Push-Pull
- Current - Output Source/Sink: 10mA, 25mA
- Clock Frequency: 400kHz
- Voltage - Supply: 1.65 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 24-WFQFN Exposed Pad
- Supplier Device Package: 24-HWQFN (4x4)
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Package: 24-WFQFN Exposed Pad |
Stock3,184 |
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NXP |
IC I/O EXPANDER 16BIT 24VFBGA
- Number of I/O: 16
- Interface: I2C, SMBus
- Interrupt Output: Yes
- Features: POR
- Output Type: Open Drain, Push-Pull
- Current - Output Source/Sink: 10mA, 25mA
- Clock Frequency: 400kHz
- Voltage - Supply: 1.65 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 24-VFBGA
- Supplier Device Package: 24-VFBGA (3x3)
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Package: 24-VFBGA |
Stock48,540 |
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NXP |
IC MPU MPC83XX 333MHZ 516BGA
- Core Processor: PowerPC e300c3
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 333MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 + PHY (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 516-BBGA Exposed Pad
- Supplier Device Package: 516-TEPBGA (27x27)
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Package: 516-BBGA Exposed Pad |
Stock5,872 |
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NXP |
IC MPU M683XX 25MHZ 357BGA
- Core Processor: CPU32+
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 25MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: -
- Package / Case: 357-BGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BGA |
Stock2,112 |
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NXP |
IC MPU E600 DUAL CORE 1023FCCBGA
- Core Processor: PowerPC e600
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 1023-BCBGA, FCCBGA
- Supplier Device Package: 1023-FCCBGA (33x33)
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Package: 1023-BCBGA, FCCBGA |
Stock6,384 |
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NXP |
IC MCU 8BIT 32KB FLASH 64LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: CAN, I2C, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 53
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 1K x 8
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 24x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock144,060 |
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NXP |
IC MCU 8BIT 20KB OTP 52PLCC
- Core Processor: HC11
- Core Size: 8-Bit
- Speed: 3MHz
- Connectivity: SCI, SPI
- Peripherals: POR, WDT
- Number of I/O: 38
- Program Memory Size: 20KB (20K x 8)
- Program Memory Type: OTP
- EEPROM Size: 512 x 8
- RAM Size: 768 x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 8x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 52-LCC (J-Lead)
- Supplier Device Package: 52-PLCC (19.1x19.1)
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Package: 52-LCC (J-Lead) |
Stock16,224 |
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NXP |
IC MCU 32BIT 2MB FLASH 416BGA
- Core Processor: e200z4d
- Core Size: 32-Bit
- Speed: 125MHz
- Connectivity: CAN, I2C, LIN, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 177
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1.064M x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 20x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 416-BBGA
- Supplier Device Package: 416-PBGA (27x27)
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Package: 416-BBGA |
Stock5,440 |
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NXP |
IC MCU 32BIT 256KB FLASH 80LQFP
- Core Processor: Coldfire V2
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: Ethernet, I2C, SPI, UART/USART
- Peripherals: DMA, LVD, POR, PWM, WDT
- Number of I/O: 56
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 8x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 80-LQFP
- Supplier Device Package: 80-LQFP (14x14)
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Package: 80-LQFP |
Stock3,840 |
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NXP |
IC MCU 32BIT 1MB FLASH 100LQFP
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 66
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 33x16b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: 100-LQFP |
Stock7,424 |
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NXP |
IC MCU 32BIT 256KB FLASH 64BGA
- Core Processor: ARM? Cortex?-M0+
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O: 54
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 16x16b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LFBGA
- Supplier Device Package: 64-MAPBGA (5x5)
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Package: 64-LFBGA |
Stock8,520 |
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NXP |
IC MCU 16BIT 512KB FLASH 144LQFP
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 80MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 119
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 20K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
- Data Converters: A/D 24x10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock6,036 |
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NXP |
IC MCU 32BIT 512KB FLASH 121BGA
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 100
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 38x16b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 121-LFBGA
- Supplier Device Package: 121-MAPBGA (8x8)
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Package: 121-LFBGA |
Stock6,312 |
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NXP |
IC MCU 8BIT 32KB FLASH 44LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: I2C, LIN, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 37
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 256 x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 44-LQFP
- Supplier Device Package: 44-LQFP (10x10)
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Package: 44-LQFP |
Stock5,552 |
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NXP |
IC NFC CONTACTLESS TXRX 32HVQFN
- Type: RFID Reader
- Frequency: 13.56MHz
- Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC
- Interface: I2C, SPI, UART
- Voltage - Supply: 3 V ~ 5.5 V
- Operating Temperature: -25°C ~ 85°C
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-HVQFN (5x5)
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Package: 32-VFQFN Exposed Pad |
Stock6,228 |
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NXP |
POWER MANAGEMENT IC I.MX7 PRE-
- Applications: LS1 Communication Processors
- Current - Supply: 450µA
- Voltage - Supply: 2.8 V ~ 4.5 V
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN (7x7)
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Package: 48-VFQFN Exposed Pad |
Stock6,208 |
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NXP |
POWER MANAGEMENT IC I.MX7 PRE-
- Applications: Processor
- Current - Supply: -
- Voltage - Supply: 2.8 V ~ 5.5 V
- Operating Temperature: -40°C ~ 105°C
- Mounting Type: Surface Mount
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN (7x7)
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Package: 48-VFQFN Exposed Pad |
Stock7,760 |
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NXP |
OVP LOAD SWITCH & OTG UP TO 1.5A
- Switch Type: -
- Number of Outputs: -
- Ratio - Input:Output: -
- Output Configuration: -
- Output Type: -
- Interface: -
- Voltage - Load: -
- Voltage - Supply (Vcc/Vdd): -
- Current - Output (Max): -
- Rds On (Typ): -
- Input Type: -
- Features: -
- Fault Protection: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock6,192 |
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NXP |
NXP 32-BIT MCU POWER ARCH CORES
- Core Processor: e200z7
- Core Size: 32-Bit Tri-Core
- Speed: 264MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
- Peripherals: DMA, LVD, POR, Zipwire
- Number of I/O: -
- Program Memory Size: 8MB (8M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 16b Sigma-Delta, eQADC
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 516-BGA
- Supplier Device Package: 516-MAPBGA (27x27)
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Package: 516-BGA |
Stock2,192 |
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NXP |
16 BIT 48K FLASH 4KB RAM
- Core Processor: 12V1
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CANbus, IrDA, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 26
- Program Memory Size: 48KB (48K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 1.5K x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock3,936 |
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NXP |
IC MCU 16BIT 64KB FLASH 64HLQFP
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: CANbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 31
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
- Data Converters: A/D 9x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 64-LQFP Exposed Pad
- Supplier Device Package: 64-LQFP (10x10)
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Package: - |
Request a Quote |
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NXP |
IC
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: 5.5V ~ 40V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-HVQFN (7x7)
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Package: - |
Request a Quote |
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