Page 83 - NXP Products | Heisener Electronics

PMBFJ620,115
NXP

JFET 2N-CH 25V 0.19W 6TSSOP

Package: 6-TSSOP, SC-88, SOT-363

Stock6,048
MRF6S21050LSR5
NXP

FET RF 68V 2.16GHZ NI-400S

Package: NI-400S

Stock6,144
BZX84-C2V7/LF1R
NXP

DIODE ZENER TO-236AB SOT23

Package: TO-236-3, SC-59, SOT-23-3

Stock3,264
MC10XS3412CPNA
NXP

IC SWITCH HIGH SIDE QUAD 24-QFN

Package: 24-PowerQFN

Stock7,472
74HC640N,652
NXP

IC TRANSCEIVER 3ST 8BIT 20DIP

Package: 20-DIP (0.300", 7.62mm)

Stock6,704
TDA9983BHW/15/C1:5
NXP

IC HDMI TX 150MHZ 80-HTQFP

Package: 80-TQFP Exposed Pad

Stock7,808
TDA19988BET/C1,157
NXP

IC HDMI TRANSMITTER 64-TFBGA

Package: 64-TFBGA

Stock5,792
74LVC1284DB,118
NXP

IC PRINTR INTFC TXRX/BUFF 20SSOP

Package: 20-SSOP (0.209", 5.30mm Width)

Stock3,120
P1020PSE2HFB
NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

Package: 689-BBGA Exposed Pad

Stock5,648
MPC860TVR66D4
NXP

IC MPU MPC8XX 66MHZ 357BGA

Package: 357-BBGA

Stock5,840
PCF51JF128VLH
NXP

IC MCU 32BIT 128KB FLASH 64LQFP

Package: 64-LQFP

Stock9,108
MC68F375MZP33R2
NXP

IC MCU 32BIT 256KB FLASH 217BGA

Package: 217-BBGA

Stock5,200
PXAG49KBA/00,512
NXP

IC MCU 16BIT 64KB FLASH 44PLCC

Package: 44-LCC (J-Lead)

Stock3,872
SPC5668EK0VMG
NXP

IC MCU 32BIT 2MB FLASH 208MAPBGA

Package: 208-BGA

Stock3,776
MC9S12DT512CPVE
NXP

IC MCU 16BIT 512KB FLASH 112LQFP

Package: 112-LQFP

Stock2,560
SPC5602BK0CLQ4R
NXP

IC MCU 32BIT 256KB FLASH 144LQFP

Package: 144-LQFP

Stock6,096
MC908QB8CDWER
NXP

IC MCU 8BIT 8KB FLASH 16SOIC

Package: 16-SOIC (0.295", 7.50mm Width)

Stock20,526
MPXM2202D
NXP

SENS PRESSURE 29 PSI MAX MPAK

Package: 5-SMD Module

Stock3,816
MMA2201KEG
NXP

ACCELEROMETER 40G ANALOG 16SOIC

Package: 16-SOIC (0.295", 7.50mm Width)

Stock3,132
NT2H0301G0DUD,005
NXP

IC SMART TAG NFC TYPE 2 UNCASED

Package: Die

Stock4,554

Part Number	Manufacturer	Description	Package	Stock
PMBFJ620,115	NXP	JFET 2N-CH 25V 0.19W 6TSSOP FET Type: 2 N-Channel (Dual) Voltage - Breakdown (V(BR)GSS): 25V Drain to Source Voltage (Vdss): 25V Current - Drain (Idss) @ Vds (Vgs=0): 24mA @ 10V Current Drain (Id) - Max: - Voltage - Cutoff (VGS off) @ Id: 2V @ 1µA Input Capacitance (Ciss) (Max) @ Vds: 5pF @ 10V Resistance - RDS(On): 50 Ohm Power - Max: 190mW Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: 6-TSSOP, SC-88, SOT-363 Supplier Device Package: 6-TSSOP	Package: 6-TSSOP, SC-88, SOT-363	Stock6,048
MRF6S21050LSR5	NXP	FET RF 68V 2.16GHZ NI-400S Transistor Type: LDMOS Frequency: 2.16GHz Gain: 16dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 450mA Power - Output: 11.5W Voltage - Rated: 68V Package / Case: NI-400S Supplier Device Package: NI-400S	Package: NI-400S	Stock6,144
BZX84-C2V7/LF1R	NXP	DIODE ZENER TO-236AB SOT23 Voltage - Zener (Nom) (Vz): 2.7V Tolerance: ±5% Power - Max: 250mW Impedance (Max) (Zzt): 100 Ohms Current - Reverse Leakage @ Vr: 20µA @ 1V Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	Package: TO-236-3, SC-59, SOT-23-3	Stock3,264
MC10XS3412CPNA	NXP	IC SWITCH HIGH SIDE QUAD 24-QFN Switch Type: General Purpose Number of Outputs: 4 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 6 V ~ 20 V Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Current - Output (Max): - Rds On (Typ): 10 mOhm, 12 mOhm Input Type: - Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Operating Temperature: -40°C ~ 150°C (TJ) Package / Case: 24-PowerQFN Supplier Device Package: 24-PQFN (12x12)	Package: 24-PowerQFN	Stock7,472
74HC640N,652	NXP	IC TRANSCEIVER 3ST 8BIT 20DIP Logic Type: Transceiver, Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 7.8mA, 7.8mA Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	Package: 20-DIP (0.300", 7.62mm)	Stock6,704
TDA9983BHW/15/C1:5	NXP	IC HDMI TX 150MHZ 80-HTQFP Type: Transmitter Applications: Recorders, Set-Top Boxes Mounting Type: Surface Mount Package / Case: 80-TQFP Exposed Pad Supplier Device Package: 80-HTQFP (12x12)	Package: 80-TQFP Exposed Pad	Stock7,808
TDA19988BET/C1,157	NXP	IC HDMI TRANSMITTER 64-TFBGA Type: HDMI Transmitter Applications: Mobile Phones, Cellular, Video Displays Mounting Type: Surface Mount Package / Case: 64-TFBGA Supplier Device Package: 64-TFBGA (4.5x4.5)	Package: 64-TFBGA	Stock5,792
74LVC1284DB,118	NXP	IC PRINTR INTFC TXRX/BUFF 20SSOP Type: Transceiver Protocol: IEEE 1284 Number of Drivers/Receivers: 4/4 Duplex: Full Receiver Hysteresis: 400mV Data Rate: - Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 20-SSOP (0.209", 5.30mm Width) Supplier Device Package: 20-SSOP	Package: 20-SSOP (0.209", 5.30mm Width)	Stock3,120
P1020PSE2HFB	NXP	IC MPU Q OR IQ 800MHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	Package: 689-BBGA Exposed Pad	Stock5,648
MPC860TVR66D4	NXP	IC MPU MPC8XX 66MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (4), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	Package: 357-BBGA	Stock5,840
PCF51JF128VLH	NXP	IC MCU 32BIT 128KB FLASH 64LQFP Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM Number of I/O: 48 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 17x12b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP	Stock9,108
MC68F375MZP33R2	NXP	IC MCU 32BIT 256KB FLASH 217BGA Core Processor: CPU32 Core Size: 32-Bit Speed: 33MHz Connectivity: CAN, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 48 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 10K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.25 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 217-BBGA Supplier Device Package: 217-PBGA (23x23)	Package: 217-BBGA	Stock5,200
PXAG49KBA/00,512	NXP	IC MCU 16BIT 64KB FLASH 44PLCC Core Processor: XA Core Size: 16-Bit Speed: 30MHz Connectivity: UART/USART Peripherals: PWM, WDT Number of I/O: 32 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	Package: 44-LCC (J-Lead)	Stock3,872
SPC5668EK0VMG	NXP	IC MCU 32BIT 2MB FLASH 208MAPBGA Core Processor: e200z650 Core Size: 32-Bit Speed: 116MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 155 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 3.3 V ~ 5 V Data Converters: A/D 64x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 208-BGA Supplier Device Package: 208-MAPBGA (17x17)	Package: 208-BGA	Stock3,776
MC9S12DT512CPVE	NXP	IC MCU 16BIT 512KB FLASH 112LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: PWM, WDT Number of I/O: 91 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 14K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	Package: 112-LQFP	Stock2,560
SPC5602BK0CLQ4R	NXP	IC MCU 32BIT 256KB FLASH 144LQFP Core Processor: e200z0h Core Size: 32-Bit Speed: 48MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 123 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 16 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 36x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (15x15)	Package: 144-LQFP	Stock6,096
MC908QB8CDWER	NXP	IC MCU 8BIT 8KB FLASH 16SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	Package: 16-SOIC (0.295", 7.50mm Width)	Stock20,526
MPXM2202D	NXP	SENS PRESSURE 29 PSI MAX MPAK Pressure Type: Differential Operating Pressure: 29.01 PSI (200 kPa) Output Type: Wheatstone Bridge Output: 0 mV ~ 40 mV (10V) Accuracy: - Voltage - Supply: 10 V ~ 16 V Port Size: - Port Style: No Port Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 5-SMD Module Supplier Device Package: 5-MPAK	Package: 5-SMD Module	Stock3,816
MMA2201KEG	NXP	ACCELEROMETER 40G ANALOG 16SOIC Type: Analog Axis: X Acceleration Range: ±40g Sensitivity (LSB/g): - Sensitivity (mV/g): 50 Bandwidth: 400Hz Output Type: Analog Voltage Voltage - Supply: 4.75 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	Package: 16-SOIC (0.295", 7.50mm Width)	Stock3,132
NT2H0301G0DUD,005	NXP	IC SMART TAG NFC TYPE 2 UNCASED Type: RFID Transponder Frequency: 13.56MHz Standards: ISO 14443 Interface: - Voltage - Supply: - Operating Temperature: -25°C ~ 70°C Package / Case: Die Supplier Device Package: Wafer	Package: Die	Stock4,554
SA676DK/01,112	NXP	IC MIXER 100MHZ UP CONVRT 20SSOP RF Type: Cordless Phones Frequency: 100MHz Number of Mixers: 2 Gain: 17dB Noise Figure: 7dB Secondary Attributes: Up Converter Current - Supply: 5mA Voltage - Supply: 2.7 V ~ 7 V Package / Case: 20-LSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-SSOP	Package: 20-LSSOP (0.173", 4.40mm Width)	Stock4,050
SA616DK/01,118	NXP	IC MIXR 150MHZ RSSI EQUIP 20SSOP RF Type: Cellular, ASK, FSK Frequency: 150MHz Number of Mixers: 2 Gain: 17dB Noise Figure: 6.8dB Secondary Attributes: RSSI Equipped Current - Supply: 3.5mA Voltage - Supply: 2.7 V ~ 7 V Package / Case: 20-LSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-SSOP	Package: 20-LSSOP (0.173", 4.40mm Width)	Stock6,984
SPC5607BAVLU6	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 149 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 29x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	Package: 176-LQFP	Stock7,536
S9S12XS256J0VAA	NXP	16-BIT MCU S12X CORE 256KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 40MHz Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	Package: 80-QFP	Stock2,784
S912ZVC19F0VKH	NXP	MAGNIV 16-BIT MCU S12Z CORE 19 Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I²C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 192KB (192K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V Data Converters: A/D 16x10b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP Exposed Pad	Stock3,520
MCIMX7U3DVK07SC	NXP	IC I.MX 7ULP VFBGA 361 Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 720MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Ethernet: - SATA: - USB: USB 2.0 (2) Voltage - I/O: - Operating Temperature: 0°C ~ 95°C Security Features: Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot Package / Case: - Supplier Device Package: -	Package: -	Stock2,736
LPC54S018J4MET180E	NXP	IC MCU CORTEX M4 BGA183 Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT Number of I/O: 137 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 360K x 8 Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 180-TFBGA Supplier Device Package: 180-TFBGA (12x12)	Package: 180-TFBGA	Stock6,416
MFS2613AMDA6AD	NXP	SAFETY SYSTEM BASIS CHIP WITH LO Applications: - Current - Supply: - Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	Package: -	Request a Quote