Page 836 - NXP Products | Heisener Electronics

PHD37N06LT,118
NXP

MOSFET N-CH 55V 37A DPAK

Package: TO-252-3, DPak (2 Leads + Tab), SC-63

Stock2,496
ON5257,215
NXP

MOSFET RF SOT23 TO-236AB

Package: TO-236-3, SC-59, SOT-23-3

Stock6,720
MRFG35003NR5
NXP

FET RF 15V 3.55GHZ

Package: PLD-1.5

Stock2,480
PMST5401,135
NXP

TRANS PNP 150V 0.3A SOT323

Package: SC-70, SOT-323

Stock7,888
NX5P2925CUKZ
NXP

IC LOAD SWITCH HI SD 2.5A 6WLCSP

Package: 6-XFBGA, WLCSP

Stock3,952
SSTU32866EC/G,557
NXP

IC BUFFER 1.8V 25BIT SOT536-1

Package: 96-LFBGA

Stock2,640
74LVT32PW,112
NXP

IC GATE OR 4CH 2-INP 14-TSSOP

Package: 14-TSSOP (0.173", 4.40mm Width)

Stock5,424
HEC4027BT,118
NXP

IC JK TYPE POS TRG DUAL 16SOIC

Package: 16-SOIC (0.154", 3.90mm Width)

Stock7,056
74HCT191D,652
NXP

IC COUNTER UP/DOWN SYNC 16SOIC

Package: 16-SOIC (0.154", 3.90mm Width)

Stock5,952
74ALVCH16543DGG:11
NXP

IC TRANSCVR TRI-ST 16BIT 56SSOP

Package: 56-TFSOP (0.240", 6.10mm Width)

Stock3,280
SC16C652IB48,128
NXP

IC DUART 32BYTES 48LQFP

Package: 48-LQFP

Stock5,856
MC92604VM
NXP

IC ETH TXRX DUAL GIG 196-MAPBGA

Package: 196-LBGA

Stock4,128
KMPC8245LZU300D
NXP

IC MPU MPC82XX 300MHZ 352TBGA

Package: 352-LBGA

Stock6,432
MC68MH360VR33LR2
NXP

IC MPU M683XX 33MHZ 357BGA

Package: 357-BBGA

Stock6,624
SPC5673KFF0VMM1R
NXP

IC MCU 32BIT 1MB FLASH 257MAPBGA

Package: 257-LFBGA

Stock7,136
MC9S08DN16ACLF
NXP

IC MCU 8BIT 16KB FLASH 48LQFP

Package: 48-LQFP

Stock5,568
MC9S08PT8AVWJ
NXP

IC MCU 8BIT 8KB FLASH 20SOIC

Package: 20-SOIC (0.295", 7.50mm Width)

Stock2,080
SPC5746CSK1MMH6
NXP

IC MCU 32BIT 3MB FLASH 100MAPBGA

Package: 100-LBGA

Stock7,476
DSPB56367AG150
NXP

IC DSP 24BIT 150MHZ 144-LQFP

Package: 144-LQFP

Stock55,932
X3T-OH048Z
NXP

IC MAGN FIELD SENSOR SGL DIE

Package: -

Stock3,258

Part Number	Manufacturer	Description	Package	Stock
PHD37N06LT,118	NXP	MOSFET N-CH 55V 37A DPAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 55V Current - Continuous Drain (Id) @ 25°C: 37A (Tc) Drive Voltage (Max Rds On, Min Rds On): 5V, 10V Vgs(th) (Max) @ Id: 2V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 22.5nC @ 5V Input Capacitance (Ciss) (Max) @ Vds: 1400pF @ 25V Vgs (Max): ±13V FET Feature: - Power Dissipation (Max): 100W (Tc) Rds On (Max) @ Id, Vgs: 32 mOhm @ 17A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Supplier Device Package: DPAK Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63	Package: TO-252-3, DPak (2 Leads + Tab), SC-63	Stock2,496
ON5257,215	NXP	MOSFET RF SOT23 TO-236AB Transistor Type: - Frequency: - Gain: - Voltage - Test: - Current Rating: - Noise Figure: - Current - Test: - Power - Output: - Voltage - Rated: - Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	Package: TO-236-3, SC-59, SOT-23-3	Stock6,720
MRFG35003NR5	NXP	FET RF 15V 3.55GHZ Transistor Type: pHEMT FET Frequency: 3.55GHz Gain: 11.5dB Voltage - Test: 12V Current Rating: - Noise Figure: - Current - Test: 55mA Power - Output: 3W Voltage - Rated: 15V Package / Case: PLD-1.5 Supplier Device Package: PLD-1.5	Package: PLD-1.5	Stock2,480
PMST5401,135	NXP	TRANS PNP 150V 0.3A SOT323 Transistor Type: PNP Current - Collector (Ic) (Max): 300mA Voltage - Collector Emitter Breakdown (Max): 150V Vce Saturation (Max) @ Ib, Ic: 500mV @ 5mA, 50mA Current - Collector Cutoff (Max): 50nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 5V Power - Max: 200mW Frequency - Transition: 300MHz Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: SC-70, SOT-323 Supplier Device Package: SOT-323-3	Package: SC-70, SOT-323	Stock7,888
NX5P2925CUKZ	NXP	IC LOAD SWITCH HI SD 2.5A 6WLCSP Switch Type: General Purpose Number of Outputs: 1 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: On/Off Voltage - Load: 0.8 V ~ 5.5 V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 2.5A Rds On (Typ): 18 mOhm Input Type: Non-Inverting Features: Load Discharge, Slew Rate Controlled Fault Protection: Reverse Current Operating Temperature: -40°C ~ 85°C (TA) Package / Case: 6-XFBGA, WLCSP Supplier Device Package: 6-WLCSP (0.87x1.37)	Package: 6-XFBGA, WLCSP	Stock3,952
SSTU32866EC/G,557	NXP	IC BUFFER 1.8V 25BIT SOT536-1 Logic Type: 1:1, 1:2 Configurable Registered Buffer with Parity Supply Voltage: 1.7 V ~ 1.9 V Number of Bits: 25, 14 Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 96-LFBGA Supplier Device Package: 96-LFBGA (13.5x5.5)	Package: 96-LFBGA	Stock2,640
74LVT32PW,112	NXP	IC GATE OR 4CH 2-INP 14-TSSOP Logic Type: OR Gate Number of Circuits: 4 Number of Inputs: 2 Features: - Voltage - Supply: 2.7 V ~ 3.6 V Current - Quiescent (Max): - Current - Output High, Low: 20mA, 32mA Logic Level - Low: 0.8V Logic Level - High: 2V Max Propagation Delay @ V, Max CL: 3.2ns @ 3.3V, 50pF Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Supplier Device Package: 14-TSSOP Package / Case: 14-TSSOP (0.173", 4.40mm Width)	Package: 14-TSSOP (0.173", 4.40mm Width)	Stock5,424
HEC4027BT,118	NXP	IC JK TYPE POS TRG DUAL 16SOIC Function: Set(Preset) and Reset Type: JK Type Output Type: Differential Number of Elements: 2 Number of Bits per Element: 1 Clock Frequency: 30MHz Max Propagation Delay @ V, Max CL: 60ns @ 15V, 50pF Trigger Type: Positive Edge Current - Output High, Low: - Voltage - Supply: 3 V ~ 15 V Current - Quiescent (Iq): 16µA Input Capacitance: - Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width)	Package: 16-SOIC (0.154", 3.90mm Width)	Stock7,056
74HCT191D,652	NXP	IC COUNTER UP/DOWN SYNC 16SOIC Logic Type: Binary Counter Direction: Up, Down Number of Elements: 1 Number of Bits per Element: 4 Reset: - Timing: Synchronous Count Rate: 39MHz Trigger Type: Positive Edge Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	Package: 16-SOIC (0.154", 3.90mm Width)	Stock5,952
74ALVCH16543DGG:11	NXP	IC TRANSCVR TRI-ST 16BIT 56SSOP Logic Type: Transceiver, Non-Inverting Number of Elements: 2 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 24mA, 24mA Voltage - Supply: 1.2 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 56-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 56-TSSOP	Package: 56-TFSOP (0.240", 6.10mm Width)	Stock3,280
SC16C652IB48,128	NXP	IC DUART 32BYTES 48LQFP Features: - Number of Channels: 2, DUART FIFO's: 32 Byte Protocol: - Data Rate (Max): 5Mbps Voltage - Supply: 2.5V, 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: - With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock5,856
MC92604VM	NXP	IC ETH TXRX DUAL GIG 196-MAPBGA Type: Transceiver Protocol: Gigabit Ethernet Number of Drivers/Receivers: 2/2 Duplex: Full Receiver Hysteresis: - Data Rate: 1Gbps Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: - Mounting Type: Surface Mount Package / Case: 196-LBGA Supplier Device Package: 196-MAPBGA (15x15)	Package: 196-LBGA	Stock4,128
KMPC8245LZU300D	NXP	IC MPU MPC82XX 300MHZ 352TBGA Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: - RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 352-LBGA Supplier Device Package: 352-TBGA (35x35)	Package: 352-LBGA	Stock6,432
MC68MH360VR33LR2	NXP	IC MPU M683XX 33MHZ 357BGA Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 33MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	Package: 357-BBGA	Stock6,624
SPC5673KFF0VMM1R	NXP	IC MCU 32BIT 1MB FLASH 257MAPBGA Core Processor: e200z7d Core Size: 32-Bit Speed: 150MHz Connectivity: CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V Data Converters: A/D 22x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 257-LFBGA Supplier Device Package: 257-MAPBGA (14x14)	Package: 257-LFBGA	Stock7,136
MC9S08DN16ACLF	NXP	IC MCU 8BIT 16KB FLASH 48LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock5,568
MC9S08PT8AVWJ	NXP	IC MCU 8BIT 8KB FLASH 20SOIC Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LIN, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 18 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SOIC	Package: 20-SOIC (0.295", 7.50mm Width)	Stock2,080
SPC5746CSK1MMH6	NXP	IC MCU 32BIT 3MB FLASH 100MAPBGA Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: - Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LBGA Supplier Device Package: 100-MAPBGA (11x11)	Package: 100-LBGA	Stock7,476
DSPB56367AG150	NXP	IC DSP 24BIT 150MHZ 144-LQFP Type: Audio Processor Interface: Host Interface, I2C, SAI, SPI Clock Rate: 150MHz Non-Volatile Memory: ROM (240 kB) On-Chip RAM: 69kB Voltage - I/O: 3.30V Voltage - Core: 1.80V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	Package: 144-LQFP	Stock55,932
X3T-OH048Z	NXP	IC MAGN FIELD SENSOR SGL DIE For Measuring: Angle Technology: Magnetoresistive Rotation Angle - Electrical, Mechanical: - Linear Range: - Output: Wheatstone Bridge Output Signal: - Actuator Type: External Magnet Not Included Linearity: - Resistance: 3.7 kOhms Resistance Tolerance: - Voltage - Supply: 5 V ~ 9 V Mounting Type: Bare Die Termination Style: - Operating Temperature: -40°C ~ 150°C	Package: -	Stock3,258
PCF7938XA/CAAB3800	NXP	IC TRANSPONDER IMMOBILIZER PLLMC Style: - Technology: - Frequency: - Memory Type: - Writable Memory: - Standards: - Operating Temperature: - Size / Dimension: -	Package: -	Stock6,912
SPC5606BF1VLU6R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 149 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 29x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	Package: 176-LQFP	Stock7,760
SPC5605BK0VLQ4R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 121 Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 15x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	Package: 144-LQFP	Stock7,488
FS32K144HNT0MLHR	NXP	S32K144 32-BIT MCU ARM Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP	Stock6,128
BB156-DG-B2	NXP	NO DESCRIPTION Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz Capacitance Ratio: 3.9 Capacitance Ratio Condition: C1/C7.5 Voltage - Peak Reverse (Max): 10 V Diode Type: Single Q @ Vr, F: - Operating Temperature: -55°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: SC-76, SOD-323 Supplier Device Package: SOD-323	Package: -	Request a Quote
LPC55S04JHI48EL	NXP	IC MCU 32BIT 128KB FLASH 48HVQFN Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 96MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 30 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 7x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	Package: -	Request a Quote
MIMX8DL1AVNFZBA	NXP	I.MX 8DUALXLITE A1 PRODUCTION PN Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: 388-LFBGA Supplier Device Package: 388-LBGA (15x15)	Package: -	Request a Quote
MC33FS8500A0KS	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Package: -	Request a Quote