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NXP |
MOSFET N-CH 150V 19A SOT685-1
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 150V
- Current - Continuous Drain (Id) @ 25°C: 19A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
- Vgs(th) (Max) @ Id: 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 26.4nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds: 1150pF @ 25V
- Vgs (Max): ±20V
- FET Feature: -
- Power Dissipation (Max): 62.5W (Tc)
- Rds On (Max) @ Id, Vgs: 75 mOhm @ 12A, 10V
- Operating Temperature: -55°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-HVSON (6x5)
- Package / Case: 8-VDFN Exposed Pad
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Package: 8-VDFN Exposed Pad |
Stock4,864 |
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NXP |
MOSFET N-CH 55V 17A TO220AB
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 55V
- Current - Continuous Drain (Id) @ 25°C: 17A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 10V
- Vgs(th) (Max) @ Id: 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 19nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds: 500pF @ 25V
- Vgs (Max): ±20V
- FET Feature: -
- Power Dissipation (Max): 45W (Tc)
- Rds On (Max) @ Id, Vgs: 70 mOhm @ 10A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Through Hole
- Supplier Device Package: TO-220AB
- Package / Case: TO-220-3
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Package: TO-220-3 |
Stock3,264 |
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NXP |
MOSFET P-CH 300V 0.17A SOT54
- FET Type: P-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 300V
- Current - Continuous Drain (Id) @ 25°C: 170mA (Ta)
- Drive Voltage (Max Rds On, Min Rds On): 10V
- Vgs(th) (Max) @ Id: 2.55V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: -
- Input Capacitance (Ciss) (Max) @ Vds: 90pF @ 25V
- Vgs (Max): ±20V
- FET Feature: -
- Power Dissipation (Max): 1W (Ta)
- Rds On (Max) @ Id, Vgs: 17 Ohm @ 170mA, 10V
- Operating Temperature: -65°C ~ 150°C (TJ)
- Mounting Type: Through Hole
- Supplier Device Package: TO-92-3
- Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
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Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) |
Stock2,800 |
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NXP |
TRANS PNP 80V 1A TO-92
- Transistor Type: PNP
- Current - Collector (Ic) (Max): 1A
- Voltage - Collector Emitter Breakdown (Max): 80V
- Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
- Current - Collector Cutoff (Max): 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
- Power - Max: 830mW
- Frequency - Transition: 145MHz
- Operating Temperature: 150°C (TJ)
- Mounting Type: Through Hole
- Package / Case: TO-226-3, TO-92-3 (TO-226AA)
- Supplier Device Package: TO-92-3
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Package: TO-226-3, TO-92-3 (TO-226AA) |
Stock2,336 |
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NXP |
IC MOTOR DRIVER PAR 24QFN
- Motor Type - Stepper: Bipolar
- Motor Type - AC, DC: Brushed DC
- Function: Driver - Fully Integrated, Control and Power Stage
- Output Configuration: Half Bridge (2)
- Interface: Parallel
- Technology: CMOS
- Step Resolution: -
- Applications: Battery Powered
- Current - Output: 1A
- Voltage - Supply: 2.7 V ~ 5.7 V
- Voltage - Load: 2 V ~ 6.8 V
- Operating Temperature: -20°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 24-VFQFN Exposed Pad
- Supplier Device Package: 24-QFN-EP (4x4)
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Package: 24-VFQFN Exposed Pad |
Stock3,936 |
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NXP |
IC LED DRIVER LIN DIM 28HTSSOP
- Type: Linear
- Topology: -
- Internal Switch(s): Yes
- Number of Outputs: 16
- Voltage - Supply (Min): 3V
- Voltage - Supply (Max): 5.5V
- Voltage - Output: 40V
- Current - Output / Channel: 57mA
- Frequency: -
- Dimming: PWM
- Applications: Backlight
- Operating Temperature: -20°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
- Supplier Device Package: 28-HTSSOP
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Package: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad |
Stock5,712 |
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NXP |
IC JK TYPE NEG TRG DUAL 16SOIC
- Function: Set(Preset) and Reset
- Type: JK Type
- Output Type: Differential
- Number of Elements: 2
- Number of Bits per Element: 1
- Clock Frequency: 100MHz
- Max Propagation Delay @ V, Max CL: 6.5ns @ 5V, 50pF
- Trigger Type: Negative Edge
- Current - Output High, Low: 1mA, 20mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Iq): 21mA
- Input Capacitance: -
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.154", 3.90mm Width)
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Package: 16-SOIC (0.154", 3.90mm Width) |
Stock4,320 |
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NXP |
IC BUFF DVR TRI-ST HEX 16DIP
- Logic Type: Buffer, Non-Inverting
- Number of Elements: 2
- Number of Bits per Element: 2, 4 (Hex)
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 8mA, 8mA
- Voltage - Supply: 1 V ~ 3.6 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Through Hole
- Package / Case: 16-DIP (0.300", 7.62mm)
- Supplier Device Package: 16-DIP
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Package: 16-DIP (0.300", 7.62mm) |
Stock3,552 |
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NXP |
IC DEMOD DUAL W/RX 64-HVQFN
- Type: Demodulator
- Applications: Set-Top Boxes
- Mounting Type: Surface Mount
- Package / Case: 64-VFQFN Dual Rows Exposed Pad
- Supplier Device Package: 64-HVQFN (9x9)
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Package: 64-VFQFN Dual Rows Exposed Pad |
Stock6,416 |
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NXP |
IC USB HOST CTLR 12X2QFN
- Protocol: USB
- Function: Controller
- Interface: USB
- Standards: -
- Voltage - Supply: 2.7 V ~ 5.5 V
- Current - Supply: -
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 12-XFQFN
- Supplier Device Package: 12-X2QFN (1.6x1.6)
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Package: 12-XFQFN |
Stock2,096 |
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NXP |
IC MPU MPC8XX 133MHZ 357BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 133MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (2), 10/100 Mbps (2)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BBGA |
Stock2,800 |
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NXP |
IC MCU 32BIT 128KB FLASH 80LQFP
- Core Processor: Coldfire V1
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: CAN, EBI/EMI, I2C, SCI, SPI, USB OTG
- Peripherals: LVD, PWM, WDT
- Number of I/O: 47
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
- Data Converters: A/D 12x12b, D/A 1x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 80-LQFP
- Supplier Device Package: 80-LQFP (12x12)
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Package: 80-LQFP |
Stock6,256 |
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NXP |
IC MCU 8BIT 16KB FLASH 32LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: I2C, LIN, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 28
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 256 x 8
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 12x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock2,100,000 |
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NXP |
IC MCU 32BIT 16KB FLASH 48LQFP
- Core Processor: ARM? Cortex?-M0+
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
- Number of I/O: 41
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 14x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock9,024 |
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NXP |
TVS DIODE 5.5VWM 6TSOP
- Type: Steering (Rail to Rail)
- Unidirectional Channels: 4
- Bidirectional Channels: -
- Voltage - Reverse Standoff (Typ): 5.5V (Max)
- Voltage - Breakdown (Min): 6V
- Voltage - Clamping (Max) @ Ipp: -
- Current - Peak Pulse (10/1000µs): -
- Power - Peak Pulse: -
- Power Line Protection: Yes
- Applications: General Purpose
- Capacitance @ Frequency: 1pF @ 1MHz
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: SC-74, SOT-457
- Supplier Device Package: 6-TSOP
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Package: SC-74, SOT-457 |
Stock3,636 |
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NXP |
IC PRESSURE SENSOR ABS 6-SIP
- Pressure Type: Absolute
- Operating Pressure: 2.18 PSI ~ 101.53 PSI (15 kPa ~ 700 kPa)
- Output Type: Analog Voltage
- Output: 0.2 V ~ 4.7 V
- Accuracy: ±2.5%
- Voltage - Supply: 4.75 V ~ 5.25 V
- Port Size: Male - 0.19" (4.93mm) Tube
- Port Style: Barbed
- Features: Temperature Compensated
- Termination Style: PCB
- Maximum Pressure: 406.11 PSI (2800 kPa)
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 6-SIP Module
- Supplier Device Package: -
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Package: 6-SIP Module |
Stock2,000 |
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NXP |
SENSOR PRESSURE VACUUM -16.68PSI
- Pressure Type: Vacuum
- Operating Pressure: -16.68 PSI (-115 kPa)
- Output Type: Analog Voltage
- Output: 0.2 V ~ 4.6 V
- Accuracy: ±1.5%
- Voltage - Supply: 4.75 V ~ 5.25 V
- Port Size: Male - 0.13" (3.17mm) Tube
- Port Style: No Port
- Features: Temperature Compensated
- Termination Style: PCB
- Maximum Pressure: -58.02 PSI (-400 kPa)
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-SMD, Gull Wing, Top Port
- Supplier Device Package: -
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Package: 8-SMD, Gull Wing, Top Port |
Stock19,818 |
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NXP |
ACCELEROMETER 10BIT SPI 16QFN
- Type: -
- Axis: -
- Acceleration Range: -
- Sensitivity (LSB/g): -
- Sensitivity (mV/g): -
- Bandwidth: -
- Output Type: -
- Voltage - Supply: -
- Features: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock4,716 |
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NXP |
FIVE- PORTS AVB & TSN AUTOMOTIVE
- Protocol: Ethernet
- Function: Switch
- Interface: SPI
- Standards: IEEE 802.3
- Voltage - Supply: 1.65 V ~ 3.6 V
- Current - Supply: 3.5mA
- Operating Temperature: -40°C ~ 125°C (TJ)
- Package / Case: 159-LFBGA
- Supplier Device Package: 159-LFBGA (12x12)
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Package: 159-LFBGA |
Stock4,656 |
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NXP |
H-BRIDGE SPI BRUSHED DC MOTOR
- Output Configuration: -
- Applications: -
- Interface: -
- Load Type: -
- Technology: -
- Rds On (Typ): -
- Current - Output / Channel: -
- Current - Peak Output: -
- Voltage - Supply: -
- Voltage - Load: -
- Operating Temperature: -
- Features: -
- Fault Protection: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock2,096 |
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NXP |
IC MCU 16BIT FLASH
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CANbus, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 31
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
- Data Converters: A/D 9x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP Exposed Pad
- Supplier Device Package: 64-LQFP-EP (10x10)
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Package: 64-LQFP Exposed Pad |
Stock4,320 |
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NXP |
NXP 32-BIT MCU DUAL POWER ARCH
- Core Processor: e200z4d, e200z0h
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz/120MHz
- Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 199
- Program Memory Size: 1.5MB (1.5M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 192K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 33x10b, 10x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 256-LBGA
- Supplier Device Package: 256-MAPBGA
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Package: 256-LBGA |
Stock3,984 |
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NXP |
16-BIT MCU S12X CORE 512KB FLA
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 119
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 24x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock6,480 |
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NXP |
NXP 32-BIT MCU POWER ARCH CORE
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 45
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 24K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock7,248 |
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NXP |
S32K144 32-BIT MCU ARM CORTEX-M
- Core Processor: ARM® Cortex®-M4F
- Core Size: 32-Bit
- Speed: 80MHz
- Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b, D/A 1x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: 100-LQFP |
Stock2,000 |
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NXP |
IC REG LINEAR FIXED LDO REG
- Output Configuration: Positive
- Output Type: Fixed
- Number of Regulators: 1
- Voltage - Input (Max): 5.5V
- Voltage - Output (Min/Fixed): 2.8V
- Voltage - Output (Max): -
- Voltage Dropout (Max): 0.075V @ 150mA
- Current - Output: 150mA
- Current - Quiescent (Iq): 100 µA
- Current - Supply (Max): 250 µA
- PSRR: 55dB (1kHz)
- Control Features: Enable
- Protection Features: Over Current, Over Temperature, Transient Voltage
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 4-UFBGA, WLCSP
- Supplier Device Package: 4-WLCSP (0.76x0.76)
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Package: - |
Request a Quote |
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NXP |
S12Z CPU, 128K FLASH
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
K4W1 HVQFN48
- Core Processor: ARM® Cortex®-M33
- Core Size: 32-Bit
- Speed: 96MHz
- Connectivity: CANbus, HMI, I2C, SPI, UART/USART
- Peripherals: DMA, PWM, WDT
- Number of I/O: 29
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
- Data Converters: A/D 14x16b SAR
- Oscillator Type: -
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-HVQFN (7x7)
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Package: - |
Request a Quote |
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