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NXP |
MOSFET N-CH 30V 78A LFPAK
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 30V
- Current - Continuous Drain (Id) @ 25°C: 78A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
- Vgs(th) (Max) @ Id: 2.15V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 21.3nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds: 1226pF @ 15V
- Vgs (Max): ±20V
- FET Feature: -
- Power Dissipation (Max): 63W (Tc)
- Rds On (Max) @ Id, Vgs: 6.1 mOhm @ 20A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Surface Mount
- Supplier Device Package: LFPAK56, Power-SO8
- Package / Case: SC-100, SOT-669
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Package: SC-100, SOT-669 |
Stock4,224 |
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NXP |
DIODE ZENER TO-236AB SOT23
- Voltage - Zener (Nom) (Vz): 12V
- Tolerance: ±2%
- Power - Max: 250mW
- Impedance (Max) (Zzt): 30 Ohms
- Current - Reverse Leakage @ Vr: 100nA @ 8V
- Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
- Operating Temperature: -65°C ~ 150°C
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: TO-236AB (SOT23)
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock4,736 |
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NXP |
IC MOTOR DRIVER PAR 24QFN
- Motor Type - Stepper: Bipolar
- Motor Type - AC, DC: Brushed DC
- Function: Driver - Fully Integrated, Control and Power Stage
- Output Configuration: Half Bridge (2)
- Interface: Parallel
- Technology: CMOS
- Step Resolution: -
- Applications: Battery Powered
- Current - Output: 1A
- Voltage - Supply: 2.7 V ~ 5.7 V
- Voltage - Load: 2 V ~ 6.8 V
- Operating Temperature: -20°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 24-VFQFN Exposed Pad
- Supplier Device Package: 24-QFN-EP (4x4)
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Package: 24-VFQFN Exposed Pad |
Stock3,664 |
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NXP |
IC SYNC 4BIT BIN COUNTER 16TSSOP
- Logic Type: Binary Counter
- Direction: Up, Down
- Number of Elements: 1
- Number of Bits per Element: 4
- Reset: -
- Timing: Synchronous
- Count Rate: 150MHz
- Trigger Type: Positive Edge
- Voltage - Supply: 2.7 V ~ 3.6 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
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Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock2,688 |
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NXP |
IC BUFF DVR TRI-ST 16BIT 48TSSOP
- Logic Type: Buffer, Inverting
- Number of Elements: 4
- Number of Bits per Element: 4
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 32mA, 64mA
- Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-TFSOP (0.240", 6.10mm Width)
- Supplier Device Package: 48-TSSOP
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Package: 48-TFSOP (0.240", 6.10mm Width) |
Stock3,664 |
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NXP |
IC BUFF/DVR TRI-ST DUAL 20SSOP
- Logic Type: Buffer, Non-Inverting
- Number of Elements: 2
- Number of Bits per Element: 4
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 15mA, 64mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-SSOP (0.209", 5.30mm Width)
- Supplier Device Package: 20-SSOP
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Package: 20-SSOP (0.209", 5.30mm Width) |
Stock4,448 |
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NXP |
IC MPU MPC85XX 1.0GHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: Security; SEC
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: SATA 3Gbps (1)
- USB: USB 2.0 (2)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock3,360 |
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NXP |
IC MPU MPC86XX 1.5GHZ 1023FCCBGA
- Core Processor: PowerPC e600
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.5GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 1023-BCBGA, FCCBGA
- Supplier Device Package: 1023-FCCBGA (33x33)
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Package: 1023-BCBGA, FCCBGA |
Stock2,896 |
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NXP |
IC MPU M680X0 33MHZ 184CQFP
- Core Processor: 68040
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 33MHz
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 5.0V
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: -
- Package / Case: 184-BCQFP
- Supplier Device Package: 184-CQFP (31.3x31.3)
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Package: 184-BCQFP |
Stock2,112 |
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NXP |
IC MPU MPC85XX 533MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 533MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DDR, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock3,664 |
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NXP |
IC SOC 4CORE 1400MHZ 780FCBGA
- Core Processor: PowerPC e5500
- Number of Cores/Bus Width: 4 Core, 64-Bit
- Speed: 1.4GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3L/4
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 1 Gbps (5)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
- Package / Case: 780-FBGA, FCBGA
- Supplier Device Package: 780-FCPBGA (23x23)
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Package: 780-FBGA, FCBGA |
Stock7,896 |
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NXP |
IC MCU 16BIT 32KB FLASH 80QFP
- Core Processor: CPU16
- Core Size: 16-Bit
- Speed: 16MHz
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
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Package: 80-QFP |
Stock7,600 |
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NXP |
IC MCU 32BIT 1MB FLASH 388BGA
- Core Processor: PowerPC
- Core Size: 32-Bit
- Speed: 40MHz
- Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: 56
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 36K x 8
- Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V
- Data Converters: A/D 40x10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 388-BBGA
- Supplier Device Package: 388-PBGA (27x27)
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Package: 388-BBGA |
Stock2,528 |
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NXP |
IC MCU 16BIT 512KB FLASH 144LQFP
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 119
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 24x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock4,880 |
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NXP |
IC MCU 32BIT ROMLESS 180TFBGA
- Core Processor: ARM? Cortex?-M3
- Core Size: 32-Bit
- Speed: 180MHz
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
- Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
- Number of I/O: 118
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 200K x 8
- Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
- Data Converters: A/D 8x10b; D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 180-TFBGA
- Supplier Device Package: 180-TFBGA (12x12)
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Package: 180-TFBGA |
Stock3,600 |
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NXP |
IC MCU 8BIT 8KB FLASH 20TSSOP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I2C, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 16
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 256 x 8
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 12x10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 20-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 20-TSSOP
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Package: 20-TSSOP (0.173", 4.40mm Width) |
Stock7,456 |
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NXP |
IC MCU 32BIT 64KB FLASH 32LQFP
- Core Processor: ARM? Cortex?-M0+
- Core Size: 32-Bit
- Speed: 40MHz
- Connectivity: I2C, LIN, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 28
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 256 x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock3,424 |
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NXP |
IC MCU 32BIT 32KB FLASH 64LQFP
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 40
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 13x16b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock7,744 |
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NXP |
IC OCTUPLE DAC 6BIT 12V 16-SOIC
- Number of Bits: 6
- Number of D/A Converters: 6
- Settling Time: -
- Output Type: Voltage - Buffered
- Differential Output: No
- Data Interface: I2C
- Reference Type: External
- Voltage - Supply, Analog: 4.5 V ~ 13.2 V
- Voltage - Supply, Digital: 4.5 V ~ 13.2 V
- INL/DNL (LSB): ±0.5 (Max), ±0.5 (Max)
- Architecture: -
- Operating Temperature: -20°C ~ 70°C
- Package / Case: 16-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 16-SO
- Mounting Type: -
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Package: 16-SOIC (0.295", 7.50mm Width) |
Stock17,604 |
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NXP |
IC TRPL 8BIT VIDEO ADC 144LQFP
- Type: ADC, Video
- Number of Channels: -
- Resolution (Bits): 8 b
- Sampling Rate (Per Second): 210M
- Data Interface: Serial
- Voltage Supply Source: Analog and Digital
- Voltage - Supply: 3 V ~ 3.6 V
- Operating Temperature: -10°C ~ 70°C
- Mounting Type: Surface Mount
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock4,896 |
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NXP |
TRANSPONDER RFIC HITAG S UNCASED
- Type: RFID Transponder
- Frequency: 100kHz ~ 150kHz
- Standards: -
- Interface: -
- Voltage - Supply: 3.5V
- Operating Temperature: -25°C ~ 85°C
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock4,518 |
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NXP |
IC CAR RADIO TUNER 80-LQFP
- Frequency: -
- Sensitivity: -
- Data Rate (Max): -
- Modulation or Protocol: AM, FM, WB
- Applications: AM/FM Radio Receiver
- Current - Receiving: -
- Data Interface: PCB, Surface Mount
- Memory Size: -
- Antenna Connector: PCB, Surface Mount
- Features: -
- Voltage - Supply: 5V, 8.5V
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 80-LQFP
- Supplier Device Package: 80-LQFP (12x12)
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Package: 80-LQFP |
Stock7,344 |
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NXP |
RF EVAL FOR BGA6130
- Type: Amplifier
- Frequency: 400MHz ~ 2.7GHz
- For Use With/Related Products: BGA6130
- Supplied Contents: 2 Boards
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Package: - |
Stock6,498 |
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NXP |
NXP 32-BIT MCU POWER ARCH CORE
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 64MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 149
- Program Memory Size: 1.5MB (1.5M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 96K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 29x10b, 5x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
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Package: 176-LQFP |
Stock6,592 |
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NXP |
8-BIT MCU S08 CORE 4KB FLASH
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 16MHz
- Connectivity: -
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 4
- Program Memory Size: 4KB (4K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 256 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 4x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SOIC
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock4,800 |
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NXP |
SAF7770EL
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 364-LFBGA
- Supplier Device Package: 364-LFBGA (15x15)
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Package: - |
Request a Quote |
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NXP |
IC MCU 16BIT 32KB FLASH 32LQFP
- Core Processor: S12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: IrDA, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 26
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 1K x 8
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: - |
Request a Quote |
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NXP |
IC
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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