Page 879 - NXP Products | Heisener Electronics

BUK9509-75A,127
NXP

MOSFET N-CH 75V 75A TO220AB

Package: TO-220-3

Stock2,800
BZX84-C4V7/LF1R
NXP

DIODE ZENER TO-236AB SOT23

Package: TO-236-3, SC-59, SOT-23-3

Stock2,208
MC33879APEK
NXP

IC SW SERIAL OCTAL 32SOIC

Package: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

Stock14,844
HEF4047BP,652
NXP

IC MONO/ASTBL MULTVIBRTR 14-DIP

Package: 14-DIP (0.300", 7.62mm)

Stock4,928
SA5234D,518
NXP

IC OPAMP GP 2.5MHZ RRO 14SO

Package: 14-SOIC (0.154", 3.90mm Width)

Stock6,640
TFA9843J/N1,112
NXP

IC AMP AUDIO PWR 29W STER 9SIL

Package: 9-SIP Exposed Tab, Formed Leads

Stock5,840
PCA9574HR,115
NXP

IC I/O EXPANDER I2C 8B 16HXQFN

Package: 16-XFQFN Exposed Pad

Stock3,952
P1010PSN5DFA
NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA1

Package: 425-FBGA

Stock6,096
MPC8572ECLPXAULD
NXP

IC MPU MPC85XX 1.333GHZ 1023BGA

Package: 1023-BFBGA, FCBGA

Stock7,056
MPC8378VRANG
NXP

IC MPU MPC83XX 800MHZ 689TEBGA

Package: 689-BBGA Exposed Pad

Stock4,672
KMPC8271ZQTMFA
NXP

IC MPU MPC82XX 400MHZ 516BGA

Package: 516-BBGA

Stock4,640
S912ZVMC64F1MKHR
NXP

IC MCU 16BIT 64KB FLASH 64LQFP

Package: 64-LQFP Exposed Pad

Stock4,432
MC908JK8CDWE
NXP

IC MCU 8BIT 8KB FLASH 20SOIC

Package: 20-SOIC (0.295", 7.50mm Width)

Stock452,256
S912XET256W0MAA
NXP

IC MCU 16BIT 256KB FLASH 80QFP

Package: 80-QFP

Stock4,624
SPC5604BF2CLL6
NXP

IC MCU 32BIT 512KB FLASH 100LQFP

Package: 100-LQFP

Stock7,440
PCK2111BD,157
NXP

IC CLK BUFFER 2:10 800MHZ 32LQFP

Package: 32-LQFP

Stock7,936
MMA5212NPKGWR2
NXP

ACCELEROMETER PSI5 16QFN

Package: -

Stock16,752
MF1S7001XDUD/V1V
NXP

MIFARE CLASSIC SMART CARD IC

Package: Die

Stock7,308
MC32PF3000A8EPR2
NXP

POWER MANAGEMENT IC I.MX7 PRE-

Package: 48-VFQFN Exposed Pad

Stock4,752
SAF7730HV/N231D,51
NXP

IC HD RADIO PROCESSOR 144HLQFP

Package: 144-LQFP Exposed Pad

Stock6,032

Part Number	Manufacturer	Description	Package	Stock
BUK9509-75A,127	NXP	MOSFET N-CH 75V 75A TO220AB FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 75V Current - Continuous Drain (Id) @ 25°C: 75A (Tj) Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs(th) (Max) @ Id: 2V @ 1mA Gate Charge (Qg) (Max) @ Vgs: - Input Capacitance (Ciss) (Max) @ Vds: 8840pF @ 25V Vgs (Max): ±10V FET Feature: - Power Dissipation (Max): 230W (Tc) Rds On (Max) @ Id, Vgs: 8.5 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-220AB Package / Case: TO-220-3	Package: TO-220-3	Stock2,800
BZX84-C4V7/LF1R	NXP	DIODE ZENER TO-236AB SOT23 Voltage - Zener (Nom) (Vz): 4.7V Tolerance: ±5% Power - Max: 250mW Impedance (Max) (Zzt): 80 Ohms Current - Reverse Leakage @ Vr: 3µA @ 2V Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	Package: TO-236-3, SC-59, SOT-23-3	Stock2,208
MC33879APEK	NXP	IC SW SERIAL OCTAL 32SOIC Switch Type: General Purpose Number of Outputs: 8 Ratio - Input:Output: 1:4 Output Configuration: High Side or Low Side Output Type: N-Channel Interface: SPI Voltage - Load: 5.5 V ~ 27.5 V Voltage - Supply (Vcc/Vdd): 3.1 V ~ 5.5 V Current - Output (Max): 600mA Rds On (Typ): 750 mOhm Input Type: - Features: - Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP	Package: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad	Stock14,844
HEF4047BP,652	NXP	IC MONO/ASTBL MULTVIBRTR 14-DIP Logic Type: Astable, Monostable Independent Circuits: 1 Schmitt Trigger Input: No Propagation Delay: 50ns Current - Output High, Low: - Voltage - Supply: 4.5 V ~ 15.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Through Hole Package / Case: 14-DIP (0.300", 7.62mm) Supplier Device Package: 14-DIP	Package: 14-DIP (0.300", 7.62mm)	Stock4,928
SA5234D,518	NXP	IC OPAMP GP 2.5MHZ RRO 14SO Amplifier Type: General Purpose Number of Circuits: 4 Output Type: Rail-to-Rail Slew Rate: 0.8 V/µs Gain Bandwidth Product: - -3db Bandwidth: 2.5MHz Current - Input Bias: 90nA Voltage - Input Offset: 200µV Current - Supply: 2.8mA Current - Output / Channel: 12mA Voltage - Supply, Single/Dual (±): 2 V ~ 5.5 V, ±1 V ~ 2.75 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	Package: 14-SOIC (0.154", 3.90mm Width)	Stock6,640
TFA9843J/N1,112	NXP	IC AMP AUDIO PWR 29W STER 9SIL Type: Class AB Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Max Output Power x Channels @ Load: 29W x 1 @ 8 Ohm; 14W x 2 @ 4 Ohm Voltage - Supply: 9 V ~ 26 V Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Through Hole Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 9-PDBS-EP Package / Case: 9-SIP Exposed Tab, Formed Leads	Package: 9-SIP Exposed Tab, Formed Leads	Stock5,840
PCA9574HR,115	NXP	IC I/O EXPANDER I2C 8B 16HXQFN Number of I/O: 8 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 1mA, 3mA Clock Frequency: 400kHz Voltage - Supply: 1.1 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-XFQFN Exposed Pad Supplier Device Package: 16-UHXQFN (2x2)	Package: 16-XFQFN Exposed Pad	Stock3,952
P1010PSN5DFA	NXP	IC MPU Q OR IQ 1.0GHZ 425TEBGA1 Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 425-FBGA Supplier Device Package: 425-TEPBGA1	Package: 425-FBGA	Stock6,096
MPC8572ECLPXAULD	NXP	IC MPU MPC85XX 1.333GHZ 1023BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.333GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 1023-BFBGA, FCBGA Supplier Device Package: 1023-FCPBGA (33x33)	Package: 1023-BFBGA, FCBGA	Stock7,056
MPC8378VRANG	NXP	IC MPU MPC83XX 800MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	Package: 689-BBGA Exposed Pad	Stock4,672
KMPC8271ZQTMFA	NXP	IC MPU MPC82XX 400MHZ 516BGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	Package: 516-BBGA	Stock4,640
S912ZVMC64F1MKHR	NXP	IC MCU 16BIT 64KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	Package: 64-LQFP Exposed Pad	Stock4,432
MC908JK8CDWE	NXP	IC MCU 8BIT 8KB FLASH 20SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI Peripherals: LED, LVD, POR, PWM Number of I/O: 15 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 13x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SOIC	Package: 20-SOIC (0.295", 7.50mm Width)	Stock452,256
S912XET256W0MAA	NXP	IC MCU 16BIT 256KB FLASH 80QFP Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	Package: 80-QFP	Stock4,624
SPC5604BF2CLL6	NXP	IC MCU 32BIT 512KB FLASH 100LQFP Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 16 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 28x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock7,440
PCK2111BD,157	NXP	IC CLK BUFFER 2:10 800MHZ 32LQFP Type: Fanout Buffer (Distribution), Multiplexer Number of Circuits: 1 Ratio - Input:Output: 2:10 Differential - Input:Output: Yes/Yes Input: LVDS Output: LVDS Frequency - Max: 800MHz Voltage - Supply: 2.375 V ~ 2.625 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	Package: 32-LQFP	Stock7,936
MMA5212NPKGWR2	NXP	ACCELEROMETER PSI5 16QFN Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock16,752
MF1S7001XDUD/V1V	NXP	MIFARE CLASSIC SMART CARD IC Type: RFID Transponder Frequency: 13.56MHz Standards: ISO 14443 Interface: UART Voltage - Supply: - Operating Temperature: -25°C ~ 70°C Package / Case: Die Supplier Device Package: Die	Package: Die	Stock7,308
MC32PF3000A8EPR2	NXP	POWER MANAGEMENT IC I.MX7 PRE- Applications: i.MX Processors Current - Supply: - Voltage - Supply: 2.8 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	Package: 48-VFQFN Exposed Pad	Stock4,752
SAF7730HV/N231D,51	NXP	IC HD RADIO PROCESSOR 144HLQFP Type: Car Signal Processor Interface: - Clock Rate: 400MHz Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-HLQFP (20x20)	Package: 144-LQFP Exposed Pad	Stock6,032
MCIMX6Z0DVM09AB	NXP	IC MPU I.MX6ULZ 900MHZ 196MAPBGA Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 900MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Keypad Ethernet: - SATA: - USB: USB 2.0 OTG + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Package / Case: 289-LFBGA Supplier Device Package: 289-MAPBGA (14x14)	Package: 289-LFBGA	Stock8,640
MKW35A512VFP4	NXP	KINETIS W 32-BIT MCU ARM CORTEX- Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: 40-QFN Supplier Device Package: -	Package: 40-QFN	Stock9,228
FS32K144MAT0VLHR	NXP	S32K144 32-BIT MCU ARM Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP	Stock7,072
SE050B2HQ1/Z01SFZ	NXP	RSA AES DES QFN20 Type: IoT Secure Element Applications: Industry 4.0 Mounting Type: Surface Mount Package / Case: 20-XFQFN Exposed Pad Supplier Device Package: 20-HX2QFN (3x3)	Package: 20-XFQFN Exposed Pad	Stock4,992
MC9S08PL16SCTG	NXP	IC MCU 8BIT 16KB FLASH 16TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: LINbus, SCI, UART/USART Peripherals: LVD, POR, PWM Number of I/O: 14 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 8x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	Package: -	Stock720
NXH3675UK-A2Z	NXP	IC Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
S32K314EHT1VMMST	NXP	S32K314 ARM CORTEX-M7, 160 MHZ, Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Speed: 160MHz Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART Peripherals: DMA, I2S, Serial Audio, WDT Number of I/O: 218 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 257-LFBGA Supplier Device Package: 257-LFBGA (14x14)	Package: -	Request a Quote
S9S12GN48J0CLF	NXP	S12 CORE,48K FLASH,AU Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 1.5K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: -	Request a Quote