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NXP |
FET RF 15V 3.55GHZ 1.5-PLD
- Transistor Type: pHEMT FET
- Frequency: 3.55GHz
- Gain: 10dB
- Voltage - Test: 12V
- Current Rating: -
- Noise Figure: -
- Current - Test: 180mA
- Power - Output: 9W
- Voltage - Rated: 15V
- Package / Case: PLD-1.5
- Supplier Device Package: PLD-1.5
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Package: PLD-1.5 |
Stock36,000 |
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NXP |
IC DBUS MASTER DUAL DIFF 16-SOIC
- Type: -
- Applications: -
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 16-SOIC
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Package: 16-SOIC (0.295", 7.50mm Width) |
Stock24,000 |
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NXP |
IC TRANSP LATCH OCTAL 3ST 20DIP
- Logic Type: D-Type Transparent Latch
- Circuit: 8:8
- Output Type: Tri-State
- Voltage - Supply: 4.5 V ~ 5.5 V
- Independent Circuits: 1
- Delay Time - Propagation: 3.5ns
- Current - Output High, Low: 3mA, 24mA
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Through Hole
- Package / Case: 20-DIP (0.300", 7.62mm)
- Supplier Device Package: 20-DIP
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Package: 20-DIP (0.300", 7.62mm) |
Stock5,232 |
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NXP |
IC HDMI TRANSMITTER 64-TFBGA
- Type: HDMI Transmitter
- Applications: Mobile Phones, Cellular, Video Displays
- Mounting Type: Surface Mount
- Package / Case: 64-TFBGA
- Supplier Device Package: 64-TFBGA (4.5x4.5)
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Package: 64-TFBGA |
Stock4,848 |
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NXP |
IC AMP AUDIO PWR 6W STER B 9SIL
- Type: Class B
- Output Type: 2-Channel (Stereo)
- Max Output Power x Channels @ Load: 6W x 2 @ 4 Ohm
- Voltage - Supply: 6 V ~ 18 V
- Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
- Mounting Type: Through Hole
- Operating Temperature: -
- Supplier Device Package: 9-SIL MPF
- Package / Case: 9-SIP Exposed Tab
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Package: 9-SIP Exposed Tab |
Stock4,144 |
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NXP |
IC UART DUAL W/FIFO 36TFBGA
- Features: -
- Number of Channels: 2, DUART
- FIFO's: 128 Byte
- Protocol: RS485
- Data Rate (Max): 5Mbps
- Voltage - Supply: 1.8V
- With Auto Flow Control: Yes
- With IrDA Encoder/Decoder: Yes
- With False Start Bit Detection: Yes
- With Modem Control: Yes
- Mounting Type: Surface Mount
- Package / Case: 36-TFBGA
- Supplier Device Package: 36-TFBGA (3.5x3.5)
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Package: 36-TFBGA |
Stock6,528 |
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NXP |
IC LIN TRANSCEIVER 8-SO
- Type: Transceiver
- Protocol: LIN
- Number of Drivers/Receivers: 1/1
- Duplex: Full
- Receiver Hysteresis: 200mV
- Data Rate: -
- Voltage - Supply: 5.5 V ~ 28 V
- Operating Temperature: -40°C ~ 150°C
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock4,480 |
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NXP |
IC MPU I.MX53 800MHZ 529TEBGA
- Core Processor: ARM? Cortex?-A8
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Multimedia; NEON? SIMD
- RAM Controllers: LPDDR2, DDR2, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100 Mbps (1)
- SATA: SATA 1.5Gbps (1)
- USB: USB 2.0 (2), USB 2.0 + PHY (2)
- Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 529-FBGA
- Supplier Device Package: -
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Package: 529-FBGA |
Stock3,744 |
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NXP |
IC MPU MPC83XX 333MHZ 516BGA
- Core Processor: PowerPC e300c3
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 333MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 + PHY (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 516-BBGA Exposed Pad
- Supplier Device Package: 516-TEPBGA (27x27)
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Package: 516-BBGA Exposed Pad |
Stock5,728 |
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NXP |
IC MPU MPC83XX 533MHZ 740TBGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 533MHz
- Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (1)
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 740-LBGA
- Supplier Device Package: 740-TBGA (37.5x37.5)
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Package: 740-LBGA |
Stock6,336 |
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NXP |
IC MPU MPC83XX 266MHZ 620BGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 266MHz
- Co-Processors/DSP: Security; SEC
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (3)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 620-BBGA Exposed Pad
- Supplier Device Package: 620-PBGA (29x29)
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Package: 620-BBGA Exposed Pad |
Stock2,368 |
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NXP |
IC MPU MPC82XX 400MHZ 516BGA
- Core Processor: PowerPC G2_LE
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: Communications; RISC CPM, Security; SEC
- RAM Controllers: DRAM, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (2)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 516-BBGA
- Supplier Device Package: 516-FPBGA (27x27)
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Package: 516-BBGA |
Stock5,440 |
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NXP |
IC MCU 32BIT 256KB FLASH 81BGA
- Core Processor: Coldfire V2
- Core Size: 32-Bit
- Speed: 80MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: DMA, LVD, POR, PWM, WDT
- Number of I/O: 56
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 8x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 81-LBGA
- Supplier Device Package: 81-MAPBGA (10x10)
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Package: 81-LBGA |
Stock6,048 |
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NXP |
IC MCU 8BIT 7.5KB FLASH 28SOIC
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: SCI, SPI
- Peripherals: LVD, POR, PWM
- Number of I/O: 17
- Program Memory Size: 7.5KB (7.5K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 384 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 6x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 28-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 28-SOIC
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Package: 28-SOIC (0.295", 7.50mm Width) |
Stock7,840 |
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NXP |
IC MCU 8BIT 4KB FLASH 28SOIC
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: -
- Peripherals: LED, LVD, POR, PWM
- Number of I/O: 23
- Program Memory Size: 4KB (4K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V
- Data Converters: A/D 12x8b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 28-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 28-SOIC
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Package: 28-SOIC (0.295", 7.50mm Width) |
Stock53,076 |
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NXP |
IC MCU 32BIT 512KB FLASH 121BGA
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 78
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 27x16b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 121-LFBGA
- Supplier Device Package: 121-MAPBGA (8x8)
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Package: 121-LFBGA |
Stock7,212 |
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NXP |
IC MCU 32BIT 128KB FLASH 48LQFP
- Core Processor: ARM7?
- Core Size: 16/32-Bit
- Speed: 60MHz
- Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: 32
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock13,344 |
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NXP |
IC DSP 24BIT 196-MAPBGA
- Type: Fixed Point
- Interface: Host Interface, SSI, SCI
- Clock Rate: 275MHz
- Non-Volatile Memory: ROM (576 B)
- On-Chip RAM: 576kB
- Voltage - I/O: 3.30V
- Voltage - Core: 1.60V
- Operating Temperature: -40°C ~ 105°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 196-BGA
- Supplier Device Package: 196-MAPBGA (15x15)
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Package: 196-BGA |
Stock3,232 |
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NXP |
IC TUNER 1CHIP RADIO DSP 32HVQFN
- Frequency: -
- Sensitivity: -
- Data Rate (Max): -
- Modulation or Protocol: AM, FM
- Applications: -
- Current - Receiving: 37mA
- Data Interface: -
- Memory Size: -
- Antenna Connector: -
- Features: -
- Voltage - Supply: 3.3V
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-HVQFN (5x5)
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Package: 32-VFQFN Exposed Pad |
Stock4,230 |
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NXP |
IC POWER AMP CLASS D I2C 36HSOP
- Type: Class D
- Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
- Max Output Power x Channels @ Load: 250W x 1 @ 2 Ohm; 135W x 2 @ 4 Ohm
- Voltage - Supply: 8 V ~ 35 V
- Features: Depop, Differential Inputs, I²C, Mute, Short-Circuit and Thermal Protection
- Mounting Type: -
- Operating Temperature: -
- Supplier Device Package: -
- Package / Case: -
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Package: - |
Stock2,000 |
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NXP |
DUAL CORE 6M FLASH 768K RAM F
- Core Processor: e200z2, e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz/160MHz
- Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: 129
- Program Memory Size: 6MB (6M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 768K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 80x10b, 64x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP Exposed Pad
- Supplier Device Package: 176-LQFP (24x24)
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Package: 176-LQFP Exposed Pad |
Stock6,768 |
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NXP |
16-BIT MCU S12X CORE 384KB FLA
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 59
- Program Memory Size: 384KB (384K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 24K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 8x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
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Package: 80-QFP |
Stock5,664 |
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NXP |
KINETIS KE02: 40MHZ CORTEX-M0+ 5
- Core Processor: ARM® Cortex®-M0+
- Core Size: 32-Bit
- Speed: 40MHz
- Connectivity: I²C, SPI, UART/USART
- Peripherals: LVD, PWM, WDT
- Number of I/O: 37
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 256 x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b, D/A 2x6b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 44-LQFP
- Supplier Device Package: 44-LQFP (10x10)
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Package: 44-LQFP |
Stock3,136 |
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NXP |
IC POWER MANAGEMENT I.MX8QM
- Applications: High Performance i.MX 8, S32x Processor Based
- Current - Supply: -
- Voltage - Supply: 2.5V ~ 5.5V
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-HVQFN (8x8)
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Package: 56-VFQFN Exposed Pad |
Stock7,888 |
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NXP |
S32K144 32-BIT MCU, ARM CORTEX-M
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
IC MCU 32BIT 256KB FLASH 64LQFP
- Core Processor: e200z0h
- Core Size: 32-Bit Single-Core
- Speed: 64MHz
- Connectivity: CANbus, I2C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 45
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 24K x 8
- Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: - |
Request a Quote |
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NXP |
PF7100 PMIC OTP
- Applications: i.MX Processors
- Current - Supply: 10µA
- Voltage - Supply: 2.5V ~ 5.5V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-HVQFN (7x7)
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Package: - |
Request a Quote |
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NXP |
MAGNIV 16-BIT MCU, S12Z CORE, 12
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 19
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
- Data Converters: A/D 6x10b, 6x12b; D/A 1x8b
- Oscillator Type: External, Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-QFN-EP (5x5)
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Package: - |
Request a Quote |
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