Page 905 - NXP Products | Heisener Electronics

2PA1774Q,115
NXP

TRANS PNP 50V 0.15A SC-75

Package: SC-75, SOT-416

Stock3,984
2N5064,112
NXP

THYRISTOR 8A 200V TO-92

Package: TO-226-3, TO-92-3 (TO-226AA)

Stock3,680
NE57810S/N1,518
NXP

IC DDR TERMINATION SPAK-5

Package: SPak-5 (5 leads + Tab)

Stock3,632
PCF1252-2T/F4,118
NXP

IC VOLT DETECT W/RESET 8SOIC

Package: 8-SOIC (0.154", 3.90mm Width)

Stock4,528
MC33143DW
NXP

IC SWITCH DUAL H-SIDE 24-SOIC

Package: 24-SOIC (0.295", 7.50mm Width)

Stock15,108
74ABT540DB,112
NXP

IC BUFF INVERT 5.5V 20SSOP

Package: 20-SSOP (0.209", 5.30mm Width)

Stock7,488
TDA8950J/N1,112
NXP

IC AMP AUDIO PWR 340W STER 23SIL

Package: 23-SIP Formed Leads

Stock13,128
PCA9537DP,118
NXP

IC I/O EXPANDER I2C 4B 10TSSOP

Package: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)

Stock21,918
SC16IS760IBS,157
NXP

IC UART 64BYTE 24HVQFN

Package: 24-VFQFN Exposed Pad

Stock4,400
NX3L2267GU,115
NXP

IC ANALOG SWITCH SPDT 10-XQFN

Package: 10-XFQFN

Stock28,674
MPC8572EVTAVNE
NXP

IC MPU MPC85XX 1.5GHZ 1023FCBGA

Package: 1023-BFBGA, FCBGA

Stock6,464
MC8641DVU1000GC
NXP

IC MPU MPC86XX 1.0GHZ 1023FCCBGA

Package: 1023-BCBGA, FCCBGA

Stock6,144
P2041NXN7MMC
NXP

IC MPU Q OR IQ 1.2GHZ 780FCBGA

Package: 780-BBGA, FCBGA

Stock6,684
MCIMX6L3DVN10AB
NXP

IC MPU I.MX6SL 1.0GHZ 432MAPBGA

Package: 432-TFBGA

Stock7,360
P89LPC9221FN,112
NXP

IC MCU 8BIT 8KB FLASH 20DIP

Package: 20-DIP (0.300", 7.62mm)

Stock4,480
MMC2114CFCPU33
NXP

IC MCU 32BIT 256KB FLASH 100LQFP

Package: 100-LQFP

Stock2,464
TDA8754HL/11/C1,55
NXP

IC TRPL 8BIT VIDEO ADC 144LQFP

Package: 144-LQFP

Stock5,280
PESD5V0V4UG,115
NXP

TVS DIODE 5VWM 13VC SOT353

Package: 5-TSSOP, SC-70-5, SOT-353

Stock4,338
OM7606/BGA2712
NXP

EVAL BOARD FOR BGA2712

Package: -

Stock7,650
A7101CHUK/T0BC2HAZ
NXP

SECURITY IC STD TEMP WLCSP

Package: 12-UFBGA, WLCSP

Stock27,834

Part Number	Manufacturer	Description	Package	Stock
2PA1774Q,115	NXP	TRANS PNP 50V 0.15A SC-75 Transistor Type: PNP Current - Collector (Ic) (Max): 150mA Voltage - Collector Emitter Breakdown (Max): 50V Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V Power - Max: 150mW Frequency - Transition: 100MHz Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: SC-75, SOT-416 Supplier Device Package: SC-75	Package: SC-75, SOT-416	Stock3,984
2N5064,112	NXP	THYRISTOR 8A 200V TO-92 Voltage - Off State: 200V Voltage - Gate Trigger (Vgt) (Max): 800mV Current - Gate Trigger (Igt) (Max): 200µA Voltage - On State (Vtm) (Max): 1.71V Current - On State (It (AV)) (Max): 510mA Current - On State (It (RMS)) (Max): 800mA Current - Hold (Ih) (Max): 5mA Current - Off State (Max): 10µA Current - Non Rep. Surge 50, 60Hz (Itsm): 10A @ 60Hz SCR Type: Sensitive Gate Operating Temperature: -65°C ~ 125°C Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) Supplier Device Package: TO-92-3	Package: TO-226-3, TO-92-3 (TO-226AA)	Stock3,680
NE57810S/N1,518	NXP	IC DDR TERMINATION SPAK-5 Applications: Converter, DDR Voltage - Input: 1.6 V ~ 3.6 V Number of Outputs: 1 Voltage - Output: - Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: SPak-5 (5 leads + Tab) Supplier Device Package: 5-SPAK	Package: SPak-5 (5 leads + Tab)	Stock3,632
PCF1252-2T/F4,118	NXP	IC VOLT DETECT W/RESET 8SOIC Type: Simple Reset/Power-On Reset Number of Voltages Monitored: 1 Output: Push-Pull, Totem Pole Reset: Active High Reset Timeout: 400 µs Minimum Voltage - Threshold: 4.25V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	Package: 8-SOIC (0.154", 3.90mm Width)	Stock4,528
MC33143DW	NXP	IC SWITCH DUAL H-SIDE 24-SOIC Switch Type: General Purpose Number of Outputs: 2 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: On/Off Voltage - Load: 9 V ~ 17 V Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Current - Output (Max): - Rds On (Typ): 140 mOhm Input Type: Non-Inverting Features: - Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Operating Temperature: -40°C ~ 150°C (TJ) Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SOIC	Package: 24-SOIC (0.295", 7.50mm Width)	Stock15,108
74ABT540DB,112	NXP	IC BUFF INVERT 5.5V 20SSOP Logic Type: Buffer, Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 20-SSOP (0.209", 5.30mm Width) Supplier Device Package: 20-SSOP	Package: 20-SSOP (0.209", 5.30mm Width)	Stock7,488
TDA8950J/N1,112	NXP	IC AMP AUDIO PWR 340W STER 23SIL Type: Class D Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Max Output Power x Channels @ Load: 340W x 1 @ 8 Ohm; 170W x 2 @ 4 Ohm Voltage - Supply: ±12.5 V ~ 40 V Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Through Hole Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: DBS23P Package / Case: 23-SIP Formed Leads	Package: 23-SIP Formed Leads	Stock13,128
PCA9537DP,118	NXP	IC I/O EXPANDER I2C 4B 10TSSOP Number of I/O: 4 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Supplier Device Package: 10-TSSOP	Package: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)	Stock21,918
SC16IS760IBS,157	NXP	IC UART 64BYTE 24HVQFN Protocol: RS232, RS485 Function: Controller Interface: I2C, SPI, UART Standards: - Voltage - Supply: 2.5V, 3.3V Current - Supply: 6mA Operating Temperature: -40°C ~ 95°C Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-HVQFN (4x4)	Package: 24-VFQFN Exposed Pad	Stock4,400
NX3L2267GU,115	NXP	IC ANALOG SWITCH SPDT 10-XQFN Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Number of Circuits: 2 On-State Resistance (Max): 750 mOhm Channel-to-Channel Matching (ΔRon): 90 mOhm Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V Voltage - Supply, Dual (V±): - Switch Time (Ton, Toff) (Max): 40ns, 20ns -3db Bandwidth: 60MHz Charge Injection: 37pC Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Crosstalk: -90dB @ 100kHz Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 10-XFQFN Supplier Device Package: 10-XQFN (1.4x1.8)	Package: 10-XFQFN	Stock28,674
MPC8572EVTAVNE	NXP	IC MPU MPC85XX 1.5GHZ 1023FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.5GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 1023-BFBGA, FCBGA Supplier Device Package: 1023-FCPBGA (33x33)	Package: 1023-BFBGA, FCBGA	Stock6,464
MC8641DVU1000GC	NXP	IC MPU MPC86XX 1.0GHZ 1023FCCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 1023-BCBGA, FCCBGA Supplier Device Package: 1023-FCCBGA (33x33)	Package: 1023-BCBGA, FCCBGA	Stock6,144
P2041NXN7MMC	NXP	IC MPU Q OR IQ 1.2GHZ 780FCBGA Core Processor: PowerPC e500mc Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (5), 10 Gbps (1) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FCPBGA (23x23)	Package: 780-BBGA, FCBGA	Stock6,684
MCIMX6L3DVN10AB	NXP	IC MPU I.MX6SL 1.0GHZ 432MAPBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 + PHY (3) Voltage - I/O: 1.2V, 1.8V, 3.0V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 432-TFBGA Supplier Device Package: 432-MAPBGA (13x13)	Package: 432-TFBGA	Stock7,360
P89LPC9221FN,112	NXP	IC MCU 8BIT 8KB FLASH 20DIP Core Processor: 8051 Core Size: 8-Bit Speed: 18MHz Connectivity: I2C, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Number of I/O: 18 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	Package: 20-DIP (0.300", 7.62mm)	Stock4,480
MMC2114CFCPU33	NXP	IC MCU 32BIT 256KB FLASH 100LQFP Core Processor: M210 Core Size: 32-Bit Speed: 33MHz Connectivity: EBI/EMI, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 67 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock2,464
TDA8754HL/11/C1,55	NXP	IC TRPL 8BIT VIDEO ADC 144LQFP Type: ADC, Video Number of Channels: - Resolution (Bits): 8 b Sampling Rate (Per Second): 110M Data Interface: Serial Voltage Supply Source: Analog and Digital Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -10°C ~ 70°C Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	Package: 144-LQFP	Stock5,280
PESD5V0V4UG,115	NXP	TVS DIODE 5VWM 13VC SOT353 Type: Zener Unidirectional Channels: 1 Bidirectional Channels: - Voltage - Reverse Standoff (Typ): 5V (Max) Voltage - Breakdown (Min): 6.4V Voltage - Clamping (Max) @ Ipp: 13V Current - Peak Pulse (10/1000µs): 1.5A (8/20µs) Power - Peak Pulse: 16W Power Line Protection: No Applications: General Purpose Capacitance @ Frequency: 12pF @ 1MHz Operating Temperature: -65°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 5-TSSOP, SC-70-5, SOT-353 Supplier Device Package: SOT-353	Package: 5-TSSOP, SC-70-5, SOT-353	Stock4,338
OM7606/BGA2712	NXP	EVAL BOARD FOR BGA2712 Type: Amplifier Frequency: 1GHz ~ 3.2GHz For Use With/Related Products: BGA2712 Supplied Contents: Board	Package: -	Stock7,650
A7101CHUK/T0BC2HAZ	NXP	SECURITY IC STD TEMP WLCSP Applications: Authentication Core Processor: MX51 Program Memory Type: - Controller Series: - RAM Size: - Interface: I²C Number of I/O: - Voltage - Supply: 2.5 V ~ 3.6 V Operating Temperature: -25°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 12-UFBGA, WLCSP Supplier Device Package: 12-WLCSP (2.06x2.02)	Package: 12-UFBGA, WLCSP	Stock27,834
MMPF0100FCAEPR2	NXP	POWER MANAGEMENT IC I.MX6 NO-P Applications: - Voltage - Input: - Number of Outputs: - Voltage - Output: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock3,664
LS1012ASE7HKB	NXP	LS1012A ST WE 800MHZ RV2 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: 211-VFLGA Supplier Device Package: 211-FCLGA (9.6x9.6)	Package: 211-VFLGA	Stock5,936
SAF4000EL-101Z23BY	NXP	SAF4000EL Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
S32G398AACK1VUCT	NXP	IC MPU S32G3 1.3GZ/400MHZ 525BGA Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit Speed: 400MHz, 1.3GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 2.5Gbps (3) SATA: - USB: USB 2.0 OTG (1) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	Package: -	Stock1,260
LPC1114FHN33-301K	NXP	IC MCU 32BIT 32KB FLASH 32HVQFN Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Speed: 50MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 28 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 32-VQFN Exposed Pad Supplier Device Package: 32-HVQFN (7x7)	Package: -	Stock3,048
MC20XS4200DFKR2	NXP	HIGH-SIDE SWITCH, 24V, DUAL 20MO Switch Type: General Purpose Number of Outputs: 2 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 8V ~ 36V Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Current - Output (Max): 4.4A Rds On (Typ): 20mOhm (Max) Input Type: Non-Inverting Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 23-PowerQFN Supplier Device Package: 23-PQFN (12x12)	Package: -	Request a Quote
S912ZVML32AMKHR	NXP	S12Z CORE, 32K FLASH, LIN, 64LQF Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 24 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Data Converters: A/D 9x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-HLQFP (10x10)	Package: -	Request a Quote
MPC880CVR133-NXP	NXP	POWERQUICC 32 BIT POWER ARCHITEC Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10Mbps (2), 10/100Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 100°C (TA) Security Features: Cryptography Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	Package: -	Request a Quote