Page 91 - NXP Products | Heisener Electronics

MRF6S19100HSR5
NXP

FET RF 68V 1.99GHZ NI-780S

Package: NI-780S

Stock3,376
MRF6S18060NBR1
NXP

FET RF 68V 1.99GHZ TO272-4

Package: TO-272BB

Stock7,520
PIP250M,518
NXP

IC REG BUCK ADJ 15A SYNC 68HVQFN

Package: 68-VFQFN Exposed Pad

Stock5,856
PCA9625D,518
NXP

IC LED DRIVER LIN DIM 100MA 32SO

Package: 32-SOIC (0.295", 7.50mm Width)

Stock5,488
PCA85133U/2DA/Q1Z
NXP

IC LCD DRIVER UNIV UNCASED

Package: Die

Stock5,792
74HC93D,112
NXP

IC 4B BINARY RIPPL COUNT 14SOIC

Package: 14-SOIC (0.154", 3.90mm Width)

Stock3,280
74AHCT1G07GW,165
NXP

IC BUFF N-INV OP/DRAIN 5TSSOP

Package: 5-TSSOP, SC-70-5, SOT-353

Stock5,168
PC34CM0902WEFR2
NXP

DUAL CAN HS 14SOIC

Package: -

Stock2,032
MCZ33904A5EKR2
NXP

IC SYSTEM BASIS CHIP 32-SOIC

Package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

Stock3,504
UJA1065TW/3V0,512
NXP

IC CAN/LIN FAIL-SAFE 32HTSSOP

Package: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

Stock2,784
P1025NSN5BFB
NXP

IC MPU Q OR IQ 667MHZ 561TEBGA1

Package: 561-FBGA

Stock3,712
MPC8358ZUADDE
NXP

IC MPU MPC83XX 266MHZ 740TBGA

Package: 740-LBGA

Stock6,576
MC7448VS1267NC
NXP

IC MPU MPC74XX 1.267GHZ 360LGA

Package: 360-CLGA, FCCLGA

Stock3,040
KMPC875ZT80
NXP

IC MPU MPC8XX 80MHZ 256BGA

Package: 256-BBGA

Stock4,336
MC68SEC000AA20B1
NXP

IC MPU M680X0 20MHZ 64QFP

Package: 64-QFP

Stock2,224
MC9S08QG8CDNER
NXP

IC MCU 8BIT 8KB FLASH 8SOIC

Package: 8-SOIC (0.154", 3.90mm Width)

Stock4,416
MC68HC908LB8CPE
NXP

IC MCU 8BIT 8KB FLASH 20DIP

Package: 20-DIP (0.300", 7.62mm)

Stock15,360
MC9S08PA4VWJR
NXP

IC MCU 8BIT 4KB FLASH 20SOIC

Package: 20-SOIC (0.295", 7.50mm Width)

Stock7,968
MC9S08QE16CWL
NXP

IC MCU 8BIT 16KB FLASH 28SOIC

Package: 28-SOIC (0.295", 7.50mm Width)

Stock16,008
MK64FN1M0VDC12
NXP

IC MCU 32BIT 1MB FLASH 121MAPBGA

Package: 121-XFBGA

Stock7,840

Part Number	Manufacturer	Description	Package	Stock
MRF6S19100HSR5	NXP	FET RF 68V 1.99GHZ NI-780S Transistor Type: LDMOS Frequency: 1.99GHz Gain: 16.1dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 900mA Power - Output: 22W Voltage - Rated: 68V Package / Case: NI-780S Supplier Device Package: NI-780S	Package: NI-780S	Stock3,376
MRF6S18060NBR1	NXP	FET RF 68V 1.99GHZ TO272-4 Transistor Type: LDMOS Frequency: 1.99GHz Gain: 15dB Voltage - Test: 26V Current Rating: - Noise Figure: - Current - Test: 600mA Power - Output: 60W Voltage - Rated: 68V Package / Case: TO-272BB Supplier Device Package: TO-272 WB-4	Package: TO-272BB	Stock7,520
PIP250M,518	NXP	IC REG BUCK ADJ 15A SYNC 68HVQFN Function: Step-Down Output Configuration: Positive Topology: Buck Output Type: Adjustable Number of Outputs: 1 Voltage - Input (Min): 5V Voltage - Input (Max): - Voltage - Output (Min/Fixed): 0.8V Voltage - Output (Max): - Current - Output: 15A Frequency - Switching: 300kHz Synchronous Rectifier: Yes Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 68-VFQFN Exposed Pad Supplier Device Package: 68-HVQFN (10x10)	Package: 68-VFQFN Exposed Pad	Stock5,856
PCA9625D,518	NXP	IC LED DRIVER LIN DIM 100MA 32SO Type: Linear Topology: - Internal Switch(s): Yes Number of Outputs: 16 Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V Voltage - Output: 24V Current - Output / Channel: 100mA Frequency: 100kHz ~ 1MHz Dimming: PWM Applications: Backlight Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 32-SOIC (0.295", 7.50mm Width) Supplier Device Package: 32-SO	Package: 32-SOIC (0.295", 7.50mm Width)	Stock5,488
PCA85133U/2DA/Q1Z	NXP	IC LCD DRIVER UNIV UNCASED Display Type: LCD Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Interface: I2C Digits or Characters: 20 Characters, 40 Characters, 320 Elements Current - Supply: 50mA Voltage - Supply: 1.8 V ~ 5.5 V Operating Temperature: -40°C ~ 95°C Mounting Type: Surface Mount Package / Case: Die Supplier Device Package: Die	Package: Die	Stock5,792
74HC93D,112	NXP	IC 4B BINARY RIPPL COUNT 14SOIC Logic Type: Binary Counter Direction: Up Number of Elements: 1 Number of Bits per Element: 4 Reset: Asynchronous Timing: - Count Rate: 108MHz Trigger Type: Negative Edge Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	Package: 14-SOIC (0.154", 3.90mm Width)	Stock3,280
74AHCT1G07GW,165	NXP	IC BUFF N-INV OP/DRAIN 5TSSOP Logic Type: Buffer, Non-Inverting Number of Elements: 1 Number of Bits per Element: 1 Input Type: - Output Type: Open Drain Current - Output High, Low: -, 8mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 5-TSSOP, SC-70-5, SOT-353 Supplier Device Package: 5-TSSOP	Package: 5-TSSOP, SC-70-5, SOT-353	Stock5,168
PC34CM0902WEFR2	NXP	DUAL CAN HS 14SOIC Applications: - Interface: - Voltage - Supply: - Package / Case: - Supplier Device Package: - Mounting Type: -	Package: -	Stock2,032
MCZ33904A5EKR2	NXP	IC SYSTEM BASIS CHIP 32-SOIC Applications: System Basis Chip Interface: CAN Voltage - Supply: 5.5 V ~ 28 V Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Mounting Type: Surface Mount	Package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad	Stock3,504
UJA1065TW/3V0,512	NXP	IC CAN/LIN FAIL-SAFE 32HTSSOP Applications: Automotive Networking Interface: SPI Serial Voltage - Supply: 5.5 V ~ 52 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	Package: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	Stock2,784
P1025NSN5BFB	NXP	IC MPU Q OR IQ 667MHZ 561TEBGA1 Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 125°C (TA) Security Features: - Package / Case: 561-FBGA Supplier Device Package: 561-TEPBGA1 (23x23)	Package: 561-FBGA	Stock3,712
MPC8358ZUADDE	NXP	IC MPU MPC83XX 266MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	Package: 740-LBGA	Stock6,576
MC7448VS1267NC	NXP	IC MPU MPC74XX 1.267GHZ 360LGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.267GHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-CLGA, FCCLGA Supplier Device Package: 360-FCCLGA (25x25)	Package: 360-CLGA, FCCLGA	Stock3,040
KMPC875ZT80	NXP	IC MPU MPC8XX 80MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1), 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23)	Package: 256-BBGA	Stock4,336
MC68SEC000AA20B1	NXP	IC MPU M680X0 20MHZ 64QFP Core Processor: EC000 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 20MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V, 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	Package: 64-QFP	Stock2,224
MC9S08QG8CDNER	NXP	IC MCU 8BIT 8KB FLASH 8SOIC Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 4 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	Package: 8-SOIC (0.154", 3.90mm Width)	Stock4,416
MC68HC908LB8CPE	NXP	IC MCU 8BIT 8KB FLASH 20DIP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LVR, POR, PWM Number of I/O: 18 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 7x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	Package: 20-DIP (0.300", 7.62mm)	Stock15,360
MC9S08PA4VWJR	NXP	IC MCU 8BIT 4KB FLASH 20SOIC Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: LIN, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 18 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SOIC	Package: 20-SOIC (0.295", 7.50mm Width)	Stock7,968
MC9S08QE16CWL	NXP	IC MCU 8BIT 16KB FLASH 28SOIC Core Processor: S08 Core Size: 8-Bit Speed: 50MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 22 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC	Package: 28-SOIC (0.295", 7.50mm Width)	Stock16,008
MK64FN1M0VDC12	NXP	IC MCU 32BIT 1MB FLASH 121MAPBGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 120MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 83 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 37x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 121-XFBGA Supplier Device Package: 121-MAPBGA (8x8)	Package: 121-XFBGA	Stock7,840
MC9S12DG256CPVE	NXP	IC MCU 16BIT 256KB FLASH 112LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: PWM, WDT Number of I/O: 91 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	Package: 112-LQFP	Stock28,872
OM7618/BGA2011	NXP	EVAL BOARD FOR BGA2011 Type: Amplifier Frequency: 1.8GHz For Use With/Related Products: BGA2714 Supplied Contents: Board	Package: -	Stock4,536
FS32K144UAT0VLLT	NXP	S32K144 32-BIT MCU ARM Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 112MHz Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock2,400
S9S12GA192F0CLL	NXP	16BIT 192K FLASH 11K RAM Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 86 Program Memory Size: 192KB (192K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 11K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 2x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock7,456
TDF8532HH-N2-S710K	NXP	IC AMPLIFIER CLASS D 100HLQFP Type: Class D Output Type: 4-Channel (Quad) Max Output Power x Channels @ Load: 80W x 4 @ 2Ohm Voltage - Supply: 5.5V ~ 25V Features: - Mounting Type: Surface Mount Operating Temperature: - Supplier Device Package: 100-HLQFP (14x14) Package / Case: 100-FQFP Exposed Pad	Package: -	Request a Quote
MC56F80748VLH	NXP	IC MCU 32BIT 64KB FLASH 64LQFP Core Processor: 56800EF Core Size: 32-Bit Speed: 100MHz Connectivity: I2C, LINbus, SCI, SPI Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 14x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: -	Request a Quote
MC33FS6600M2ES	NXP	SAFETY SBC FOR S32S2 MCU Applications: Safety Current - Supply: - Voltage - Supply: 2.7V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Package: -	Stock765
LX2120SC72232B	NXP	IC MPU QORLQ 2.2GHZ 1517FCPBGA Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 12 Core, 64-Bit Speed: 2.2GHz Co-Processors/DSP: - RAM Controllers: DDR4 Graphics Acceleration: Yes Display & Interface Controllers: - Ethernet: 100Gbps (2) SATA: SATA 3.0 (4) USB: USB 3.0 (2) + PHY (2) Voltage - I/O: 1.2V, 1.8V, 3.3V Operating Temperature: 0°C ~ 105°C (TJ) Security Features: Secure Boot, TrustZone® Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCPBGA (40x40)	Package: -	Request a Quote