Page 915 - NXP Products | Heisener Electronics

BF1105,215
NXP

MOSFET N-CH 7V DUAL SOT143

Package: TO-253-4, TO-253AA

Stock5,136
MBC13900NT1
NXP

TRANS RF NPN LO NOISE SOT-343

Package: SC-82A, SOT-343

Stock4,192
TEA1622P/N1,112
NXP

IC CTRLR PWM SMPS UVLO HV 8DIP

Package: 8-DIP (0.300", 7.62mm)

Stock4,096
74LV273DB,112
NXP

IC D-TYPE POS TRG SNGL 20SSOP

Package: 20-SSOP (0.209", 5.30mm Width)

Stock7,504
74HCT4017N,652
NXP

IC JOHNSON DECADE COUNTER 16-DIP

Package: 16-DIP (0.300", 7.62mm)

Stock4,512
N74F241D,602
NXP

IC BUFFER TRI-ST NON-INV 20SOIC

Package: 20-SOIC (0.295", 7.50mm Width)

Stock6,656
74HCT2G126GD,125
NXP

IC BUFFER/LINE DVR CMOS XSON8U

Package: 8-XFDFN

Stock2,352
PPC8572EPXARLC
NXP

IC MPU MPC85XX 1.067GHZ 1023BGA

Package: 1023-BFBGA, FCBGA

Stock4,080
MPC8536BVTAVLA
NXP

IC MPU MPC85XX 1.5GHZ 783FCBGA

Package: 783-BBGA, FCBGA

Stock4,016
MC68360ZQ25LR2
NXP

IC MPU M683XX 25MHZ 357BGA

Package: 357-BBGA

Stock5,920
XPC850SRVR50BU
NXP

IC MPU MPC8XX 50MHZ 256BGA

Package: 256-BBGA

Stock7,280
MC68302PV16C
NXP

IC MPU M683XX 16MHZ 144LQFP

Package: 144-LQFP

Stock64,308
MC8640TVJ1250HE
NXP

IC MPU E600 SGL CORE 994FCCBGA

Package: 994-BCBGA, FCCBGA

Stock6,944
MPC8250ACZUMHBC
NXP

IC MPU MPC82XX 266MHZ 408TBGA

Package: 480-LBGA

Stock4,624
MCP11A1CFNE3
NXP

IC MCU 8BIT ROMLESS 52PLCC

Package: 52-LCC (J-Lead)

Stock4,240
MC68HC908LB8CDWE
NXP

IC MCU 8BIT 8KB FLASH 20SOIC

Package: 20-SOIC (0.295", 7.50mm Width)

Stock4,928
MC9S08LC36LK
NXP

IC MCU 8BIT 36KB FLASH 80LQFP

Package: 80-LQFP

Stock2,048
MF3DH2201DUF/00V
NXP

MIFARE DESFIRE EV2

Package: Die

Stock2,520
TFF1012HN/N1,115
NXP

IC DOWNCONVERTER 16DHVQFN

Package: 16-VFQFN Exposed Pad

Stock4,536
T2081NXE8PTB
NXP

QORIQ 64B POWER ARCH 8X 1.5GHZ

Package: -

Stock7,776

Part Number	Manufacturer	Description	Package	Stock
BF1105,215	NXP	MOSFET N-CH 7V DUAL SOT143 Transistor Type: N-Channel Dual Gate Frequency: 800MHz Gain: 20dB Voltage - Test: 5V Current Rating: 30mA Noise Figure: 1.7dB Current - Test: - Power - Output: - Voltage - Rated: 7V Package / Case: TO-253-4, TO-253AA Supplier Device Package: SOT-143B	Package: TO-253-4, TO-253AA	Stock5,136
MBC13900NT1	NXP	TRANS RF NPN LO NOISE SOT-343 Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 6.5V Frequency - Transition: 15GHz Noise Figure (dB Typ @ f): 0.8dB ~ 1.1dB @ 900MHz ~ 1.9GHz Gain: 15dB ~ 22dB Power - Max: 188mW DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 2V Current - Collector (Ic) (Max): 20mA Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: SC-82A, SOT-343 Supplier Device Package: SOT-343	Package: SC-82A, SOT-343	Stock4,192
TEA1622P/N1,112	NXP	IC CTRLR PWM SMPS UVLO HV 8DIP Output Isolation: Isolated Internal Switch(s): Yes Voltage - Breakdown: 650V Topology: Flyback Voltage - Start Up: 9.5V Voltage - Supply (Vcc/Vdd): 7.5 V ~ 40 V Duty Cycle: 75% Frequency - Switching: 10kHz ~ 200kHz Power (Watts): - Fault Protection: Current Limiting, Over Temperature, Short Circuit Control Features: Frequency Control Operating Temperature: -20°C ~ 85°C (TA) Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-DIP Mounting Type: Through Hole	Package: 8-DIP (0.300", 7.62mm)	Stock4,096
74LV273DB,112	NXP	IC D-TYPE POS TRG SNGL 20SSOP Function: Master Reset Type: D-Type Output Type: Non-Inverted Number of Elements: 1 Number of Bits per Element: 8 Clock Frequency: 100MHz Max Propagation Delay @ V, Max CL: 19ns @ 5V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 12mA, 12mA Voltage - Supply: 1 V ~ 5.5 V Current - Quiescent (Iq): 160µA Input Capacitance: 3.5pF Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 20-SSOP (0.209", 5.30mm Width)	Package: 20-SSOP (0.209", 5.30mm Width)	Stock7,504
74HCT4017N,652	NXP	IC JOHNSON DECADE COUNTER 16-DIP Logic Type: Counter, Decade Direction: Up Number of Elements: 1 Number of Bits per Element: 10 Reset: Asynchronous Timing: - Count Rate: 67MHz Trigger Type: Positive, Negative Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	Package: 16-DIP (0.300", 7.62mm)	Stock4,512
N74F241D,602	NXP	IC BUFFER TRI-ST NON-INV 20SOIC Logic Type: Buffer, Non-Inverting Number of Elements: 2 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 15mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	Package: 20-SOIC (0.295", 7.50mm Width)	Stock6,656
74HCT2G126GD,125	NXP	IC BUFFER/LINE DVR CMOS XSON8U Logic Type: Buffer, Non-Inverting Number of Elements: 2 Number of Bits per Element: 1 Input Type: - Output Type: Push-Pull Current - Output High, Low: 6mA, 6mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 8-XFDFN Supplier Device Package: 8-XSON, SOT996-2 (2x3)	Package: 8-XFDFN	Stock2,352
PPC8572EPXARLC	NXP	IC MPU MPC85XX 1.067GHZ 1023BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.067GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 1023-BFBGA, FCBGA Supplier Device Package: 1023-FCPBGA (33x33)	Package: 1023-BFBGA, FCBGA	Stock4,080
MPC8536BVTAVLA	NXP	IC MPU MPC85XX 1.5GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.5GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 (3) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock4,016
MC68360ZQ25LR2	NXP	IC MPU M683XX 25MHZ 357BGA Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	Package: 357-BBGA	Stock5,920
XPC850SRVR50BU	NXP	IC MPU MPC8XX 50MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23)	Package: 256-BBGA	Stock7,280
MC68302PV16C	NXP	IC MPU M683XX 16MHZ 144LQFP Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 16MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	Package: 144-LQFP	Stock64,308
MC8640TVJ1250HE	NXP	IC MPU E600 SGL CORE 994FCCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.25GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 994-BCBGA, FCCBGA Supplier Device Package: 994-FCCBGA (33x33)	Package: 994-BCBGA, FCCBGA	Stock6,944
MPC8250ACZUMHBC	NXP	IC MPU MPC82XX 266MHZ 408TBGA Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	Package: 480-LBGA	Stock4,624
MCP11A1CFNE3	NXP	IC MCU 8BIT ROMLESS 52PLCC Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1)	Package: 52-LCC (J-Lead)	Stock4,240
MC68HC908LB8CDWE	NXP	IC MCU 8BIT 8KB FLASH 20SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LVR, POR, PWM Number of I/O: 18 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 7x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SOIC	Package: 20-SOIC (0.295", 7.50mm Width)	Stock4,928
MC9S08LC36LK	NXP	IC MCU 8BIT 36KB FLASH 80LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LCD, LVD, POR, PWM, WDT Number of I/O: 24 Program Memory Size: 36KB (36K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2.5K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12)	Package: 80-LQFP	Stock2,048
MF3DH2201DUF/00V	NXP	MIFARE DESFIRE EV2 Type: RFID Reader Frequency: 13.56MHz Standards: ISO 14443 Interface: - Voltage - Supply: - Operating Temperature: -25°C ~ 75°C Package / Case: Die Supplier Device Package: Die	Package: Die	Stock2,520
TFF1012HN/N1,115	NXP	IC DOWNCONVERTER 16DHVQFN RF Type: Ku-Band Frequency: 10.7GHz ~ 12.75GHz Number of Mixers: 1 Gain: 30dB Noise Figure: 9dB Secondary Attributes: - Current - Supply: 52mA Voltage - Supply: 5V Package / Case: 16-VFQFN Exposed Pad Supplier Device Package: 16-DHVQFN (2.5x3.5)	Package: 16-VFQFN Exposed Pad	Stock4,536
T2081NXE8PTB	NXP	QORIQ 64B POWER ARCH 8X 1.5GHZ Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Stock7,776
T1014NSE7PQA	NXP	QORIQ 1XCPU 64-BIT PWR ARCH 1. Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Stock5,024
MC9S08PL8CTG	NXP	MCU 8-BIT 8KB 20MHZ TSSOP16 Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: LINbus, SCI, UART/USART Peripherals: LVD, POR, PWM Number of I/O: 14 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	Package: 16-TSSOP (0.173", 4.40mm Width)	Stock4,064
MKE14Z256VLH7	NXP	KINETIS KE14Z: 72MHZ CORTEX-M0+ Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 72MHz Connectivity: FlexIO, I²C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Number of I/O: 58 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 34K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP	Stock14,580
SPC5746CSK1AVKU6	NXP	32 BIT3M FLASH384 RAM Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz, 160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	Package: 176-LQFP Exposed Pad	Stock7,632
SPC5605BK0MLL4R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 77 Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 7x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock4,432
MKE02Z32VLD4R	NXP	KINETIS KE02: 40MHZ CORTEX-M0+ 5 Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 40MHz Connectivity: I²C, SPI, UART/USART Peripherals: LVD, PWM, WDT Number of I/O: 37 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 2x6b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	Package: 44-LQFP	Stock2,576
MKE15Z64VFP4	NXP	IC MCU 32BIT 64KB FLASH 40HVQFN Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Speed: 48MHz Connectivity: CANbus, I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Number of I/O: 36 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 12x12b SAR; D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (5x5)	Package: -	Stock330
LS1023ACE9MQB	NXP	LAYERSCAPE 64-BIT ARM CORTEX-A53 Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.2GHz Co-Processors/DSP: - RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1GbE (4), 2.5GbE (2), 10GbE (1) SATA: SATA 6Gbps (1) USB: USB 3.0 + PHY (3) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security Package / Case: 780-BFBGA, FCBGA Supplier Device Package: 780-FBGA (23x23)	Package: -	Request a Quote