Page 930 - NXP Products | Heisener Electronics

PH3330L,115
NXP

MOSFET N-CH 30V 100A LFPAK

Package: SC-100, SOT-669

Stock7,392
BF1109R,215
NXP

MOSFET 2N-CH 11V 30MA SOT143R

Package: SOT-143R

Stock5,888
MPC17510AEJR2
NXP

IC MOTOR DRIVER PAR 20TSSOP

Package: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad

Stock4,160
ASL1003NTKJ
NXP

IC LED DRIVER AUTO 14HVSON

Package: -

Stock2,384
N74F139N,602
NXP

IC DECODER/DEMUX DUAL 1-4 16DIP

Package: 16-DIP (0.300", 7.62mm)

Stock6,592
74HC574PW/AUJ
NXP

IC FLIP FLOP OCT D 3ST 20TSSOP

Package: 20-TSSOP (0.173", 4.40mm Width)

Stock4,784
74ABT646ADB,118
NXP

IC TRANSCVR 8BIT N-INV 24SSOP

Package: 24-SSOP (0.209", 5.30mm Width)

Stock6,432
MC33790HEG
NXP

IC DSI INTERFACE 2CH 16SOIC

Package: 16-SOIC (0.295", 7.50mm Width)

Stock3,632
MPC8572ELPXARLD
NXP

IC MPU MPC85XX 1.067GHZ 1023BGA

Package: 1023-BFBGA, FCBGA

Stock6,352
MC68EC000AA20
NXP

IC MPU M680X0 20MHZ 64QFP

Package: 64-QFP

Stock6,704
KMPC8265AZUPJDC
NXP

IC MPU MPC82XX 300MHZ 408TBGA

Package: 480-LBGA

Stock5,104
P5040NXE72QC
NXP

IC SOC 64BIT 4X2.2GHZ 1295FCBGA

Package: 1295-BBGA, FCBGA

Stock2,368
MCIMX6D6AVT08AD
NXP

IC MPU I.MX6D 852MHZ 624FCBGA

Package: 624-FBGA, FCBGA

Stock17,676
S9S08DN32F1MLC
NXP

IC MCU 8BIT 32KB FLASH 32LQFP

Package: 32-LQFP

Stock4,256
P80C552EBB/08,557
NXP

IC MCU 8BIT ROMLESS 80QFP

Package: 80-BQFP

Stock5,200
MC9S08PT32VQH
NXP

IC MCU 8BIT 32KB FLASH 64QFP

Package: 64-QFP

Stock6,048
MSC8154ESAG1000B
NXP

IC DSP 4X 1GHZ SC3850 783FCBGA

Package: 783-BBGA, FCBGA

Stock6,832
TDA8296HN/C1,518
NXP

IC IF DEMODULATOR DGTL 40HVQFN

Package: 40-VFQFN Exposed Pad

Stock4,644
MBC13917EPR2
NXP

RF AMP SIGE 100MHZ-2.5GHZ 6MLPD

Package: 6-WFDFN Exposed Pad

Stock4,914
MC35FS6513CAE
NXP

SBC, DCDC 1.5A VCORE FS1B CAN,15

Package: 48-LQFP Exposed Pad

Stock6,096

Part Number	Manufacturer	Description	Package	Stock
PH3330L,115	NXP	MOSFET N-CH 30V 100A LFPAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 100A (Tc) Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs(th) (Max) @ Id: 2.15V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 30.5nC @ 4.5V Input Capacitance (Ciss) (Max) @ Vds: 4840pF @ 12V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 62.5W (Tc) Rds On (Max) @ Id, Vgs: 3.3 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Supplier Device Package: LFPAK56, Power-SO8 Package / Case: SC-100, SOT-669	Package: SC-100, SOT-669	Stock7,392
BF1109R,215	NXP	MOSFET 2N-CH 11V 30MA SOT143R Transistor Type: N-Channel Dual Gate Frequency: 800MHz Gain: 20dB Voltage - Test: 9V Current Rating: 30mA Noise Figure: 1.5dB Current - Test: - Power - Output: - Voltage - Rated: 11V Package / Case: SOT-143R Supplier Device Package: SOT-143R	Package: SOT-143R	Stock5,888
MPC17510AEJR2	NXP	IC MOTOR DRIVER PAR 20TSSOP Motor Type - Stepper: - Motor Type - AC, DC: Brushed DC Function: Driver - Fully Integrated, Control and Power Stage Output Configuration: Half Bridge (2) Interface: Parallel Technology: CMOS Step Resolution: - Applications: Battery Powered Current - Output: 1.2A Voltage - Supply: 4 V ~ 5.5 V Voltage - Load: 2 V ~ 15 V Operating Temperature: -30°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad Supplier Device Package: 20-TSSOP	Package: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad	Stock4,160
ASL1003NTKJ	NXP	IC LED DRIVER AUTO 14HVSON Type: - Topology: - Internal Switch(s): - Number of Outputs: - Voltage - Supply (Min): - Voltage - Supply (Max): - Voltage - Output: - Current - Output / Channel: - Frequency: - Dimming: - Applications: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock2,384
N74F139N,602	NXP	IC DECODER/DEMUX DUAL 1-4 16DIP Type: Decoder/Demultiplexer Circuit: 1 x 2:4 Independent Circuits: 2 Current - Output High, Low: 1mA, 20mA Voltage Supply Source: Single Supply Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	Package: 16-DIP (0.300", 7.62mm)	Stock6,592
74HC574PW/AUJ	NXP	IC FLIP FLOP OCT D 3ST 20TSSOP Function: Standard Type: D-Type Output Type: Tri-State, Non-Inverted Number of Elements: 1 Number of Bits per Element: 8 Clock Frequency: 133MHz Max Propagation Delay @ V, Max CL: 26ns @ 6V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 7.8mA, 7.8mA Voltage - Supply: 2 V ~ 6 V Current - Quiescent (Iq): 8µA Input Capacitance: 3.5pF Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width)	Package: 20-TSSOP (0.173", 4.40mm Width)	Stock4,784
74ABT646ADB,118	NXP	IC TRANSCVR 8BIT N-INV 24SSOP Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 24-SSOP (0.209", 5.30mm Width) Supplier Device Package: 24-SSOP	Package: 24-SSOP (0.209", 5.30mm Width)	Stock6,432
MC33790HEG	NXP	IC DSI INTERFACE 2CH 16SOIC Type: Distributed Systems Interface Input Type: Logic Output Type: Logic Interface: SPI Current - Supply: 1mA Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	Package: 16-SOIC (0.295", 7.50mm Width)	Stock3,632
MPC8572ELPXARLD	NXP	IC MPU MPC85XX 1.067GHZ 1023BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.067GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 1023-BFBGA, FCBGA Supplier Device Package: 1023-FCPBGA (33x33)	Package: 1023-BFBGA, FCBGA	Stock6,352
MC68EC000AA20	NXP	IC MPU M680X0 20MHZ 64QFP Core Processor: EC000 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 20MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	Package: 64-QFP	Stock6,704
KMPC8265AZUPJDC	NXP	IC MPU MPC82XX 300MHZ 408TBGA Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	Package: 480-LBGA	Stock5,104
P5040NXE72QC	NXP	IC SOC 64BIT 4X2.2GHZ 1295FCBGA Core Processor: PowerPC e5500 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 2.2GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (10), 10 Gbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: 1.0V, 1.2V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage Package / Case: 1295-BBGA, FCBGA Supplier Device Package: 1295-FCPBGA (37.5x37.5)	Package: 1295-BBGA, FCBGA	Stock2,368
MCIMX6D6AVT08AD	NXP	IC MPU I.MX6D 852MHZ 624FCBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 852MHZ Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	Package: 624-FBGA, FCBGA	Stock17,676
S9S08DN32F1MLC	NXP	IC MCU 8BIT 32KB FLASH 32LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 25 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 1.5K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	Package: 32-LQFP	Stock4,256
P80C552EBB/08,557	NXP	IC MCU 8BIT ROMLESS 80QFP Core Processor: 8051 Core Size: 8-Bit Speed: 16MHz Connectivity: EBI/EMI, I2C, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 40 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 80-BQFP Supplier Device Package: 80-PQFP (14x20)	Package: 80-BQFP	Stock5,200
MC9S08PT32VQH	NXP	IC MCU 8BIT 32KB FLASH 64QFP Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LIN, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 57 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	Package: 64-QFP	Stock6,048
MSC8154ESAG1000B	NXP	IC DSP 4X 1GHZ SC3850 783FCBGA Type: SC3850 Quad Core Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Clock Rate: 1GHz Non-Volatile Memory: ROM (96 kB) On-Chip RAM: 576kB Voltage - I/O: 2.50V Voltage - Core: 1.00V Operating Temperature: 0°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock6,832
TDA8296HN/C1,518	NXP	IC IF DEMODULATOR DGTL 40HVQFN Function: Demodulator LO Frequency: - RF Frequency: - P1dB: - Gain: - Noise Figure: - Current - Supply: 65mA Voltage - Supply: 1.1 V ~ 3.6 V Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	Package: 40-VFQFN Exposed Pad	Stock4,644
MBC13917EPR2	NXP	RF AMP SIGE 100MHZ-2.5GHZ 6MLPD Frequency: 100MHz ~ 2.5GHz P1dB: -1.1dB Gain: 14.9dB Noise Figure: 1.8dB RF Type: General Purpose Voltage - Supply: 2.1 V ~ 3.3 V Current - Supply: 20mA Test Frequency: 1.9GHz Package / Case: 6-WFDFN Exposed Pad Supplier Device Package: 6-MLPD EP (1.5x2)	Package: 6-WFDFN Exposed Pad	Stock4,914
MC35FS6513CAE	NXP	SBC, DCDC 1.5A VCORE FS1B CAN,15 Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP Exposed Pad	Stock6,096
CBTV24DD12AETY	NXP	12-BIT SWITCH/MUX FOR DDR4 SAC 4 Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Number of Circuits: 12 On-State Resistance (Max): 9 Ohm Channel-to-Channel Matching (ΔRon): 400 mOhm (Typ) Voltage - Supply, Single (V+): 1.62 V ~ 3.63 V Voltage - Supply, Dual (V±): - Switch Time (Ton, Toff) (Max): - -3db Bandwidth: 7.4GHz Charge Injection: - Channel Capacitance (CS(off), CD(off)): - Current - Leakage (IS(off)) (Max): - Crosstalk: - Operating Temperature: -10°C ~ 85°C (TA) Package / Case: 48-TFBGA Supplier Device Package: 48-TFBGA (3x8)	Package: 48-TFBGA	Stock2,080
SPC5674FK0MVY3R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z7 Core Size: 32-Bit Speed: 264MHz Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Number of I/O: 32 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V Data Converters: A/D 64x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	Package: 516-BBGA	Stock4,880
SPC5566MZP132	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z6 Core Size: 32-Bit Speed: 132MHz Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 256 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock4,192
S912XET256W1CAL	NXP	16-BIT MCU S12X CORE 256KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	Package: 112-LQFP	Stock4,896
FC32K144HFT0MLHR	NXP	IC Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
MPF5032BMMA5ESR2	NXP	PMIC 2 BUCKS 2 LDO A1 DIE Applications: System Basis Chip Current - Supply: - Voltage - Supply: 3.3V ~ 5.25V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-PowerVFQFN Supplier Device Package: 40-HVQFN (6x6)	Package: -	Request a Quote
FD32K144HRT0VLFR	NXP	S32K144, 512K FLASH, 64K RAM Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
MPF5200AMMG2ESR2	NXP	POWER MANAGEMENT SPECIALIZED - P Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote