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NXP |
MOSFET N-CH 55V 66A TO220AB
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 55V
- Current - Continuous Drain (Id) @ 25°C: 66A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
- Vgs(th) (Max) @ Id: 2V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: -
- Input Capacitance (Ciss) (Max) @ Vds: 3085pF @ 25V
- Vgs (Max): ±10V
- FET Feature: -
- Power Dissipation (Max): 138W (Tc)
- Rds On (Max) @ Id, Vgs: 15 mOhm @ 25A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Through Hole
- Supplier Device Package: TO-220AB
- Package / Case: TO-220-3
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Package: TO-220-3 |
Stock4,960 |
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NXP |
MOSFET N-CH 55V 47A TO220AB
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 55V
- Current - Continuous Drain (Id) @ 25°C: 47A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 10V
- Vgs(th) (Max) @ Id: 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: -
- Input Capacitance (Ciss) (Max) @ Vds: 1310pF @ 25V
- Vgs (Max): ±20V
- FET Feature: -
- Power Dissipation (Max): 106W (Tc)
- Rds On (Max) @ Id, Vgs: 24 mOhm @ 25A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Through Hole
- Supplier Device Package: TO-220AB
- Package / Case: TO-220-3
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Package: TO-220-3 |
Stock6,112 |
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NXP |
FET RF 65V 860MHZ NI-860C
- Transistor Type: LDMOS
- Frequency: 860MHz
- Gain: 18.2dB
- Voltage - Test: 32V
- Current Rating: 17A
- Noise Figure: -
- Current - Test: 2A
- Power - Output: 45W
- Voltage - Rated: 65V
- Package / Case: NI-860C3
- Supplier Device Package: NI-860C3
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Package: NI-860C3 |
Stock3,968 |
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NXP |
TRANS RF NPN 12V 40MA SOT-323
- Transistor Type: NPN
- Voltage - Collector Emitter Breakdown (Max): 12V
- Frequency - Transition: 11GHz
- Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
- Gain: 12.5dB
- Power - Max: 450mW
- DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
- Current - Collector (Ic) (Max): 40mA
- Operating Temperature: -40°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: SC-70, SOT-323
- Supplier Device Package: SOT-323-3
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Package: SC-70, SOT-323 |
Stock6,752 |
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NXP |
TXRX TRANSLATING DUAL 6TSSOP
- Translator Type: Voltage Level
- Channel Type: Bidirectional
- Number of Circuits: 1
- Channels per Circuit: 1
- Voltage - VCCA: 1.65V ~ 3.6V
- Voltage - VCCB: 2.3V ~ 5.5V
- Input Signal: -
- Output Signal: -
- Output Type: Open Drain, Tri-State
- Data Rate: 50Mbps
- Operating Temperature: -40°C ~ 125°C (TA)
- Features: Auto-Direction Sensing
- Mounting Type: Surface Mount
- Package / Case: 6-TSSOP, SC-88, SOT-363
- Supplier Device Package: 6-TSSOP
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Package: 6-TSSOP, SC-88, SOT-363 |
Stock5,360 |
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NXP |
IC GATE OR 4CH 2-INP 14-SO
- Logic Type: OR Gate
- Number of Circuits: 4
- Number of Inputs: 2
- Features: -
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Max): -
- Current - Output High, Low: 1mA, 20mA
- Logic Level - Low: 0.8V
- Logic Level - High: 2V
- Max Propagation Delay @ V, Max CL: 5.6ns @ 5V, 50pF
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Supplier Device Package: 14-SO
- Package / Case: 14-SOIC (0.154", 3.90mm Width)
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Package: 14-SOIC (0.154", 3.90mm Width) |
Stock30,000 |
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NXP |
IC D-TYPE POS TRG SNGL 20DIP
- Function: Standard
- Type: D-Type
- Output Type: Tri-State, Non-Inverted
- Number of Elements: 1
- Number of Bits per Element: 8
- Clock Frequency: 165MHz
- Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
- Trigger Type: Positive Edge
- Current - Output High, Low: 3mA, 24mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Iq): 86mA
- Input Capacitance: -
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Through Hole
- Package / Case: 20-DIP (0.300", 7.62mm)
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Package: 20-DIP (0.300", 7.62mm) |
Stock6,336 |
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NXP |
IC TUNER TERR/CATV 48HLQFN
- Type: Tuner
- Applications: TV
- Mounting Type: Surface Mount
- Package / Case: 48-LFQFN Exposed Pad
- Supplier Device Package: 48-HLQFN (7x7)
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Package: 48-LFQFN Exposed Pad |
Stock6,080 |
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NXP |
IC MPU Q OR IQ 2.0GHZ 1295FCBGA
- Core Processor: PowerPC e5500
- Number of Cores/Bus Width: 2 Core, 64-Bit
- Speed: 2.0GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3, DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 1 Gbps (5), 10 Gbps (1)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 1295-BBGA, FCBGA
- Supplier Device Package: 1295-FCPBGA (37.5x37.5)
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Package: 1295-BBGA, FCBGA |
Stock5,744 |
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NXP |
IC MPU Q OR IQ 800MHZ 425TEBGA
- Core Processor: PowerPC e500v2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3, DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (1)
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 425-FBGA
- Supplier Device Package: 425-TEPBGA I (19x19)
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Package: 425-FBGA |
Stock2,128 |
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NXP |
IC MPU MPC85XX 1.333GHZ 783BGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.333GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 (3)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 90°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock2,816 |
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NXP |
IC MPU MPC85XX 667MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 667MHz
- Co-Processors/DSP: Communications; CPM, Security; SEC
- RAM Controllers: DDR, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock7,152 |
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NXP |
IC MCU 32BIT 256KB FLASH 121BGA
- Core Processor: Coldfire V2
- Core Size: 32-Bit
- Speed: 60MHz
- Connectivity: Ethernet, I2C, SPI, UART/USART
- Peripherals: DMA, LVD, POR, PWM, WDT
- Number of I/O: 73
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 8x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 121-LBGA
- Supplier Device Package: 121-MAPBGA (12x12)
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Package: 121-LBGA |
Stock3,376 |
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NXP |
IC MCU 32BIT 256KB FLASH 100LQFP
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 64MHz
- Connectivity: CAN, LIN, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 79
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 16
- RAM Size: 20K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: 100-LQFP |
Stock5,776 |
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NXP |
IC MCU 8BIT 8KB FLASH 16TSSOP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: LIN, SCI
- Peripherals: LVD, POR, PWM
- Number of I/O: 14
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 10x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
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Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock6,480 |
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NXP |
IC MCU 8BIT 4KB FLASH 8SOIC
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I2C, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 4
- Program Memory Size: 4KB (4K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 256 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 4x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SOIC
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock7,472 |
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NXP |
IC MCU 16BIT 32KB FLASH 32LQFP
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: I2C, IrDA, LIN, SCI, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 19
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 128 x 8
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V
- Data Converters: A/D 6x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock2,096 |
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NXP |
IC MCU 32BIT 2MB FLASH 176LQFP
- Core Processor: e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 200MHz
- Connectivity: CAN, Ethernet, I2C, LIN, SCI, SPI, UART/USART
- Peripherals: DMA, LVD, POR, Zipwire
- Number of I/O: -
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128 x 8
- Voltage - Supply (Vcc/Vdd): 3.5 V ~ 5.5 V
- Data Converters: A/D 12b SAR, 16b Sigma-Delta
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
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Package: 176-LQFP |
Stock7,380 |
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NXP |
IC MCU 32BIT 512KB FLASH 144LQFP
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 100
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 192K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 41x16b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock5,648 |
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NXP |
IC DSP 24BIT 100MHZ 196-MAPBGA
- Type: Fixed Point
- Interface: Host Interface, SSI, SCI
- Clock Rate: 100MHz
- Non-Volatile Memory: ROM (576 B)
- On-Chip RAM: 24kB
- Voltage - I/O: 3.30V
- Voltage - Core: 3.30V
- Operating Temperature: -40°C ~ 105°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 196-LBGA
- Supplier Device Package: 196-MAPBGA (15x15)
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Package: 196-LBGA |
Stock3,664 |
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NXP |
RF TXRX MODULE 802.15.4 U.FL ANT
- RF Family/Standard: 802.15.4
- Protocol: Zigbee?
- Modulation: O-QPSK
- Frequency: 2.4GHz
- Data Rate: -
- Power - Output: 9.5dBm
- Sensitivity: -96dBm
- Serial Interfaces: I2C, SPI, UART
- Antenna Type: Not Included, U.FL
- Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
- Voltage - Supply: 2 V ~ 3.6 V
- Current - Receiving: 22mA
- Current - Transmitting: 35mA
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 27-SMD Module
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Package: 27-SMD Module |
Stock16,944 |
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NXP |
TOWER SYSTEM KIT
- Type: Transceiver; 802.15.4
- Frequency: 2.4GHz
- For Use With/Related Products: KW2x
- Supplied Contents: Board, Cable
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Package: - |
Stock6,084 |
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NXP |
IC AMP LNA FOR WIRELESS 10HVSON
- Frequency: 500MHz ~ 1.5GHz
- P1dB: 16.5dB
- Gain: 21dB
- Noise Figure: 0.65dB
- RF Type: General Purpose
- Voltage - Supply: 3 V ~ 3.6 V
- Current - Supply: 65mA
- Test Frequency: 900MHz
- Package / Case: 10-VFDFN Exposed Pad
- Supplier Device Package: 10-HVSON (3x3)
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Package: 10-VFDFN Exposed Pad |
Stock6,480 |
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NXP |
MMIC AMPLIFIER 6TSSOP
- Frequency: 50MHz ~ 3.6GHz
- P1dB: 8.9dBm (7.8mW)
- Gain: 22.9dB
- Noise Figure: 5.3dB
- RF Type: ISM
- Voltage - Supply: 5 V ~ 6 V
- Current - Supply: 15.9mA
- Test Frequency: 1GHz
- Package / Case: 6-TSSOP, SC-88, SOT-363
- Supplier Device Package: 6-TSSOP
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Package: 6-TSSOP, SC-88, SOT-363 |
Stock4,410 |
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NXP |
KINETIS KL17: 48MHZ CORTEX-M0+ U
- Core Processor: ARM® Cortex®-M0+
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: I²C, LINbus, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
- Number of I/O: 54
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 20x16b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LFBGA
- Supplier Device Package: 64-MAPBGA (5x5)
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Package: 64-LFBGA |
Stock3,152 |
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NXP |
SAF4000EL
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
LAYERSCAPE 64-BIT ARM CORTEX-A72
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCPBGA (40x40)
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Package: - |
Request a Quote |
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NXP |
I.MX 8X FIPS
- Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
- Number of Cores/Bus Width: 3 Core, 64-Bit
- Speed: 1.2GHz, 264MHz
- Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
- RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
- Graphics Acceleration: Yes
- Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
- Ethernet: 10/100/1000Mbps (2)
- SATA: -
- USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 125°C (TJ)
- Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
- Package / Case: 609-BFBGA
- Supplier Device Package: 609-FBGA (21x21)
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Package: - |
Request a Quote |
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