Page 2 - TE Connectivity AMP Connectors Products - Sockets for ICs, Transistors

2-2129710-7
TE Connectivity AMP Connectors

LEFT SIDE LGA3647-1 SOCKET-P1

Package: -

Stock8,514
2-2129710-8
TE Connectivity AMP Connectors

RIGHT SIDE LGA3647-1 SOCKET-P1

Package: -

Stock7,524
2-2129710-5
TE Connectivity AMP Connectors

LEFT SIDE LGA3647-0 SOCKET- P0

Package: -

Stock7,056
1981837-1
TE Connectivity AMP Connectors

CONN SOCKET LGA 1366POS GOLD

Package: -

Stock8,874
8060-1G12
TE Connectivity AMP Connectors

CONN TRANSIST TO-5 4POS GOLD

Package: -

Stock6,660
1-1747890-1
TE Connectivity AMP Connectors

CONN SOCKET LGA 771POS GOLD

Package: -

Stock7,116
824-AG31D-ESL-LF
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 24POS GOLD

Package: -

Stock18,672
816-AG12D-ES-LF
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 16POS TIN

Package: -

Stock30,996
4-1571551-3
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 14POS GOLD

Package: -

Stock20,388
818-AG11D-ESL-LF
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 18POS GOLD

Package: -

Stock26,754
4-1571552-4
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 16POS GOLD

Package: -

Stock27,318
1-2199300-2
TE Connectivity AMP Connectors

32P,DIP SKT,600 CL,OTC,PB FREE

Package: -

Stock16,950
2174988-2
TE Connectivity AMP Connectors

SOCKET ASSY LGA2011-1 0.38AU

Package: -

Stock7,254
3-1571550-2
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 40POS GOLD

Package: -

Stock9,192
7-1437529-6
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 8POS GOLD

Package: -

Stock7,248
1-1571550-0
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 32POS TIN

Package: -

Stock16,980
1554653-1
TE Connectivity AMP Connectors

CONN SOCKET LGA 2011POS GOLD

Package: -

Stock7,020
3-1437508-6
TE Connectivity AMP Connectors

CONN TRANSIST TO-5 8POS GOLD

Package: -

Stock6,960
8058-1G30
TE Connectivity AMP Connectors

CONN TRANSIST TO-5 4POS GOLD

Package: -

Stock12,654
8058-1G24
TE Connectivity AMP Connectors

CONN TRANSIST TO-5 4POS GOLD

Package: -

Stock6,864

Part Number	Manufacturer	Description	Package	Stock	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
2-2129710-7	TE Connectivity AMP Connectors	LEFT SIDE LGA3647-1 SOCKET-P1 Type: LGA Number of Positions or Pins (Grid): 1823 Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: Liquid Crystal Polymer (LCP) Operating Temperature: -	Package: -	Stock8,514	1823	-	Gold	30µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	-	-	-	Copper Alloy	Liquid Crystal Polymer (LCP)	-
2-2129710-8	TE Connectivity AMP Connectors	RIGHT SIDE LGA3647-1 SOCKET-P1 Type: LGA Number of Positions or Pins (Grid): 1823 Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: Liquid Crystal Polymer (LCP) Operating Temperature: -	Package: -	Stock7,524	1823	-	Gold	30µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	-	-	-	Copper Alloy	Liquid Crystal Polymer (LCP)	-
2-2129710-5	TE Connectivity AMP Connectors	LEFT SIDE LGA3647-0 SOCKET- P0 Type: LGA Number of Positions or Pins (Grid): 1823 Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: Liquid Crystal Polymer (LCP) Operating Temperature: -	Package: -	Stock7,056	1823	-	Gold	30µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	-	-	-	Copper Alloy	Liquid Crystal Polymer (LCP)	-
1981837-1	TE Connectivity AMP Connectors	CONN SOCKET LGA 1366POS GOLD Type: LGA Number of Positions or Pins (Grid): 1366 (32 x 41) Pitch - Mating: 0.040" (1.01mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15µin (0.38µm) Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.040" (1.01mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: Thermoplastic Operating Temperature: -	Package: -	Stock8,874	1366 (32 x 41)	0.040" (1.01mm)	Gold	15µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.040" (1.01mm)	-	-	Copper Alloy	Thermoplastic	-
8060-1G12	TE Connectivity AMP Connectors	CONN TRANSIST TO-5 4POS GOLD Type: Transistor, TO-5 Number of Positions or Pins (Grid): 4 (Round) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Fluoropolymer (FP) Operating Temperature: -55°C ~ 125°C	Package: -	Stock6,660	4 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Fluoropolymer (FP)	-55°C ~ 125°C
1-1747890-1	TE Connectivity AMP Connectors	CONN SOCKET LGA 771POS GOLD Type: LGA Number of Positions or Pins (Grid): 771 (33 x 33) Pitch - Mating: 0.043" (1.09mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.043" (1.09mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: Thermoplastic Operating Temperature: -25°C ~ 100°C	Package: -	Stock7,116	771 (33 x 33)	0.043" (1.09mm)	Gold	-	Copper Alloy	Surface Mount	Open Frame	Solder	0.043" (1.09mm)	-	-	-	Thermoplastic	-25°C ~ 100°C
824-AG31D-ESL-LF	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 24POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	Package: -	Stock18,672	24 (2 x 12)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
816-AG12D-ES-LF	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 16POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	Package: -	Stock30,996	16 (2 x 8)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
4-1571551-3	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 14POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 25µin (0.63µm) Contact Material - Post: Nickel Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock20,388	14 (2 x 7)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	25µin (0.63µm)	Nickel	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
818-AG11D-ESL-LF	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 18POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	Package: -	Stock26,754	18 (2 x 9)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
4-1571552-4	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 16POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20µin (0.51µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 20µin (0.51µm) Contact Material - Post: Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	Package: -	Stock27,318	16 (2 x 8)	0.100" (2.54mm)	Gold	20µin (0.51µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20µin (0.51µm)	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
1-2199300-2	TE Connectivity AMP Connectors	32P,DIP SKT,600 CL,OTC,PB FREE Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock16,950	-	-	-	-	-	-	-	-	-	-	-	-	-	-
2174988-2	TE Connectivity AMP Connectors	SOCKET ASSY LGA2011-1 0.38AU Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock7,254	-	-	-	-	-	-	-	-	-	-	-	-	-	-
3-1571550-2	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 40POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 25µin (0.63µm) Contact Material - Post: Beryllium Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock9,192	40 (2 x 20)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	25µin (0.63µm)	Beryllium Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
7-1437529-6	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 8POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: - Operating Temperature: -55°C ~ 125°C	Package: -	Stock7,248	8 (2 x 4)	0.100" (2.54mm)	Gold	-	Copper Alloy	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Copper Alloy	-	-55°C ~ 125°C
1-1571550-0	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 32POS TIN Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	Package: -	Stock16,980	32 (2 x 16)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
1554653-1	TE Connectivity AMP Connectors	CONN SOCKET LGA 2011POS GOLD Type: LGA Number of Positions or Pins (Grid): 2011 (47 x 58) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15µin (0.38µm) Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: 15µin (0.38µm) Contact Material - Post: Copper Alloy Housing Material: Thermoplastic Operating Temperature: -25°C ~ 100°C	Package: -	Stock7,020	2011 (47 x 58)	-	Gold	15µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	-	Gold	15µin (0.38µm)	Copper Alloy	Thermoplastic	-25°C ~ 100°C
3-1437508-6	TE Connectivity AMP Connectors	CONN TRANSIST TO-5 8POS GOLD Type: Transistor, TO-5 Number of Positions or Pins (Grid): 8 (Round) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polytetrafluoroethylene (PTFE) Operating Temperature: -55°C ~ 125°C	Package: -	Stock6,960	8 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Brass	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
8058-1G30	TE Connectivity AMP Connectors	CONN TRANSIST TO-5 4POS GOLD Type: Transistor, TO-5 Number of Positions or Pins (Grid): 4 (Round) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Panel Mount Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polytetrafluoroethylene (PTFE) Operating Temperature: -55°C ~ 125°C	Package: -	Stock12,654	4 (Round)	-	Gold	-	Beryllium Copper	Panel Mount	Closed Frame	Solder	-	Gold	-	Brass	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
8058-1G24	TE Connectivity AMP Connectors	CONN TRANSIST TO-5 4POS GOLD Type: Transistor, TO-5 Number of Positions or Pins (Grid): 4 (Round) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Panel Mount Features: - Termination: Solder Cup Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polytetrafluoroethylene (PTFE) Operating Temperature: -55°C ~ 125°C	Package: -	Stock6,864	4 (Round)	-	Gold	-	Beryllium Copper	Panel Mount	-	Solder Cup	-	Gold	-	Brass	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
540-AG10D-ES	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 40POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: - Operating Temperature: -55°C ~ 125°C	Package: -	Stock20,484	40 (2 x 20)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	Brass	-	-55°C ~ 125°C
514-AG10D	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 14POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: - Operating Temperature: -55°C ~ 125°C	Package: -	Stock27,192	14 (2 x 7)	0.100" (2.54mm)	Gold	-	Copper Alloy	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Copper Alloy	-	-55°C ~ 125°C
4-1571552-9	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20µin (0.51µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 20µin (0.51µm) Contact Material - Post: Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	Package: -	Stock17,940	28 (2 x 14)	0.100" (2.54mm)	Gold	20µin (0.51µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20µin (0.51µm)	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
1-2199298-8	TE Connectivity AMP Connectors	24P,DIP SKT,300 CL,LDR,PB FREE Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock23,226	-	-	-	-	-	-	-	-	-	-	-	-	-	-
2-2129710-6	TE Connectivity AMP Connectors	RIGHT SIDE LGA3647-0 SOCKET-P0 Type: LGA Number of Positions or Pins (Grid): 1823 Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: Liquid Crystal Polymer (LCP) Operating Temperature: -	Package: -	Stock8,748	1823	-	Gold	30µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	-	-	-	Copper Alloy	Liquid Crystal Polymer (LCP)	-
2201838-1	TE Connectivity AMP Connectors	SOCKET ASSY LGA2011-3 Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock8,280	-	-	-	-	-	-	-	-	-	-	-	-	-	-
8080-1G7	TE Connectivity AMP Connectors	CONN TRANSIST TO-3 4POS GOLD Type: Transistor, TO-3 Number of Positions or Pins (Grid): 4 (Round) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Fluoropolymer (FP) Operating Temperature: -55°C ~ 125°C	Package: -	Stock6,264	4 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Fluoropolymer (FP)	-55°C ~ 125°C
8060-1G5	TE Connectivity AMP Connectors	CONN TRANSIST TO-5 3POS GOLD Type: Transistor, TO-5 Number of Positions or Pins (Grid): 3 (Round) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Polytetrafluoroethylene (PTFE) Operating Temperature: -55°C ~ 125°C	Package: -	Stock6,648	3 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C