TE Connectivity AMP Connectors Products - Sockets for ICs, Transistors

8060-1G11
TE Connectivity AMP Connectors

CONN TRANSIST TO-5 3POS GOLD

Package: -

Stock8,508
8060-1G4
TE Connectivity AMP Connectors

CONN TRANSIST TO-5 4POS GOLD

Package: -

Stock8,820
8060-1G13
TE Connectivity AMP Connectors

CONN TRANSIST TO-5 3POS GOLD

Package: -

Stock6,708
8060-1G3
TE Connectivity AMP Connectors

CONN TRANSIST TO-5 3POS GOLD

Package: -

Stock28,776
8058-1G23
TE Connectivity AMP Connectors

CONN TRANSIST TO-5 3POS GOLD

Package: -

Stock14,370
516-AG10D
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 16POS GOLD

Package: -

Stock21,396
510-AG90D-10
TE Connectivity AMP Connectors

CONN SOCKET SIP 10POS GOLD

Package: -

Stock6,300
840-AG11D-ESL-LF
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 40POS GOLD

Package: -

Stock13,056
814-AG10D-ES
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 14POS GOLD

Package: -

Stock8,100
832-AG11D-ESL-LF
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 32POS GOLD

Package: -

Stock20,448
828-AG11D-ESL-LF
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS GOLD

Package: -

Stock29,370
820-AG11D-ESL-LF
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 20POS GOLD

Package: -

Stock29,760
816-AG11D-ESL-LF
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 16POS GOLD

Package: -

Stock32,988
814-AG11D-ESL-LF
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 14POS GOLD

Package: -

Stock27,732
808-AG11D-ESL-LF
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 8POS GOLD

Package: -

Stock23,808
4-1571552-2
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 14POS GOLD

Package: -

Stock28,980
808-AG11D-ES-LF
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 8POS GOLD

Package: -

Stock21,270
1-2199299-5
TE Connectivity AMP Connectors

40P,DIP SKT,600 CL,LDR,PB FREE

Package: -

Stock23,010
1-2199299-2
TE Connectivity AMP Connectors

28P,DIP SKT,600 CL,LDR,PB FREE

Package: -

Stock32,892
1-2199298-9
TE Connectivity AMP Connectors

28P,DIP SKT,300 CL,LDR,PB FREE

Package: -

Stock82,590

Part Number	Manufacturer	Description	Package	Stock	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
8060-1G11	TE Connectivity AMP Connectors	CONN TRANSIST TO-5 3POS GOLD Type: Transistor, TO-5 Number of Positions or Pins (Grid): 3 (Round) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Polytetrafluoroethylene (PTFE) Operating Temperature: -55°C ~ 125°C	Package: -	Stock8,508	3 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
8060-1G4	TE Connectivity AMP Connectors	CONN TRANSIST TO-5 4POS GOLD Type: Transistor, TO-5 Number of Positions or Pins (Grid): 4 (Round) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Polytetrafluoroethylene (PTFE) Operating Temperature: -55°C ~ 125°C	Package: -	Stock8,820	4 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
8060-1G13	TE Connectivity AMP Connectors	CONN TRANSIST TO-5 3POS GOLD Type: Transistor, TO-5 Number of Positions or Pins (Grid): 3 (Round) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Polytetrafluoroethylene (PTFE) Operating Temperature: -55°C ~ 125°C	Package: -	Stock6,708	3 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
8060-1G3	TE Connectivity AMP Connectors	CONN TRANSIST TO-5 3POS GOLD Type: Transistor, TO-5 Number of Positions or Pins (Grid): 3 (Round) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Polytetrafluoroethylene (PTFE) Operating Temperature: -55°C ~ 125°C	Package: -	Stock28,776	3 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
8058-1G23	TE Connectivity AMP Connectors	CONN TRANSIST TO-5 3POS GOLD Type: Transistor, TO-5 Number of Positions or Pins (Grid): 3 (Round) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polytetrafluoroethylene (PTFE) Operating Temperature: -55°C ~ 125°C	Package: -	Stock14,370	3 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Brass	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
516-AG10D	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 16POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: - Operating Temperature: -55°C ~ 125°C	Package: -	Stock21,396	16 (2 x 8)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	Brass	-	-55°C ~ 125°C
510-AG90D-10	TE Connectivity AMP Connectors	CONN SOCKET SIP 10POS GOLD Type: SIP Number of Positions or Pins (Grid): 10 (1 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Thermoplastic Operating Temperature: -	Package: -	Stock6,300	10 (1 x 10)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Thermoplastic	-
840-AG11D-ESL-LF	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 40POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	Package: -	Stock13,056	40 (2 x 20)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
814-AG10D-ES	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 14POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: Polyester Operating Temperature: -55°C ~ 105°C	Package: -	Stock8,100	14 (2 x 7)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Copper Alloy	Polyester	-55°C ~ 105°C
832-AG11D-ESL-LF	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 32POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: Polyester Operating Temperature: -55°C ~ 105°C	Package: -	Stock20,448	32 (2 x 16)	0.100" (2.54mm)	Gold	Flash	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester	-55°C ~ 105°C
828-AG11D-ESL-LF	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	Package: -	Stock29,370	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
820-AG11D-ESL-LF	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 20POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	Package: -	Stock29,760	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
816-AG11D-ESL-LF	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 16POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	Package: -	Stock32,988	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
814-AG11D-ESL-LF	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 14POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	Package: -	Stock27,732	14 (2 x 7)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
808-AG11D-ESL-LF	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 8POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	Package: -	Stock23,808	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
4-1571552-2	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 14POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20µin (0.51µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 20µin (0.51µm) Contact Material - Post: Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	Package: -	Stock28,980	14 (2 x 7)	0.100" (2.54mm)	Gold	20µin (0.51µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20µin (0.51µm)	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
808-AG11D-ES-LF	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 8POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20µin (0.51µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 20µin (0.51µm) Contact Material - Post: Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	Package: -	Stock21,270	8 (2 x 4)	0.100" (2.54mm)	Gold	20µin (0.51µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20µin (0.51µm)	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
1-2199299-5	TE Connectivity AMP Connectors	40P,DIP SKT,600 CL,LDR,PB FREE Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60µin (1.52µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 60µin (1.52µm) Contact Material - Post: Nickel Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Operating Temperature: -40°C ~ 105°C	Package: -	Stock23,010	40 (2 x 20)	0.100" (2.54mm)	Tin	60µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	60µin (1.52µm)	Nickel	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
1-2199299-2	TE Connectivity AMP Connectors	28P,DIP SKT,600 CL,LDR,PB FREE Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60µin (1.52µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 60µin (1.52µm) Contact Material - Post: Nickel Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Operating Temperature: -40°C ~ 105°C	Package: -	Stock32,892	28 (2 x 14)	0.100" (2.54mm)	Tin	60µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	60µin (1.52µm)	Nickel	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
1-2199298-9	TE Connectivity AMP Connectors	28P,DIP SKT,300 CL,LDR,PB FREE Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock82,590	-	-	-	-	-	-	-	-	-	-	-	-	-	-
1-2199298-6	TE Connectivity AMP Connectors	20P,DIP SKT,300 CL,LDR,PB FREE Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock46,494	-	-	-	-	-	-	-	-	-	-	-	-	-	-
1-2199298-5	TE Connectivity AMP Connectors	18P,DIP SKT,300 CL,LDR,PB FREE Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock48,552	-	-	-	-	-	-	-	-	-	-	-	-	-	-
1-2199298-4	TE Connectivity AMP Connectors	16P,DIP SKT,300 CL,LDR,PB FREE Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock100,842	-	-	-	-	-	-	-	-	-	-	-	-	-	-
1-2199298-3	TE Connectivity AMP Connectors	14P,DIP SKT,300 CL,LDR,PB FREE Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock123,318	-	-	-	-	-	-	-	-	-	-	-	-	-	-
1-2199298-1	TE Connectivity AMP Connectors	6P,DIP SKT,300 CL,LDR,PB FREE Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock102,798	-	-	-	-	-	-	-	-	-	-	-	-	-	-
1-2199298-2	TE Connectivity AMP Connectors	8P,DIP SKT,300 CL,LDR,PB FREE Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock66,054	-	-	-	-	-	-	-	-	-	-	-	-	-	-
2-821949-5	TE Connectivity AMP Connectors	CONN SOCKET PQFP 132POS TIN-LEAD Type: QFP Number of Positions or Pins (Grid): 132 (4 x 33) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Phosphor Bronze Housing Material: Liquid Crystal Polymer (LCP) Operating Temperature: -	Package: -	Stock17,916	132 (4 x 33)	0.050" (1.27mm)	Tin-Lead	200µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Tin-Lead	200µin (5.08µm)	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-
1-1571994-0	TE Connectivity AMP Connectors	CONN SOCKET SIP 10POS GOLD Type: SIP Number of Positions or Pins (Grid): 10 (1 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20µin (0.51µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 20µin (0.51µm) Contact Material - Post: Copper Housing Material: Thermoplastic, Polyester Operating Temperature: -	Package: -	Stock28,044	10 (1 x 10)	0.100" (2.54mm)	Gold	20µin (0.51µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	20µin (0.51µm)	Copper	Thermoplastic, Polyester	-