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TE Connectivity AMP Connectors |
510AG91D14ESL=SOCKET ASSY.
- Type: -
- Number of Positions or Pins (Grid): -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: -
- Features: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
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Package: - |
Stock3,454 |
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- | - | - | - | - | - | - | - | - | - | - | - | - | - |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 32POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 5µin (0.127µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Copper Alloy
- Housing Material: Polyester
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock7,380 |
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32 (2 x 16) | 0.100" (2.54mm) | Gold | 5µin (0.127µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Copper Alloy | Polyester | -55°C ~ 125°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 20POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 20 (2 x 10)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 25µin (0.63µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 25µin (0.63µm)
- Contact Material - Post: Nickel
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock2,322 |
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20 (2 x 10) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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TE Connectivity AMP Connectors |
CONN SOCKET SIP 13POS TIN
- Type: SIP
- Number of Positions or Pins (Grid): 13 (1 x 13)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Thermoplastic, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock8,856 |
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13 (1 x 13) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 28POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 28 (2 x 14)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 25µin (0.63µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: -
- Contact Material - Post: Copper Alloy
- Housing Material: Polyester
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock3,580 |
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28 (2 x 14) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 14POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 14 (2 x 7)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: Flash
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: Flash
- Contact Material - Post: Nickel
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock4,824 |
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14 (2 x 7) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 8POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 8 (2 x 4)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 25µin (0.63µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: Polyester
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock5,670 |
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8 (2 x 4) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 24POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 24 (2 x 12)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 20µin (0.51µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 20µin (0.51µm)
- Contact Material - Post: Copper
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock3,418 |
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24 (2 x 12) | 0.100" (2.54mm) | Gold | 20µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 20µin (0.51µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
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TE Connectivity AMP Connectors |
CONN SOCKET SIP 17POS TIN
- Type: SIP
- Number of Positions or Pins (Grid): 17 (1 x 17)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Thermoplastic, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock2,952 |
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17 (1 x 17) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
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TE Connectivity AMP Connectors |
510-AG92D-05=INLINE SOCKET
- Type: -
- Number of Positions or Pins (Grid): -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: -
- Features: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
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Package: - |
Stock7,200 |
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- | - | - | - | - | - | - | - | - | - | - | - | - | - |
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TE Connectivity AMP Connectors |
CONN SOCKET SIP 14POS TIN
- Type: SIP
- Number of Positions or Pins (Grid): 14 (1 x 14)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: -
- Contact Material - Post: Phosphor Bronze
- Housing Material: Thermoplastic, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock6,588 |
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14 (1 x 14) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 22POS GOLD
- Type: DIP, 0.4" (10.16mm) Row Spacing
- Number of Positions or Pins (Grid): 22 (2 x 11)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 5µin (0.127µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: Polyester
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock3,454 |
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22 (2 x 11) | 0.100" (2.54mm) | Gold | 5µin (0.127µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 32POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 25µin (0.63µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: Polyester
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock2,700 |
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32 (2 x 16) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
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TE Connectivity AMP Connectors |
510-AG92D-08=INLINE SOCKET
- Type: -
- Number of Positions or Pins (Grid): -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: -
- Features: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
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Package: - |
Stock2,124 |
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- | - | - | - | - | - | - | - | - | - | - | - | - | - |
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TE Connectivity AMP Connectors |
CONN SOCKET SIP 15POS TIN
- Type: SIP
- Number of Positions or Pins (Grid): 15 (1 x 15)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Thermoplastic, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock8,640 |
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15 (1 x 15) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 28POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 28 (2 x 14)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Thermoplastic, Glass Filled
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock4,518 |
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28 (2 x 14) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 125°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 28POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 28 (2 x 14)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 15µin (0.38µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 15µin (0.38µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Thermoplastic, Glass Filled
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock8,892 |
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28 (2 x 14) | 0.100" (2.54mm) | Gold | 15µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 18POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 18 (2 x 9)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 25µin (0.63µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 25µin (0.63µm)
- Contact Material - Post: Nickel
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock5,652 |
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18 (2 x 9) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 28POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 28 (2 x 14)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Thermoplastic, Glass Filled
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock4,734 |
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28 (2 x 14) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 125°C |
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TE Connectivity AMP Connectors |
CONN SOCKET SIP 12POS TIN
- Type: SIP
- Number of Positions or Pins (Grid): 12 (1 x 12)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: -
- Contact Material - Post: Phosphor Bronze
- Housing Material: Thermoplastic, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock3,436 |
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12 (1 x 12) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 8POS TIN
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 8 (2 x 4)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: -
- Contact Material - Post: Copper
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Operating Temperature: -55°C ~ 105°C
|
Package: - |
Stock3,906 |
|
8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 20POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 20 (2 x 10)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Thermoplastic, Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock8,262 |
|
20 (2 x 10) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 125°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 32POS TIN
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: -
- Contact Material - Post: Copper
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Operating Temperature: -55°C ~ 105°C
|
Package: - |
Stock6,246 |
|
32 (2 x 16) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 6POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 6 (2 x 3)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 25µin (0.63µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: -
- Contact Material - Post: Copper Alloy
- Housing Material: Polyester
- Operating Temperature: -55°C ~ 105°C
|
Package: - |
Stock8,694 |
|
6 (2 x 3) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 32POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 25µin (0.63µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 25µin (0.63µm)
- Contact Material - Post: Nickel
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock8,316 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 8POS TIN
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 8 (2 x 4)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock7,398 |
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8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 28POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 28 (2 x 14)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 15µin (0.38µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 15µin (0.38µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Thermoplastic, Glass Filled
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock2,520 |
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28 (2 x 14) | 0.100" (2.54mm) | Gold | 15µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
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TE Connectivity AMP Connectors |
SIP IC SKT 20 SSR SN/AU FLH ROHS
- Type: -
- Number of Positions or Pins (Grid): -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: -
- Features: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
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Package: - |
Stock2,250 |
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