Page 184 - Xilinx Inc. Products - Embedded - FPGAs (Field Programmable Gate Array)

XCV600E-8FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

Package: 680-LBGA Exposed Pad

Stock6,272
XCV600E-8FG676C
Xilinx Inc.

IC FPGA 444 I/O 676FBGA

Package: 676-BBGA, FCBGA

Stock4,944
XCV600E-8BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

Package: 560-LBGA, Metal

Stock2,496
XCV600E-8BG432C
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

Package: 432-LBGA, Metal

Stock6,608
XCV600E-7HQ240I
Xilinx Inc.

IC FPGA 158 I/O 240HQFP

Package: 240-BFQFP Exposed Pad

Stock47,796
XCV600E-7HQ240C
Xilinx Inc.

IC FPGA 158 I/O 240HQFP

Package: 240-BFQFP Exposed Pad

Stock2,240
XCV600E-7FG900I
Xilinx Inc.

IC FPGA 512 I/O 900FBGA

Package: 900-BBGA

Stock7,360
XCV600E-7FG900C
Xilinx Inc.

IC FPGA 512 I/O 900FBGA

Package: 900-BBGA

Stock2,096
XCV600E-7FG680I
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

Package: 680-LBGA Exposed Pad

Stock5,760
XCV600E-7FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

Package: 680-LBGA Exposed Pad

Stock5,776
XCV600E-7FG676I
Xilinx Inc.

IC FPGA 444 I/O 676FBGA

Package: 676-BBGA, FCBGA

Stock2,480
XCV600E-7FG676C
Xilinx Inc.

IC FPGA 444 I/O 676FBGA

Package: 676-BBGA, FCBGA

Stock4,800
XCV600E-7BG560I
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

Package: 560-LBGA, Metal

Stock4,560
XCV600E-7BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

Package: 560-LBGA, Metal

Stock17,988
XCV600E-7BG432I
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

Package: 432-LBGA, Metal

Stock10,776
XCV600E-7BG432C
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

Package: 432-LBGA, Metal

Stock6,744
XCV600E-6HQ240I
Xilinx Inc.

IC FPGA 158 I/O 240HQFP

Package: 240-BFQFP Exposed Pad

Stock7,344
XCV600E-6HQ240C
Xilinx Inc.

IC FPGA 158 I/O 240HQFP

Package: 240-BFQFP Exposed Pad

Stock4,240
XCV600E-6FG900I
Xilinx Inc.

IC FPGA 512 I/O 900FBGA

Package: 900-BBGA

Stock6,832
XCV600E-6FG900C
Xilinx Inc.

IC FPGA 512 I/O 900FBGA

Package: 900-BBGA

Stock22,212

Part Number	Manufacturer	Description	Package	Stock	Number of Logic Elements/Cells	Total RAM Bits	Number of I/O	Number of Gates	Voltage - Supply	Mounting Type	Operating Temperature	Package / Case	Supplier Device Package
XCV600E-8FG680C	Xilinx Inc.	IC FPGA 512 I/O 680FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 512 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40x40)	Package: 680-LBGA Exposed Pad	Stock6,272	15552	294912	512	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	680-LBGA Exposed Pad	680-FTEBGA (40x40)
XCV600E-8FG676C	Xilinx Inc.	IC FPGA 444 I/O 676FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 444 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock4,944	15552	294912	444	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	676-BBGA, FCBGA	676-FCBGA (27x27)
XCV600E-8BG560C	Xilinx Inc.	IC FPGA 404 I/O 560MBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 404 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	Package: 560-LBGA, Metal	Stock2,496	15552	294912	404	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XCV600E-8BG432C	Xilinx Inc.	IC FPGA 316 I/O 432MBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 316 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	Package: 432-LBGA, Metal	Stock6,608	15552	294912	316	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	432-LBGA, Metal	432-MBGA (40x40)
XCV600E-7HQ240I	Xilinx Inc.	IC FPGA 158 I/O 240HQFP Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 158 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP Exposed Pad	Stock47,796	15552	294912	158	985882	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	240-BFQFP Exposed Pad	240-PQFP (32x32)
XCV600E-7HQ240C	Xilinx Inc.	IC FPGA 158 I/O 240HQFP Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 158 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP Exposed Pad	Stock2,240	15552	294912	158	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	240-BFQFP Exposed Pad	240-PQFP (32x32)
XCV600E-7FG900I	Xilinx Inc.	IC FPGA 512 I/O 900FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 512 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA Supplier Device Package: 900-FBGA (31x31)	Package: 900-BBGA	Stock7,360	15552	294912	512	985882	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	900-BBGA	900-FBGA (31x31)
XCV600E-7FG900C	Xilinx Inc.	IC FPGA 512 I/O 900FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 512 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 900-BBGA Supplier Device Package: 900-FBGA (31x31)	Package: 900-BBGA	Stock2,096	15552	294912	512	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	900-BBGA	900-FBGA (31x31)
XCV600E-7FG680I	Xilinx Inc.	IC FPGA 512 I/O 680FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 512 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40x40)	Package: 680-LBGA Exposed Pad	Stock5,760	15552	294912	512	985882	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	680-LBGA Exposed Pad	680-FTEBGA (40x40)
XCV600E-7FG680C	Xilinx Inc.	IC FPGA 512 I/O 680FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 512 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40x40)	Package: 680-LBGA Exposed Pad	Stock5,776	15552	294912	512	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	680-LBGA Exposed Pad	680-FTEBGA (40x40)
XCV600E-7FG676I	Xilinx Inc.	IC FPGA 444 I/O 676FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 444 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock2,480	15552	294912	444	985882	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	676-BBGA, FCBGA	676-FCBGA (27x27)
XCV600E-7FG676C	Xilinx Inc.	IC FPGA 444 I/O 676FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 444 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock4,800	15552	294912	444	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	676-BBGA, FCBGA	676-FCBGA (27x27)
XCV600E-7BG560I	Xilinx Inc.	IC FPGA 404 I/O 560MBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 404 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	Package: 560-LBGA, Metal	Stock4,560	15552	294912	404	985882	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XCV600E-7BG560C	Xilinx Inc.	IC FPGA 404 I/O 560MBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 404 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	Package: 560-LBGA, Metal	Stock17,988	15552	294912	404	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XCV600E-7BG432I	Xilinx Inc.	IC FPGA 316 I/O 432MBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 316 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	Package: 432-LBGA, Metal	Stock10,776	15552	294912	316	985882	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	432-LBGA, Metal	432-MBGA (40x40)
XCV600E-7BG432C	Xilinx Inc.	IC FPGA 316 I/O 432MBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 316 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	Package: 432-LBGA, Metal	Stock6,744	15552	294912	316	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	432-LBGA, Metal	432-MBGA (40x40)
XCV600E-6HQ240I	Xilinx Inc.	IC FPGA 158 I/O 240HQFP Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 158 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP Exposed Pad	Stock7,344	15552	294912	158	985882	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	240-BFQFP Exposed Pad	240-PQFP (32x32)
XCV600E-6HQ240C	Xilinx Inc.	IC FPGA 158 I/O 240HQFP Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 158 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP Exposed Pad	Stock4,240	15552	294912	158	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	240-BFQFP Exposed Pad	240-PQFP (32x32)
XCV600E-6FG900I	Xilinx Inc.	IC FPGA 512 I/O 900FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 512 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA Supplier Device Package: 900-FBGA (31x31)	Package: 900-BBGA	Stock6,832	15552	294912	512	985882	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	900-BBGA	900-FBGA (31x31)
XCV600E-6FG900C	Xilinx Inc.	IC FPGA 512 I/O 900FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 512 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 900-BBGA Supplier Device Package: 900-FBGA (31x31)	Package: 900-BBGA	Stock22,212	15552	294912	512	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	900-BBGA	900-FBGA (31x31)
XCV600E-6FG680C	Xilinx Inc.	IC FPGA 512 I/O 680FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 512 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40x40)	Package: 680-LBGA Exposed Pad	Stock6,480	15552	294912	512	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	680-LBGA Exposed Pad	680-FTEBGA (40x40)
XCV600E-6FG676I	Xilinx Inc.	IC FPGA 444 I/O 676FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 444 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock4,912	15552	294912	444	985882	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	676-BBGA, FCBGA	676-FCBGA (27x27)
XCV600E-6FG676C	Xilinx Inc.	IC FPGA 444 I/O 676FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 444 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock5,088	15552	294912	444	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	676-BBGA, FCBGA	676-FCBGA (27x27)
XCV600E-6BG560I	Xilinx Inc.	IC FPGA 404 I/O 560MBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 404 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	Package: 560-LBGA, Metal	Stock6,656	15552	294912	404	985882	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XCV600E-6BG560C	Xilinx Inc.	IC FPGA 404 I/O 560MBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 404 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	Package: 560-LBGA, Metal	Stock4,016	15552	294912	404	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XCV600E-6BG432I	Xilinx Inc.	IC FPGA 316 I/O 432MBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 316 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	Package: 432-LBGA, Metal	Stock9,312	15552	294912	316	985882	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	432-LBGA, Metal	432-MBGA (40x40)
XCV600E-6BG432C	Xilinx Inc.	IC FPGA 316 I/O 432MBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 316 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	Package: 432-LBGA, Metal	Stock5,632	15552	294912	316	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	432-LBGA, Metal	432-MBGA (40x40)
XCV600-6HQ240C	Xilinx Inc.	IC FPGA 166 I/O 240HQFP Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 98304 Number of I/O: 166 Number of Gates: 661111 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP Exposed Pad	Stock14,520	15552	98304	166	661111	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	240-BFQFP Exposed Pad	240-PQFP (32x32)