Page 185 - Xilinx Inc. Products - Embedded - FPGAs (Field Programmable Gate Array)

XCV812E-6BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

Package: 560-LBGA, Metal

Stock5,184
XCV800-6HQ240C
Xilinx Inc.

IC FPGA 166 I/O 240HQFP

Package: 240-BFQFP Exposed Pad

Stock5,600
XCV800-6FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

Package: 680-LBGA Exposed Pad

Stock6,464
XCV800-6FG676C
Xilinx Inc.

IC FPGA 444 I/O 676FBGA

Package: 676-BBGA, FCBGA

Stock6,688
XCV800-6BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

Package: 560-LBGA, Metal

Stock5,680
XCV800-6BG432C
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

Package: 432-LBGA, Metal

Stock3,984
XCV800-5HQ240I
Xilinx Inc.

IC FPGA 166 I/O 240HQFP

Package: 240-BFQFP Exposed Pad

Stock4,256
XCV800-5HQ240C
Xilinx Inc.

IC FPGA 166 I/O 240HQFP

Package: 240-BFQFP Exposed Pad

Stock22,200
XCV800-5FG680I
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

Package: 680-LBGA Exposed Pad

Stock4,784
XCV800-5FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

Package: 680-LBGA Exposed Pad

Stock3,648
XCV800-5FG676I
Xilinx Inc.

IC FPGA 444 I/O 676FBGA

Package: 676-BBGA, FCBGA

Stock7,808
XCV800-5FG676C
Xilinx Inc.

IC FPGA 444 I/O 676FBGA

Package: 676-BBGA, FCBGA

Stock5,600
XCV800-5BG560I
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

Package: 560-LBGA, Metal

Stock5,056
XCV800-5BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

Package: 560-LBGA, Metal

Stock4,784
XCV800-5BG432I
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

Package: 432-LBGA, Metal

Stock3,408
XCV800-5BG432C
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

Package: 432-LBGA, Metal

Stock8,928
XCV800-4HQ240I
Xilinx Inc.

IC FPGA 166 I/O 240HQFP

Package: 240-BFQFP Exposed Pad

Stock5,664
XCV800-4HQ240C
Xilinx Inc.

IC FPGA 166 I/O 240HQFP

Package: 240-BFQFP Exposed Pad

Stock6,176
XCV800-4FG680I
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

Package: 680-LBGA Exposed Pad

Stock7,584
XCV800-4FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

Package: 680-LBGA Exposed Pad

Stock2,080

Part Number	Manufacturer	Description	Package	Stock	Number of Logic Elements/Cells	Total RAM Bits	Number of I/O	Number of Gates	Voltage - Supply	Mounting Type	Operating Temperature	Package / Case	Supplier Device Package
XCV812E-6BG560C	Xilinx Inc.	IC FPGA 404 I/O 560MBGA Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 1146880 Number of I/O: 404 Number of Gates: 254016 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	Package: 560-LBGA, Metal	Stock5,184	21168	1146880	404	254016	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XCV800-6HQ240C	Xilinx Inc.	IC FPGA 166 I/O 240HQFP Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 166 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP Exposed Pad	Stock5,600	21168	114688	166	888439	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	240-BFQFP Exposed Pad	240-PQFP (32x32)
XCV800-6FG680C	Xilinx Inc.	IC FPGA 512 I/O 680FBGA Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 512 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40x40)	Package: 680-LBGA Exposed Pad	Stock6,464	21168	114688	512	888439	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	680-LBGA Exposed Pad	680-FTEBGA (40x40)
XCV800-6FG676C	Xilinx Inc.	IC FPGA 444 I/O 676FBGA Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 444 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock6,688	21168	114688	444	888439	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	676-BBGA, FCBGA	676-FCBGA (27x27)
XCV800-6BG560C	Xilinx Inc.	IC FPGA 404 I/O 560MBGA Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 404 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	Package: 560-LBGA, Metal	Stock5,680	21168	114688	404	888439	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XCV800-6BG432C	Xilinx Inc.	IC FPGA 316 I/O 432MBGA Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 316 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	Package: 432-LBGA, Metal	Stock3,984	21168	114688	316	888439	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	432-LBGA, Metal	432-MBGA (40x40)
XCV800-5HQ240I	Xilinx Inc.	IC FPGA 166 I/O 240HQFP Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 166 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP Exposed Pad	Stock4,256	21168	114688	166	888439	2.375 V ~ 2.625 V	Surface Mount	-40°C ~ 100°C (TJ)	240-BFQFP Exposed Pad	240-PQFP (32x32)
XCV800-5HQ240C	Xilinx Inc.	IC FPGA 166 I/O 240HQFP Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 166 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP Exposed Pad	Stock22,200	21168	114688	166	888439	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	240-BFQFP Exposed Pad	240-PQFP (32x32)
XCV800-5FG680I	Xilinx Inc.	IC FPGA 512 I/O 680FBGA Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 512 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40x40)	Package: 680-LBGA Exposed Pad	Stock4,784	21168	114688	512	888439	2.375 V ~ 2.625 V	Surface Mount	-40°C ~ 100°C (TJ)	680-LBGA Exposed Pad	680-FTEBGA (40x40)
XCV800-5FG680C	Xilinx Inc.	IC FPGA 512 I/O 680FBGA Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 512 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40x40)	Package: 680-LBGA Exposed Pad	Stock3,648	21168	114688	512	888439	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	680-LBGA Exposed Pad	680-FTEBGA (40x40)
XCV800-5FG676I	Xilinx Inc.	IC FPGA 444 I/O 676FBGA Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 444 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock7,808	21168	114688	444	888439	2.375 V ~ 2.625 V	Surface Mount	-40°C ~ 100°C (TJ)	676-BBGA, FCBGA	676-FCBGA (27x27)
XCV800-5FG676C	Xilinx Inc.	IC FPGA 444 I/O 676FBGA Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 444 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock5,600	21168	114688	444	888439	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	676-BBGA, FCBGA	676-FCBGA (27x27)
XCV800-5BG560I	Xilinx Inc.	IC FPGA 404 I/O 560MBGA Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 404 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	Package: 560-LBGA, Metal	Stock5,056	21168	114688	404	888439	2.375 V ~ 2.625 V	Surface Mount	-40°C ~ 100°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XCV800-5BG560C	Xilinx Inc.	IC FPGA 404 I/O 560MBGA Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 404 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	Package: 560-LBGA, Metal	Stock4,784	21168	114688	404	888439	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XCV800-5BG432I	Xilinx Inc.	IC FPGA 316 I/O 432MBGA Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 316 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	Package: 432-LBGA, Metal	Stock3,408	21168	114688	316	888439	2.375 V ~ 2.625 V	Surface Mount	-40°C ~ 100°C (TJ)	432-LBGA, Metal	432-MBGA (40x40)
XCV800-5BG432C	Xilinx Inc.	IC FPGA 316 I/O 432MBGA Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 316 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	Package: 432-LBGA, Metal	Stock8,928	21168	114688	316	888439	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	432-LBGA, Metal	432-MBGA (40x40)
XCV800-4HQ240I	Xilinx Inc.	IC FPGA 166 I/O 240HQFP Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 166 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP Exposed Pad	Stock5,664	21168	114688	166	888439	2.375 V ~ 2.625 V	Surface Mount	-40°C ~ 100°C (TJ)	240-BFQFP Exposed Pad	240-PQFP (32x32)
XCV800-4HQ240C	Xilinx Inc.	IC FPGA 166 I/O 240HQFP Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 166 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP Exposed Pad	Stock6,176	21168	114688	166	888439	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	240-BFQFP Exposed Pad	240-PQFP (32x32)
XCV800-4FG680I	Xilinx Inc.	IC FPGA 512 I/O 680FBGA Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 512 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40x40)	Package: 680-LBGA Exposed Pad	Stock7,584	21168	114688	512	888439	2.375 V ~ 2.625 V	Surface Mount	-40°C ~ 100°C (TJ)	680-LBGA Exposed Pad	680-FTEBGA (40x40)
XCV800-4FG680C	Xilinx Inc.	IC FPGA 512 I/O 680FBGA Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 512 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40x40)	Package: 680-LBGA Exposed Pad	Stock2,080	21168	114688	512	888439	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	680-LBGA Exposed Pad	680-FTEBGA (40x40)
XCV800-4FG676I	Xilinx Inc.	IC FPGA 444 I/O 676FBGA Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 444 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock3,232	21168	114688	444	888439	2.375 V ~ 2.625 V	Surface Mount	-40°C ~ 100°C (TJ)	676-BBGA, FCBGA	676-FCBGA (27x27)
XCV800-4FG676C	Xilinx Inc.	IC FPGA 444 I/O 676FBGA Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 444 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock5,104	21168	114688	444	888439	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	676-BBGA, FCBGA	676-FCBGA (27x27)
XCV800-4BG560I	Xilinx Inc.	IC FPGA 404 I/O 560MBGA Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 404 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	Package: 560-LBGA, Metal	Stock3,408	21168	114688	404	888439	2.375 V ~ 2.625 V	Surface Mount	-40°C ~ 100°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XCV800-4BG560C	Xilinx Inc.	IC FPGA 404 I/O 560MBGA Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 404 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	Package: 560-LBGA, Metal	Stock9,180	21168	114688	404	888439	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XCV800-4BG432I	Xilinx Inc.	IC FPGA 316 I/O 432MBGA Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 316 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	Package: 432-LBGA, Metal	Stock3,888	21168	114688	316	888439	2.375 V ~ 2.625 V	Surface Mount	-40°C ~ 100°C (TJ)	432-LBGA, Metal	432-MBGA (40x40)
XCV800-4BG432C	Xilinx Inc.	IC FPGA 316 I/O 432MBGA Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 316 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	Package: 432-LBGA, Metal	Stock9,696	21168	114688	316	888439	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	432-LBGA, Metal	432-MBGA (40x40)
XCV600E-8HQ240C	Xilinx Inc.	IC FPGA 158 I/O 240HQFP Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 158 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	Package: 240-BFQFP Exposed Pad	Stock3,984	15552	294912	158	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	240-BFQFP Exposed Pad	240-PQFP (32x32)
XCV600E-8FG900C	Xilinx Inc.	IC FPGA 512 I/O 900FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 512 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 900-BBGA Supplier Device Package: 900-FBGA (31x31)	Package: 900-BBGA	Stock5,424	15552	294912	512	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	900-BBGA	900-FBGA (31x31)