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Xilinx Inc. |
IC FPGA 82 I/O 484FCBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 533MHz, 1.3GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 484-BBGA, FCBGA
- Supplier Device Package: 484-FCBGA (19x19)
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Package: 484-BBGA, FCBGA |
Stock2,880 |
|
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? | - | 256KB | DMA, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq?UltraScale+? FPGA, 103K+ Logic Cells | 0°C ~ 100°C (TJ) | 484-BBGA, FCBGA | 484-FCBGA (19x19) |
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Xilinx Inc. |
IC SOC CORTEX-A9 KINTEX7 484BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 800MHz
- Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-BBGA, FCBGA
- Supplier Device Package: 484-FCBGA (23x23)
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Package: 484-BBGA, FCBGA |
Stock3,120 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | Kintex?-7 FPGA, 125K Logic Cells | -40°C ~ 100°C (TJ) | 484-BBGA, FCBGA | 484-FCBGA (23x23) |
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Xilinx Inc. |
IC FPGA 252 I/O 784FCBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 533MHz, 1.3GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 784-BBGA, FCBGA
- Supplier Device Package: 784-FCBGA (23x23)
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Package: 784-BBGA, FCBGA |
Stock3,776 |
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Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? | - | 256KB | DMA, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq?UltraScale+? FPGA, 103K+ Logic Cells | -40°C ~ 100°C (TJ) | 784-BBGA, FCBGA | 784-FCBGA (23x23) |
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Xilinx Inc. |
IC SOC CORTEX-A9 KINTEX7 676FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 676-BBGA, FCBGA
- Supplier Device Package: 676-FCBGA (27x27)
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Package: 676-BBGA, FCBGA |
Stock4,128 |
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Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Kintex?-7 FPGA, 125K Logic Cells | -40°C ~ 100°C (TJ) | 676-BBGA, FCBGA | 676-FCBGA (27x27) |
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Xilinx Inc. |
IC FPGA 180 I/O 625FCBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 533MHz, 1.3GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 625-BFBGA, FCBGA
- Supplier Device Package: 625-FCBGA (21x21)
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Package: 625-BFBGA, FCBGA |
Stock2,096 |
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Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? | - | 256KB | DMA, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq?UltraScale+? FPGA, 103K+ Logic Cells | -40°C ~ 100°C (TJ) | 625-BFBGA, FCBGA | 625-FCBGA (21x21) |
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Xilinx Inc. |
IC FPGA 252 I/O 784FCBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.5GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 784-BBGA, FCBGA
- Supplier Device Package: 784-FCBGA (23x23)
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Package: 784-BBGA, FCBGA |
Stock2,640 |
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Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? | - | 256KB | DMA, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.5GHz | Zynq?UltraScale+? FPGA, 103K+ Logic Cells | 0°C ~ 100°C (TJ) | 784-BBGA, FCBGA | 784-FCBGA (23x23) |
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Xilinx Inc. |
IC FPGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-FBGA
- Supplier Device Package: 485-FBGA (19x19)
|
Package: 484-FBGA |
Stock7,936 |
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Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Kintex?-7 FPGA, 125K Logic Cells | -40°C ~ 100°C (TJ) | 484-FBGA | 485-FBGA (19x19) |
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Xilinx Inc. |
IC SOC CORTEX A-9 ZYNQ7 485BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-FBGA
- Supplier Device Package: 485-FBGA (19x19)
|
Package: 484-FBGA |
Stock5,424 |
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Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Kintex?-7 FPGA, 125K Logic Cells | -40°C ~ 100°C (TJ) | 484-FBGA | 485-FBGA (19x19) |
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Xilinx Inc. |
IC FPGA 180 I/O 625FCBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.5GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 625-BFBGA, FCBGA
- Supplier Device Package: 625-FCBGA (21x21)
|
Package: 625-BFBGA, FCBGA |
Stock5,184 |
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Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? | - | 256KB | DMA, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.5GHz | Zynq?UltraScale+? FPGA, 103K+ Logic Cells | 0°C ~ 100°C (TJ) | 625-BFBGA, FCBGA | 625-FCBGA (21x21) |
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Xilinx Inc. |
IC FPGA 82 I/O 484FCBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 533MHz, 1.3GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-BBGA, FCBGA
- Supplier Device Package: 484-FCBGA (19x19)
|
Package: 484-BBGA, FCBGA |
Stock4,704 |
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Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? | - | 256KB | DMA, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq?UltraScale+? FPGA, 103K+ Logic Cells | -40°C ~ 100°C (TJ) | 484-BBGA, FCBGA | 484-FCBGA (19x19) |
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Xilinx Inc. |
IC FPGA 82 I/O 484FCBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.5GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 484-BBGA, FCBGA
- Supplier Device Package: 484-FCBGA (19x19)
|
Package: 484-BBGA, FCBGA |
Stock4,032 |
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Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? | - | 256KB | DMA, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.5GHz | Zynq?UltraScale+? FPGA, 103K+ Logic Cells | 0°C ~ 100°C (TJ) | 484-BBGA, FCBGA | 484-FCBGA (19x19) |
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Xilinx Inc. |
IC FPGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-BBGA, FCBGA
- Supplier Device Package: 484-FCBGA (23x23)
|
Package: 484-BBGA, FCBGA |
Stock3,280 |
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Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Kintex?-7 FPGA, 125K Logic Cells | -40°C ~ 100°C (TJ) | 484-BBGA, FCBGA | 484-FCBGA (23x23) |
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Xilinx Inc. |
IC FPGA 252 I/O 784FCBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 533MHz, 1.3GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 784-BBGA, FCBGA
- Supplier Device Package: 784-FCBGA (23x23)
|
Package: 784-BBGA, FCBGA |
Stock6,832 |
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Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? | - | 256KB | DMA, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq?UltraScale+? FPGA, 103K+ Logic Cells | 0°C ~ 100°C (TJ) | 784-BBGA, FCBGA | 784-FCBGA (23x23) |
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Xilinx Inc. |
IC FPGA 180 I/O 625FCBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 533MHz, 1.3GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 625-BFBGA, FCBGA
- Supplier Device Package: 625-FCBGA (21x21)
|
Package: 625-BFBGA, FCBGA |
Stock3,328 |
|
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? | - | 256KB | DMA, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq?UltraScale+? FPGA, 103K+ Logic Cells | 0°C ~ 100°C (TJ) | 625-BFBGA, FCBGA | 625-FCBGA (21x21) |
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Xilinx Inc. |
PROGRAMMABLE SOC
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-LFBGA, CSPBGA
- Supplier Device Package: 484-CSPBGA (19x19)
|
Package: 484-LFBGA, CSPBGA |
Stock4,576 |
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Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Artix?-7 FPGA, 85K Logic Cells | -40°C ~ 100°C (TJ) | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) |
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Xilinx Inc. |
IC FPGA 82 I/O 484FCBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 533MHz, 1.3GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 484-BBGA, FCBGA
- Supplier Device Package: 484-FCBGA (19x19)
|
Package: 484-BBGA, FCBGA |
Stock2,336 |
|
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? | - | 256KB | DMA, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq?UltraScale+? FPGA, 103K+ Logic Cells | 0°C ~ 100°C (TJ) | 484-BBGA, FCBGA | 484-FCBGA (19x19) |
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Xilinx Inc. |
IC SOC CORTEX-A9 ARTIX-7 485BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 866MHz
- Primary Attributes: Artix?-7 FPGA, 74K Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 484-LFBGA, CSPBGA
- Supplier Device Package: 485-CSBGA (19x19)
|
Package: 484-LFBGA, CSPBGA |
Stock3,856 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 866MHz | Artix?-7 FPGA, 74K Logic Cells | 0°C ~ 100°C (TJ) | 484-LFBGA, CSPBGA | 485-CSBGA (19x19) |
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Xilinx Inc. |
IC SOC CORTEX-A9 ARTIX-7 484BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 866MHz
- Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 484-LFBGA, CSPBGA
- Supplier Device Package: 484-CSPBGA (19x19)
|
Package: 484-LFBGA, CSPBGA |
Stock6,128 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 866MHz | Artix?-7 FPGA, 85K Logic Cells | 0°C ~ 100°C (TJ) | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) |
|
|
Xilinx Inc. |
IC FPGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 766MHz
- Primary Attributes: Artix?-7 FPGA, 74K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-LFBGA, CSPBGA
- Supplier Device Package: 484-CSPBGA (19x19)
|
Package: 484-LFBGA, CSPBGA |
Stock5,136 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 766MHz | Artix?-7 FPGA, 74K Logic Cells | -40°C ~ 100°C (TJ) | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) |
|
|
Xilinx Inc. |
IC SOC CORTEX-A9 ARTIX7 485BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Artix?-7 FPGA, 74K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-LFBGA, CSPBGA
- Supplier Device Package: 485-CSBGA (19x19)
|
Package: 484-LFBGA, CSPBGA |
Stock3,520 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Artix?-7 FPGA, 74K Logic Cells | -40°C ~ 100°C (TJ) | 484-LFBGA, CSPBGA | 485-CSBGA (19x19) |
|
|
Xilinx Inc. |
IC SOC CORTEX-A9 ARTIX-7 485BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 766MHz
- Primary Attributes: Artix?-7 FPGA, 74K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-LFBGA, CSPBGA
- Supplier Device Package: 485-CSBGA (19x19)
|
Package: 484-LFBGA, CSPBGA |
Stock2,368 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 766MHz | Artix?-7 FPGA, 74K Logic Cells | -40°C ~ 100°C (TJ) | 484-LFBGA, CSPBGA | 485-CSBGA (19x19) |
|
|
Xilinx Inc. |
IC SOC CORTEX-A9 KINTEX7 484BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-LFBGA, CSPBGA
- Supplier Device Package: 484-CSPBGA (19x19)
|
Package: 484-LFBGA, CSPBGA |
Stock2,048 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Artix?-7 FPGA, 85K Logic Cells | -40°C ~ 100°C (TJ) | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) |
|
|
Xilinx Inc. |
IC SOC CORTEX-A9 ARTIX-7 485BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 766MHz
- Primary Attributes: Artix?-7 FPGA, 74K Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 484-LFBGA, CSPBGA
- Supplier Device Package: 485-CSBGA (19x19)
|
Package: 484-LFBGA, CSPBGA |
Stock3,744 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 766MHz | Artix?-7 FPGA, 74K Logic Cells | 0°C ~ 100°C (TJ) | 484-LFBGA, CSPBGA | 485-CSBGA (19x19) |
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|
Xilinx Inc. |
IC SOC CORTEX-A9 ARTIX-7 400BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 866MHz
- Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 400-LFBGA, CSPBGA
- Supplier Device Package: 400-CSPBGA (17x17)
|
Package: 400-LFBGA, CSPBGA |
Stock6,704 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 866MHz | Artix?-7 FPGA, 85K Logic Cells | 0°C ~ 100°C (TJ) | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) |
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|
Xilinx Inc. |
IC SOC CORTEX-A9 KINTEX7400BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 400-LFBGA, CSPBGA
- Supplier Device Package: 400-CSPBGA (17x17)
|
Package: 400-LFBGA, CSPBGA |
Stock6,656 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Artix?-7 FPGA, 85K Logic Cells | -40°C ~ 100°C (TJ) | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) |
|
|
Xilinx Inc. |
IC FPGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Artix?-7 FPGA, 74K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-LFBGA, CSPBGA
- Supplier Device Package: 484-CSPBGA (19x19)
|
Package: 484-LFBGA, CSPBGA |
Stock4,832 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Artix?-7 FPGA, 74K Logic Cells | -40°C ~ 100°C (TJ) | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) |
|
|
Xilinx Inc. |
IC SOC CORTEX A-9 ZYNQ7 400BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
- Operating Temperature: -40°C ~ 125°C (TJ)
- Package / Case: 400-LFBGA, CSPBGA
- Supplier Device Package: 400-CSPBGA (17x17)
|
Package: 400-LFBGA, CSPBGA |
Stock5,760 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Artix?-7 FPGA, 85K Logic Cells | -40°C ~ 125°C (TJ) | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) |
|
|
Xilinx Inc. |
IC SOC CORTEX-A9 ARTIX-7 485BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Artix?-7 FPGA, 74K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-LFBGA, CSPBGA
- Supplier Device Package: 485-CSBGA (19x19)
|
Package: 484-LFBGA, CSPBGA |
Stock2,816 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Artix?-7 FPGA, 74K Logic Cells | -40°C ~ 100°C (TJ) | 484-LFBGA, CSPBGA | 485-CSBGA (19x19) |