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Xilinx Inc. |
IC SOC CORTEX-A9 ARTIX-7 484BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 766MHz
- Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-LFBGA, CSPBGA
- Supplier Device Package: 484-CSPBGA (19x19)
|
Package: 484-LFBGA, CSPBGA |
Stock10,644 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 766MHz | Artix?-7 FPGA, 85K Logic Cells | -40°C ~ 100°C (TJ) | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) |
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|
Xilinx Inc. |
IC SOC CORTEX-A9 ARTIX-7 484BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 766MHz
- Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 484-LFBGA, CSPBGA
- Supplier Device Package: 484-CSPBGA (19x19)
|
Package: 484-LFBGA, CSPBGA |
Stock6,612 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 766MHz | Artix?-7 FPGA, 85K Logic Cells | 0°C ~ 100°C (TJ) | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) |
|
|
Xilinx Inc. |
IC SOC CORTEX-A9 ARTIX-7 400BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 766MHz
- Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 400-LFBGA, CSPBGA
- Supplier Device Package: 400-CSPBGA (17x17)
|
Package: 400-LFBGA, CSPBGA |
Stock6,144 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 766MHz | Artix?-7 FPGA, 85K Logic Cells | -40°C ~ 100°C (TJ) | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) |
|
|
Xilinx Inc. |
IC SOC CORTEX-A9 ARTIX-7 484BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-LFBGA, CSPBGA
- Supplier Device Package: 484-CSPBGA (19x19)
|
Package: 484-LFBGA, CSPBGA |
Stock9,228 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Artix?-7 FPGA, 85K Logic Cells | -40°C ~ 100°C (TJ) | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) |
|
|
Xilinx Inc. |
IC SOC CORTEX-A9 ARTIX-7 485BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Artix?-7 FPGA, 74K Logic Cells
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-LFBGA, CSPBGA
- Supplier Device Package: 485-CSBGA (19x19)
|
Package: 484-LFBGA, CSPBGA |
Stock6,896 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Artix?-7 FPGA, 74K Logic Cells | 0°C ~ 85°C (TJ) | 484-LFBGA, CSPBGA | 485-CSBGA (19x19) |
|
|
Xilinx Inc. |
IC SOC CORTEX-A9 ARTIX-7 484BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-LFBGA, CSPBGA
- Supplier Device Package: 484-CSPBGA (19x19)
|
Package: 484-LFBGA, CSPBGA |
Stock7,616 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Artix?-7 FPGA, 85K Logic Cells | 0°C ~ 85°C (TJ) | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) |
|
|
Xilinx Inc. |
IC SOC CORTEX-A9 ARTIX-7 400BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 400-LFBGA, CSPBGA
- Supplier Device Package: 400-CSPBGA (17x17)
|
Package: 400-LFBGA, CSPBGA |
Stock5,600 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Artix?-7 FPGA, 85K Logic Cells | 0°C ~ 85°C (TJ) | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) |
|
|
Xilinx Inc. |
IC SOC CORTEX-A9 ARTIX-7 400BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 766MHz
- Primary Attributes: Artix?-7 FPGA, 28K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 400-LFBGA, CSPBGA
- Supplier Device Package: 400-CSPBGA (17x17)
|
Package: 400-LFBGA, CSPBGA |
Stock7,944 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 766MHz | Artix?-7 FPGA, 28K Logic Cells | -40°C ~ 100°C (TJ) | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) |
|
|
Xilinx Inc. |
IC SOC CORTEX-A9 ARTIX-7 225BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 766MHz
- Primary Attributes: Artix?-7 FPGA, 28K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 225-LFBGA, CSPBGA
- Supplier Device Package: 225-CSPBGA (13x13)
|
Package: 225-LFBGA, CSPBGA |
Stock6,852 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 766MHz | Artix?-7 FPGA, 28K Logic Cells | -40°C ~ 100°C (TJ) | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) |
|
|
Xilinx Inc. |
IC SOC CORTEX-A9 ARTIX-7 400BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Artix?-7 FPGA, 28K Logic Cells
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 400-LFBGA, CSPBGA
- Supplier Device Package: 400-CSPBGA (17x17)
|
Package: 400-LFBGA, CSPBGA |
Stock11,988 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Artix?-7 FPGA, 28K Logic Cells | 0°C ~ 85°C (TJ) | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) |
|
|
Xilinx Inc. |
IC SOC CORTEX-A9 ARTIX-7 225BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Artix?-7 FPGA, 28K Logic Cells
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 225-LFBGA, CSPBGA
- Supplier Device Package: 225-CSPBGA (13x13)
|
Package: 225-LFBGA, CSPBGA |
Stock8,196 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Artix?-7 FPGA, 28K Logic Cells | 0°C ~ 85°C (TJ) | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) |
|
|
Xilinx Inc. |
XAZU3EG-1SFVC784Q
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Stock7,792 |
|
- | - | - | - | - | - | - | - | - | - |
|
|
Xilinx Inc. |
XAZU3EG-1SFVA625Q
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Stock5,424 |
|
- | - | - | - | - | - | - | - | - | - |
|
|
Xilinx Inc. |
IC SOC CORTEX-A9 KINTEX7 676FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: -
- Peripherals: DMA
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 800MHz
- Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 676-BBGA, FCBGA
- Supplier Device Package: 676-FCBGA (27x27)
|
Package: 676-BBGA, FCBGA |
Stock3,360 |
|
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | - | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | Kintex™-7 FPGA, 125K Logic Cells | -40°C ~ 100°C (TJ) | 676-BBGA, FCBGA | 676-FCBGA (27x27) |
|
|
Xilinx Inc. |
IC FPGA XC ZYNQ-7000 676FCBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 676-BBGA, FCBGA
- Supplier Device Package: 676-FCBGA (27x27)
|
Package: 676-BBGA, FCBGA |
Stock7,744 |
|
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Kintex™-7 FPGA, 125K Logic Cells | -40°C ~ 100°C (TJ) | 676-BBGA, FCBGA | 676-FCBGA (27x27) |
|
|
Xilinx Inc. |
XAZU2EG-1SFVC784Q
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Stock2,624 |
|
- | - | - | - | - | - | - | - | - | - |
|
|
Xilinx Inc. |
XAZU2EG-1SFVA625Q
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Stock5,952 |
|
- | - | - | - | - | - | - | - | - | - |
|
|
Xilinx Inc. |
VIRTEX-7 FBGA BLOCK 484BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
- Operating Temperature: -40°C ~ 125°C (TJ)
- Package / Case: 484-BBGA, FCBGA
- Supplier Device Package: 484-FCBGA (23x23)
|
Package: 484-BBGA, FCBGA |
Stock2,416 |
|
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Kintex™-7 FPGA, 125K Logic Cells | -40°C ~ 125°C (TJ) | 484-BBGA, FCBGA | 484-FCBGA (23x23) |
|
|
Xilinx Inc. |
IC SOC CORTEX A-9 ZYNQ7 400BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: -
- Peripherals: DMA
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Artix™-7 FPGA, 28K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 400-LFBGA, CSPBGA
- Supplier Device Package: 400-CSPBGA (17x17)
|
Package: 400-LFBGA, CSPBGA |
Stock3,952 |
|
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | - | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Artix™-7 FPGA, 28K Logic Cells | -40°C ~ 100°C (TJ) | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) |
|
|
Xilinx Inc. |
XAZU3EG-L1SFVC784I
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Stock6,176 |
|
- | - | - | - | - | - | - | - | - | - |
|
|
Xilinx Inc. |
XAZU3EG-L1SFVA625I
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Stock4,400 |
|
- | - | - | - | - | - | - | - | - | - |
|
|
Xilinx Inc. |
XAZU3EG-1SFVC784I
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: 784-BFBGA, FCBGA
- Supplier Device Package: 784-FCBGA (23x23)
|
Package: 784-BFBGA, FCBGA |
Stock4,416 |
|
- | - | - | - | - | - | - | - | 784-BFBGA, FCBGA | 784-FCBGA (23x23) |
|
|
Xilinx Inc. |
XAZU3EG-1SFVA625I
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: 625-BFBGA, FCBGA
- Supplier Device Package: 625-FCBGA (21x21)
|
Package: 625-BFBGA, FCBGA |
Stock6,080 |
|
- | - | - | - | - | - | - | - | 625-BFBGA, FCBGA | 625-FCBGA (21x21) |
|
|
Xilinx Inc. |
XAZU2EG-L1SFVC784I
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Stock7,264 |
|
- | - | - | - | - | - | - | - | - | - |
|
|
Xilinx Inc. |
XAZU2EG-L1SFVA625I
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Stock5,440 |
|
- | - | - | - | - | - | - | - | - | - |
|
|
Xilinx Inc. |
XAZU2EG-1SFVC784I
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: 784-BFBGA, FCBGA
- Supplier Device Package: 784-FCBGA (23x23)
|
Package: 784-BFBGA, FCBGA |
Stock7,488 |
|
- | - | - | - | - | - | - | - | 784-BFBGA, FCBGA | 784-FCBGA (23x23) |
|
|
Xilinx Inc. |
XAZU2EG-1SFVA625I
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: 625-BFBGA, FCBGA
- Supplier Device Package: 625-FCBGA (21x21)
|
Package: 625-BFBGA, FCBGA |
Stock6,204 |
|
- | - | - | - | - | - | - | - | 625-BFBGA, FCBGA | 625-FCBGA (21x21) |
|
|
Xilinx Inc. |
IC SOC CORTEX-A53 484FCBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- Flash Size: -
- RAM Size: 1.2MB
- Peripherals: DMA, WDT
- Connectivity: CANbus, I²C, SPI, UART/USART, USB
- Speed: 500MHz, 1.2GHz
- Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
- Operating Temperature: -40°C ~ 125°C (TJ)
- Package / Case: 484-BFBGA, FCBGA
- Supplier Device Package: 484-FCBGA (19x19)
|
Package: 484-BFBGA, FCBGA |
Stock6,512 |
|
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 1.2MB | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | -40°C ~ 125°C (TJ) | 484-BFBGA, FCBGA | 484-FCBGA (19x19) |