Latest Technologies of Infineon Technologies

Records 149

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2022-05-23, Highest power density 1700V IGBT7 allowing multiple applications

Infineon Technologies currently offers the new TRENCHSTOP 1700V IGBT7 chip in the standard industrial package EconoDUAL 3. Compared to previous IGBT4 chipset modules, FF900R17ME7_B11 with this chip can achieve up to 40% inverter output current at the same package size. The new module also provides significantly lower static and dynamic losses, while addressing the application of static losses that are common in diode chips
2022-05-18, New battery management integrated circuit provides superior measurement performance

Feiling Technology Co., LTD has launched a new battery management IC series, including TLE9012DQU and TLE9015DQU. The new battery management IC is a competitive system-level solution for battery module, battery to battery pack, and battery to vehicle battery topology. The device is suitable for a wide range of industrial, consumer and automotive applications such as MHEV, HEV, PHEV and BEV. TLE9015DQU is a battery monitoring transceiver IC used to connect several TLE9012DQU devices within the Daisy chain of lithium ion batteries.
2022-05-13, SiC MOSFET uses enhancements to achieve maximum system efficiency

Infineon Technologies has released a new CoolSiC technology: the CoolSiC MOSFET 1200V M1H. Recent advances in CoolSiC base technology allow for an exceptionally large gate operating window, increasing the on resistance for a given die size. The device will be integrated into the Easy family, further enhancing the Easy 1B and 2B modules. In addition to the Easy module family, the M1H portfolio includes new ultra-low pass resistors of 7mOhm, 14mOhm and 20mOhm in to247-3 and TO247-4 discrete packages
2022-05-05, Provide power management solutions that drive superior performance and energy efficiency

Infineon Technologies has introduced a complete compute server power management system based on the Intel Sapphire Rapids CPU. The XDP Ultra-transient phase XDPE152 series controllers are based on the ultra-low-power Arm Cortex-M0 for maximum flexibility and optimized performance across workloads and ultra-fast dynamic load response times. The TDA215xx series OptiMOS integrated power class leverages industry's best OptiMOS 6 technology to deliver superior efficiency (& GT; 95%) and reliability, significantly reducing system cooling and maintenance costs.
2022-04-27, The platform provides automatic life estimation for selecting semiconductor components

Infineon Power Simulation Platform (IPOSIM) is a power simulation platform launched by Infineon Technologies Inc., which provides analysis of individual operating points and user-defined load profiles. A total of 19 disk and module topologies are provided, grouped by power conversion type. A user-friendly GUI was created to guide the designer through a step-by-step process of simulation of electrical equipment. With these features, it helps to select the right high-power product according to the needs of the application.
2022-04-21, A novel automotive IGBT is used in discrete traction inverters

Infineon Technologies has launched the EDT2 IGBT in TO247PLUS package. The device optimizes discrete traction inverters for automobiles and expands the portfolio of discrete high voltage devices for automotive applications. Rated current 120A and 200A, the discrete EDT2 IGBT has very low forward voltage at 100C and can reduce on-loss by up to 13% compared to the previous generation. In addition, EDT2 IGBT provides a very narrow parameter distribution.
2022-04-17, Multifunctional short circuit protection for power electronic systems

Infineon Technologies Co., LTD has launched the F3 Enhanced (1ED332x) series independent EiceDRIVER enhanced gated drive. The unit is installed in a 300mil wide-body DSO 16 package with a significant leakage distance of 8mm. Single-channel isolated gate drivers have CMTI of up to 300kV/us and typical output current of up to 8.5a. Devices are created for a wide power range and support an absolute maximum output voltage of 40V
2022-04-13, Class D audio amplifier modules feature small size and radiation-free operation

Infineon Technologies Inc. now offers the MERUS dual-channel, analog input, Class D Audio Amplifier Multi-chip Module (MCM) MA5332MS. The device comes in a compact 7mm x 7mm2 42-pin QFN package that integrates a two-channel PWM controller, a high-voltage gate driver, and four low R DS(ON) MOSFEts. As a highly integrated MCM, it also contains a protection circuit, with over current, over temperature self-reset under voltage protection
2022-04-02, The new MCU speeds up the electrification and digitization of vehicles

Infineon Technologies ag has launched a new generation of AURIX MCU family products, the TC4x family promotes trends in mobile, ADAS, automotive E/E architectures and affordable AI applications. AURIX has established itself as an automotive architecture for high growth and safety-critical applications, including powertrain, safety, assist and autonomous driving, and domain or area control. Its scalable home concept is an important part of reliable electronic and software-based applications.
2022-03-26, Wireless charging security solutions for automotive applications

Infineon technologies has created a security solution for automotive wireless charging: The OPTIGA Trust Charge vehicle complies with version 1.3 of the WPC Qi standard, which requires strong password authentication of up to 15W for wireless charging. And is an embedded security solution with WPC-compatible supply and undo services, as well as compliance with Qi 1.3 encryption features such as ECDSA, NIST-P256 and SHA-256, and also allows manufacturers of wireless chargers or dedicated subsystems to do a quick and simple design according to the latest Qi security requirements
2022-02-20, Single-Stage Flyback Controller Optimizes Cost-Effective Smart LED Drivers

ICL88xx series of adapters and chargers, flat screen TV, all-in-one and gain up to 125W display. All three solutions provide benchmark performance for PFC and total harmonic distortion under full load and low load conditions, facilitating platform designs and window drivers. The series offers external start circuit control signals, a bottom-up platform design for greater flexibility and cost optimization, and also offers a comprehensive set of protection features. The series provides external start circuit control signals for greater flexibility
2022-02-11, Combined chips bring high-performance connectivity for new satellite navigation

The TomTom GO Discover is considered one of the fastest and most powerful satellite navigation systems on the market today. The satellite navigation has 5 ", 6 "and 7" displays and utilizes infineon's AIROC CYW43455 Wi-Fi and Bluetooth combination chip. The wireless solution integrates wi-Fi-5 (802.11AC) and Bluetooth 5.0 on a single chip, providing fast and robust wireless connectivity critical to navigation devices and enabling reliable, high-performance connectivity.
2022-02-06, The TOLL series offers improved robustness and extended life

Applications including e-scooters, e-forklifts and other LEVs, as well as power tools and battery management systems, necessitate high current rating, ruggedness and extended lifetime. Infineon Technologies AG answers these demands by providing more choices to power system designers to satisfy diverse design requirements and deliver maximum performance in the smallest space.
2022-02-05, Single channel door drive IC series integrated electrical isolation

Infineon's growing portfolio of single-channel door drive ics now includes the new EiceDRIVER 1EDB single-channel door drive ICS family, providing 3kVrms (UL 1577) of current input-output isolation. The new series consists of four sections (1EDB6275F, 1EDB7275F, 1EDB8275F and 1EDB9275F) and is optimized for high/low side applications. All products offer independent and very low ohm (0.95 ohms) sources and (0.48 ohms)sink outputs for ease of design, providing the typical drive strength of 5.4a peak source and 9.8A peak sink
2022-01-27, New traction inverter power module

Infineon Technologies has introduced a simple backpack with automotive performance 2B EDT2, a flexible, retractable half-bridge power module. Another unique feature of this module is the plug-and-play approach, which simplifies module integration.
2022-01-21, The new compensation package based on 40nm technology provides superior contactless performance

Infineon Technologies AG has launched its SECORA Pay payment solution based on the latest 40nm technology platform. The plug and play solution draws on extensive expertise in contactless payment technology and uses its SOLID FLASH chip platform. Offers components including new applets and custom value-added products standard payment cards (SECORA Payment S), as well as multi-application cards (SECORA Payment X) and off-the-shelf solutions
2022-01-19, First space-grade FPGA radiation-resistant NOR flash

To meet the growing demand for high reliability memory, Infineon Technologies has announced the industry's first high-density RadTol NOR flash product that conforms to the MIL-PRF-38535 QML-V process (QML-V equivalent). The 256Mb and 512Mb RadTol NOR Flash non-volatile memory provides superior, low-pin number, single-chip solutions for applications including FPGA configuration, image storage, microcontroller data, and startup code storage. The device can be programmed in the system via FPGA or standalone programmer and is offered in the same 36-lead ceramic flat package
2022-01-15, Supports higher power USB PD 3.1 high voltage MCU

Infineon Technologies has launched the industry's first high-voltage MCU supporting USBPD 3.1. Ez-pd PMG1 (Power Delivery Microcontroller Gen1) is the company's first GENERATION USB PD MCU and supports higher Power capabilities as defined in the USB PD 3.1 specification. The series also integrates a market-proven USB PD stack to promote reliable performance and interoperability. Help consumers make their daily lives easier, safer and more environmentally friendly

Latest Technologies of Infineon Technologies

2022-05-23, Highest power density 1700V IGBT7 allowing multiple applications

2022-05-18, New battery management integrated circuit provides superior measurement performance

2022-05-13, SiC MOSFET uses enhancements to achieve maximum system efficiency

2022-05-05, Provide power management solutions that drive superior performance and energy efficiency

2022-04-27, The platform provides automatic life estimation for selecting semiconductor components

2022-04-21, A novel automotive IGBT is used in discrete traction inverters

2022-04-17, Multifunctional short circuit protection for power electronic systems

2022-04-13, Class D audio amplifier modules feature small size and radiation-free operation

2022-04-02, The new MCU speeds up the electrification and digitization of vehicles

2022-03-26, Wireless charging security solutions for automotive applications

2022-02-20, Single-Stage Flyback Controller Optimizes Cost-Effective Smart LED Drivers

2022-02-11, Combined chips bring high-performance connectivity for new satellite navigation

2022-02-06, The TOLL series offers improved robustness and extended life

2022-02-05, Single channel door drive IC series integrated electrical isolation

2022-01-27, New traction inverter power module

2022-01-21, The new compensation package based on 40nm technology provides superior contactless performance

2022-01-19, First space-grade FPGA radiation-resistant NOR flash

2022-01-15, Supports higher power USB PD 3.1 high voltage MCU