Embedded flash for devices that require high density | Heisener Electronics
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Embedded flash for devices that require high density

Post Date: 2022-04-05 , Kionix Inc.
Technology Cover

    Kioxia Europe GmbH has released a version of UFS. 3.1 Embedded flash devices adopt its innovative 4-bit 4-level cell technology. For applications that require high density, such as cutting-edge smartphones, QLC technology provides the ability to achieve the highest density in a single package.

   The UFS PoC is a 512GB prototype equipped with 1TB (128GB) BiCS FLASH 3D FLASH with QLC technology. PoC devices are designed to meet the increasing performance and density requirements of mobile applications, which are driven by higher resolution graphics, 5G networks, 4K + video and more.

     Axel Stoermann, VP of Memory Marketing said:"Kioxia has been an inventor and leading supplier of UFS memory since 2013. Since that time,  we focus on expanding our already broad lineup with new UFS Memory products for applications that demand superior  interface performance," "With QLC UFS,  we can offer another solution which will meet the increasing requirements for Flash memory devices," 

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