Infineon has signed a wafer and ingot supply agreement with Chinese silicon carbide supplier Tianke Heda

Infineon Technologies is diversifying its silicon carbide (SiC) supplier system and has entered into a long-term agreement with Chinese sic supplier Beijing Tianke Heda Semiconductor Co., LTD. (" Tianke Heda ") to secure additional and competitive supply of SIC materials. Tianke Heda will supply Infineon with high-quality and competitive 150mm silicon carbide wafers and ingots for manufacturing silicon carbide semiconductor products, which are expected to account for a double-digit share of Infineon's long-term demand.

The agreement between Infineon and Tianke Heda will help ensure the stability of the entire supply chain, meet the growing demand in China for silicon carbide semiconductor products in automotive, solar and electric vehicle charging applications and energy storage systems, and facilitate the rapid development of emerging semiconductor materials. Under the agreement, the first phase will focus on the supply of 150mm silicon carbide materials, but Tianke Heda will also provide 200mm diameter silicon carbide materials to assist Infineon's transition to 200mm diameter wafers.

Ms. Angelique van der Burg, Chief Purchasing Officer, Infineon Technologies, said, "In order to meet the growing demand for silicon carbide, Infineon is significantly increasing capacity at its production sites in Malaysia and Austria. At the same time, in order to provide a comprehensive product offering to our customers, Infineon is currently doubling its investment in silicon carbide technology and product portfolio, and implementing a multi-supplier and multi-country sourcing strategy to enhance its supply chain resilience, benefiting our broad customer base. "We are very pleased to have entered into a competitive agreement with Tenke Huda, whose materials perform exceptionally well."

Yang Jian, General Manager of Tianke Heda, said, "We are very pleased to have Infineon, the world leader in the power semiconductor market, as our customer and look forward to working with Infineon. "We will continue to improve our silicon carbide materials and develop next-generation 8-inch wafer technology. Infineon is an excellent customer in this area."

Infineon is focusing on increasing its silicon carbide production capacity to meet its target of 30 per cent global market share by 2030. Infineon's silicon carbide production capacity is expected to increase tenfold by 2027. Infineon's new facility in Guling, Malaysia, is scheduled to open in 2024 and will complement the capacity of its factory in Filach, Austria. To date, Infineon has supplied silicon carbide semiconductor products to more than 3,600 automotive and industrial customers worldwide.