Lattice - New industrial camera modules features MachXO3 FPGA and sensor bridge

Lattice Semiconductor announced that its MachXO3 FPGA and USB 3.0 sensor bridge reference design has been integrated into Leopard Imaging's new USB 3.0 camera module, a leader in HD embedded cameras. The MachXO3 FPGA and USB 3.0 sensor bridge reference design work together to convert the subLVDS video signal of the image sensor used in the module into a parallel format that can interface with the camera's USB 3.0 controller. The ability to convert video signals into a format compatible with the USB controller makes the embedded camera module available for a variety of industrial systems. "Because of the multiple video standards used in embedded applications, it is vital that we are able to convert these signals into any format required by a particular industrial system," said Bill Pu, president of Leopard Imaging. "Lattice Semiconductor's MachXO3 FPGA provides programmability and bridging in the small form factor required for a USB 3.0 camera module, and its sensor bridge reference design accelerates our ability to integrate Lattice technology into the final product." Deepak Boppana, Director of Product Marketing, Lattice Semiconductor, added: "Camera image sensor interfaces are becoming more and more popular in embedded applications." "Our MachXO3 FPGAs can provide I / O speeds up to 900Mbps, so our customers can even add Convert high-quality video images into any desired format without affecting the performance of the entire video system. " The company said that the reference design can be used for interfacing and bridging of subLVDS, MIPI CSI-2, HiSPi and USB3 FX3 controllers and can be customized according to the application.