The smaller, thinner and lighter FO-USON8 is packaged with 128Mb SPI NOR Flash

Industry leading semiconductor device supplier GigaDevice has announced the launch of SPI NOR Flash GD25LE128EXH in a 3mm×3mm×0.4mm FO-USON8 package with a maximum thickness of only 0.4mm and a capacity of up to 128Mb. It is the smallest plastic packaging product that can be realized in this capacity in the industry at present. It can provide a great deal of compact design freedom while dealing with the needs of large capacity code storage.

In recent years, with the rapid development of the Internet of Things, wearable, health monitoring, Netcom and other applications, the market demand is diverse, not only to provide rich functions in the exquisite and small form of products, but also to have very low power consumption, to ensure that the products work for a long time. As an important code storage unit in these devices, SPI NOR Flash needs to provide smaller, thinner, and lighter product options to meet these changing application requirements.

GD25LE Series SPI NOR Flash is the flagship low-power product of Zhaoyi Innovation. The newly launched 3mm×3mm×0.4mm FO-USON8 GD25LE128EXH product continues the excellent performance of the LE series, with the highest clock frequency of 133MHz. The data throughput is up to 532Mbit/s, which greatly improves the system access speed and startup efficiency of customers. At the same time, the four-channel 133MHz read power consumption is only 6mA, which reduces the power consumption by 45% compared with similar products in the industry and effectively prolonging the battery life of the device.

Moreover, more importantly, GD25LE128EXH realizes the ultra-small size of 128Mb capacity products. Previously, the mainstream package of 128Mb capacity products in the industry is 6mm×5mm×0.8mm WSON8, while GD25LE128EXH adopts the new ultra-small size package of 3mm×3mm×0.4mm. The area is reduced by 70%, the thickness is reduced by 50%, which can significantly save 85% space volume and save material cost.

In addition to a significant increase in size, the 3mm×3mm×0.4mm FO-USON8 GD25LE128EXH is compatible with pins for 3mm×4mm×0.6mm USON8 packages of 64Mb or less, allowing rapid capacity upgrades to 128Mb without having to adjust PCB layout. For schemes with different capacity requirements, the design of compatibility requirements is further simplified.

"As a leading Fabless chip supplier in the industry, Zhaoyi Innovation is not only an advocate of innovative technology, but also a practitioner of advanced technology," said Mr. Chen Hui, Executive Director of Zhaoyi Innovation Storage Business Unit. The first launch of the ultra-small size 3mm×3mm×0.4mm FO-USON8 package 128Mb SPI NOR Flash, perfectly matching the industry's requirements for miniaturization and high integration. And the first product GD25LE128EXH based on this packaging technology has low power consumption characteristics, which makes it suitable for any battery powered product design. In the future, with the continuous upgrading of intelligent devices, Zhayi Innovation predicts that SPI NOR Flash products with large capacity, small size and low power consumption will continue to be needed by the industry. In response to this trend, the company is planning to develop other storage products in smaller sizes with advanced packaging and storage technologies to provide customers with more diverse options."