|
|
|
3M |
CONN SOCKET QFN 88POS GOLD
- Type: QFN
- Number of Positions or Pins (Grid): 88 (4 x 22)
- Pitch - Mating: 0.016" (0.40mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.016" (0.40mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES)
- Operating Temperature: -
|
Package: - |
Stock6,156 |
|
88 (4 x 22) | 0.016" (0.40mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.016" (0.40mm) | Gold | - | Beryllium Copper | Polyethersulfone (PES) | - |
|
|
|
3M |
CONN SOCKET QFN 48POS GOLD
- Type: QFN
- Number of Positions or Pins (Grid): 48 (4 x 12)
- Pitch - Mating: 0.016" (0.40mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES)
- Operating Temperature: -
|
Package: - |
Stock6,156 |
|
48 (4 x 12) | 0.016" (0.40mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) | - |
|
|
|
3M |
CONN SOCKET PGA ZIF 441POS GOLD
- Type: PGA, ZIF (ZIP)
- Number of Positions or Pins (Grid): 441 (21 x 21)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: -
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES)
- Operating Temperature: -55°C ~ 150°C
|
Package: - |
Stock8,226 |
|
441 (21 x 21) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
|
|
3M |
CONN SOCKET QFN 32POS GOLD
- Type: QFN
- Number of Positions or Pins (Grid): 32 (4 x 8)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES)
- Operating Temperature: -
|
Package: - |
Stock8,892 |
|
32 (4 x 8) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) | - |
|
|
|
3M |
CONN SOCKET PGA ZIF 121POS GOLD
- Type: PGA, ZIF (ZIP)
- Number of Positions or Pins (Grid): 121 (11 x 11)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: -
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES)
- Operating Temperature: -55°C ~ 150°C
|
Package: - |
Stock9,084 |
|
121 (11 x 11) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
|
|
3M |
CONN SOCKET PGA ZIF 169POS GOLD
- Type: PGA, ZIF (ZIP)
- Number of Positions or Pins (Grid): 169 (13 x 13)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: -
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES)
- Operating Temperature: -55°C ~ 150°C
|
Package: - |
Stock6,288 |
|
169 (13 x 13) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
|
|
3M |
CONN SOCKET SIP ZIF 20POS GOLD
- Type: SIP, ZIF (ZIP)
- Number of Positions or Pins (Grid): 20 (1 x 20)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: -
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock7,932 |
|
20 (1 x 20) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
|
3M |
CONN SOCKET SOIC 28POS GOLD
- Type: SOIC
- Number of Positions or Pins (Grid): 28 (2 x 14)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES), Glass Filled
- Operating Temperature: -55°C ~ 150°C
|
Package: - |
Stock6,360 |
|
28 (2 x 14) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | -55°C ~ 150°C |
|
|
|
3M |
CONN TRANSIST TO-3/TO-66 3POS
- Type: Transistor, TO-3 and TO-66
- Number of Positions or Pins (Grid): 3 (Rectangular)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.234" (5.94mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -55°C ~ 150°C
|
Package: - |
Stock6,156 |
|
3 (Rectangular) | - | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.234" (5.94mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | -55°C ~ 150°C |
|
|
|
3M |
CONN IC DIP SOCKET ZIF 40POS GLD
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 40 (2 x 20)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Connector
- Features: Closed Frame
- Termination: Press-Fit
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock6,324 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
|
3M |
CONN IC DIP SOCKET ZIF 32POS GLD
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Connector
- Features: Closed Frame
- Termination: Press-Fit
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock7,884 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
|
3M |
CONN SOCKET SOIC 16POS GOLD
- Type: SOIC
- Number of Positions or Pins (Grid): 16 (2 x 8)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES), Glass Filled
- Operating Temperature: -55°C ~ 150°C
|
Package: - |
Stock6,012 |
|
16 (2 x 8) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | -55°C ~ 150°C |
|
|
|
3M |
CONN SOCKET SOIC 16POS GOLD
- Type: SOIC
- Number of Positions or Pins (Grid): 16 (2 x 8)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES), Glass Filled
- Operating Temperature: -55°C ~ 150°C
|
Package: - |
Stock7,896 |
|
16 (2 x 8) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | -55°C ~ 150°C |
|
|
|
3M |
CONN IC DIP SOCKET ZIF 48POS GLD
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 48 (2 x 24)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Connector
- Features: Closed Frame
- Termination: Press-Fit
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock13,524 |
|
48 (2 x 24) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
|
3M |
CONN SOCKET SOIC 14POS GOLD
- Type: SOIC
- Number of Positions or Pins (Grid): 14 (2 x 7)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES), Glass Filled
- Operating Temperature: -55°C ~ 150°C
|
Package: - |
Stock7,404 |
|
14 (2 x 7) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | -55°C ~ 150°C |
|
|
|
3M |
CONN SOCKET SOIC 8POS GOLD
- Type: SOIC
- Number of Positions or Pins (Grid): 8 (2 x 4)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES), Glass Filled
- Operating Temperature: -55°C ~ 150°C
|
Package: - |
Stock22,776 |
|
8 (2 x 4) | - | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | -55°C ~ 150°C |
|
|
|
3M |
CONN IC DIP SOCKET ZIF 40POS GLD
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 40 (2 x 20)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Connector
- Features: Closed Frame
- Termination: Press-Fit
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock7,584 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
|
3M |
CONN IC DIP SOCKET ZIF 28POS GLD
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 28 (2 x 14)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Connector
- Features: Closed Frame
- Termination: Press-Fit
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock8,406 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
|
3M |
CONN IC DIP SOCKET ZIF 16POS GLD
- Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 16 (2 x 8)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Connector
- Features: Closed Frame
- Termination: Press-Fit
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock7,236 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
|
3M |
CONN IC DIP SOCKET ZIF 24POS GLD
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 24 (2 x 12)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Connector
- Features: Closed Frame
- Termination: Press-Fit
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock7,224 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
|
3M |
CONN IC DIP SOCKET ZIF 20POS GLD
- Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 20 (2 x 10)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Connector
- Features: Closed Frame
- Termination: Press-Fit
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock9,444 |
|
20 (2 x 10) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
|
3M |
CONN IC DIP SOCKET ZIF 14POS GLD
- Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 14 (2 x 7)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Connector
- Features: Closed Frame
- Termination: Press-Fit
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock23,460 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
|
3M |
CONN SOCKET PLCC 44POS TIN
- Type: PLCC
- Number of Positions or Pins (Grid): 44 (4 x 11)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 160µin (4.06µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 160µin (4.06µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
- Operating Temperature: -40°C ~ 105°C
|
Package: - |
Stock23,196 |
|
44 (4 x 11) | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
|
|
3M |
CONN SOCKET PLCC 44POS TIN
- Type: PLCC
- Number of Positions or Pins (Grid): 44 (4 x 11)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 160µin (4.06µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 160µin (4.06µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
- Operating Temperature: -40°C ~ 105°C
|
Package: - |
Stock100,662 |
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44 (4 x 11) | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
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3M |
CONN SOCKET PLCC 32POS TIN
- Type: PLCC
- Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 160µin (4.06µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 160µin (4.06µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
- Operating Temperature: -40°C ~ 105°C
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Package: - |
Stock7,140 |
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32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
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3M |
CONN IC DIP SOCKET 28POS TIN
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 28 (2 x 14)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 35µin (0.90µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 35µin (0.90µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyester, Glass Filled
- Operating Temperature: -25°C ~ 85°C
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Package: - |
Stock109,938 |
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28 (2 x 14) | 0.100" (2.54mm) | Tin | 35µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 35µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled | -25°C ~ 85°C |
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3M |
CONN IC DIP SOCKET 14POS TIN
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 14 (2 x 7)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 35µin (0.90µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 35µin (0.90µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyester, Glass Filled
- Operating Temperature: -25°C ~ 85°C
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Package: - |
Stock98,028 |
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14 (2 x 7) | 0.100" (2.54mm) | Tin | 35µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 35µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled | -25°C ~ 85°C |
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3M |
CONN IC DIP SOCKET 16POS TIN
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 16 (2 x 8)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 35µin (0.90µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 35µin (0.90µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyester, Glass Filled
- Operating Temperature: -25°C ~ 85°C
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Package: - |
Stock109,494 |
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16 (2 x 8) | 0.100" (2.54mm) | Tin | 35µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 35µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled | -25°C ~ 85°C |
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