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3M |
CONN IC DIP SOCKET 42POS TIN
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 42 (2 x 21)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 135µin (3.43µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 135µin (3.43µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyester, Glass Filled
- Operating Temperature: -25°C ~ 85°C
|
Package: - |
Stock6,714 |
|
42 (2 x 21) | 0.100" (2.54mm) | Tin | 135µin (3.43µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 135µin (3.43µm) | Phosphor Bronze | Polyester, Glass Filled | -25°C ~ 85°C |
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3M |
CONN IC DIP SOCKET 32POS TIN
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 35µin (0.90µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 35µin (0.90µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyester, Glass Filled
- Operating Temperature: -25°C ~ 85°C
|
Package: - |
Stock3,690 |
|
32 (2 x 16) | 0.100" (2.54mm) | Tin | 35µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 35µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled | -25°C ~ 85°C |
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3M |
CONN IC DIP SOCKET 24POS TIN
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 24 (2 x 12)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 35µin (0.90µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 35µin (0.90µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyester, Glass Filled
- Operating Temperature: -25°C ~ 85°C
|
Package: - |
Stock5,598 |
|
24 (2 x 12) | 0.100" (2.54mm) | Tin | 35µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 35µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled | -25°C ~ 85°C |
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3M |
CONN SOCKET SOIC 28POS GOLD
- Type: SOIC
- Number of Positions or Pins (Grid): 28 (2 x 14)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES), Glass Filled
- Operating Temperature: -55°C ~ 150°C
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Package: - |
Stock5,742 |
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28 (2 x 14) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | -55°C ~ 150°C |
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3M |
CONN IC DIP SOCKET ZIF 64POS GLD
- Type: DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing
- Number of Positions or Pins (Grid): 64 (2 x 32)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Connector
- Features: Closed Frame
- Termination: Press-Fit
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock3,474 |
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64 (2 x 32) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
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3M |
CONN IC DIP SOCKET 8POS TIN
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 8 (2 x 4)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 35µin (0.90µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 35µin (0.90µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyester, Glass Filled
- Operating Temperature: -25°C ~ 85°C
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Package: - |
Stock2,538 |
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8 (2 x 4) | 0.100" (2.54mm) | Tin | 35µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 35µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled | -25°C ~ 85°C |
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3M |
CONN SOCKET QFN 60POS GOLD
- Type: QFN
- Number of Positions or Pins (Grid): 60 (4 x 15)
- Pitch - Mating: 0.016" (0.40mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.016" (0.40mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES)
- Operating Temperature: -
|
Package: - |
Stock7,326 |
|
60 (4 x 15) | 0.016" (0.40mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.016" (0.40mm) | Gold | - | Beryllium Copper | Polyethersulfone (PES) | - |
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3M |
CONN SOCKET QFN 40POS GOLD
- Type: QFN
- Number of Positions or Pins (Grid): 40 (4 x 10)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES)
- Operating Temperature: -
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Package: - |
Stock8,658 |
|
40 (4 x 10) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) | - |
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3M |
CONN SOCKET QFN 40POS GOLD
- Type: QFN
- Number of Positions or Pins (Grid): 40 (4 x 10)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES)
- Operating Temperature: -
|
Package: - |
Stock6,750 |
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40 (4 x 10) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) | - |
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3M |
CONN IC DIP SOCKET ZIF 90POS GLD
- Type: DIP, ZIF (ZIP)
- Number of Positions or Pins (Grid): 90 (2 x 45)
- Pitch - Mating: 0.070" (1.78mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.070" (1.78mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock4,788 |
|
90 (2 x 45) | 0.070" (1.78mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.070" (1.78mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
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3M |
CONN IC DIP SOCKET ZIF 42POS GLD
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 42 (2 x 21)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Connector
- Features: Closed Frame
- Termination: Press-Fit
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock6,084 |
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42 (2 x 21) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
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3M |
CONN SOCKET SOIC 18POS GOLD
- Type: SOIC
- Number of Positions or Pins (Grid): 18 (2 x 9)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES), Glass Filled
- Operating Temperature: -55°C ~ 150°C
|
Package: - |
Stock6,138 |
|
18 (2 x 9) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | -55°C ~ 150°C |
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3M |
CONN IC DIP SOCKET ZIF 32POS GLD
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.070" (1.78mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Connector
- Features: Closed Frame
- Termination: Press-Fit
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock5,796 |
|
32 (2 x 16) | 0.070" (1.78mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
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3M |
CONN ZIG-ZAG ZIF 51POS GOLD
- Type: Zig-Zag, ZIF (ZIP)
- Number of Positions or Pins (Grid): 51 (1 x 25, 1 x 26)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock7,776 |
|
51 (1 x 25, 1 x 26) | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
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3M |
CONN ZIG-ZAG ZIF 51POS GOLD
- Type: Zig-Zag, ZIF (ZIP)
- Number of Positions or Pins (Grid): 51 (1 x 25, 1 x 26)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock7,416 |
|
51 (1 x 25, 1 x 26) | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
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3M |
CONN SOCKET PGA ZIF 361POS GOLD
- Type: PGA, ZIF (ZIP)
- Number of Positions or Pins (Grid): 361 (19 x 19)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: -
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES)
- Operating Temperature: -55°C ~ 150°C
|
Package: - |
Stock6,570 |
|
361 (19 x 19) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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3M |
CONN SOCKET SIP ZIF 36POS GOLD
- Type: SIP, ZIF (ZIP)
- Number of Positions or Pins (Grid): 36 (1 x 36)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: -
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock8,064 |
|
36 (1 x 36) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
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3M |
CONN IC DIP SOCKET ZIF 56POS GLD
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 56 (2 x 28)
- Pitch - Mating: 0.070" (1.78mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Connector
- Features: Closed Frame
- Termination: Press-Fit
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock5,778 |
|
56 (2 x 28) | 0.070" (1.78mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
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3M |
CONN SOCKET SOIC 24POS GOLD
- Type: SOIC
- Number of Positions or Pins (Grid): 24 (2 x 12)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES), Glass Filled
- Operating Temperature: -55°C ~ 150°C
|
Package: - |
Stock5,886 |
|
24 (2 x 12) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | -55°C ~ 150°C |
|
|
|
3M |
CONN SOCKET SOIC 20POS GOLD
- Type: SOIC
- Number of Positions or Pins (Grid): 20 (2 x 10)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES), Glass Filled
- Operating Temperature: -55°C ~ 150°C
|
Package: - |
Stock6,108 |
|
20 (2 x 10) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | -55°C ~ 150°C |
|
|
|
3M |
CONN IC DIP SOCKET ZIF 40POS GLD
- Type: DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing
- Number of Positions or Pins (Grid): 40 (2 x 20)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Connector
- Features: Closed Frame
- Termination: Press-Fit
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock3,906 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
|
3M |
CONN IC DIP SOCKET ZIF 42POS GLD
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 42 (2 x 21)
- Pitch - Mating: 0.070" (1.78mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Connector
- Features: Closed Frame
- Termination: Press-Fit
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock4,626 |
|
42 (2 x 21) | 0.070" (1.78mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
|
3M |
CONN IC DIP SOCKET ZIF 28POS GLD
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 28 (2 x 14)
- Pitch - Mating: 0.070" (1.78mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Connector
- Features: Closed Frame
- Termination: Press-Fit
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock6,660 |
|
28 (2 x 14) | 0.070" (1.78mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
|
3M |
CONN SOCKET PLCC 52POS TIN
- Type: PLCC
- Number of Positions or Pins (Grid): 52 (4 x 13)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 160µin (4.06µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 160µin (4.06µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
- Operating Temperature: -40°C ~ 105°C
|
Package: - |
Stock18,408 |
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52 (4 x 13) | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
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3M |
CONN SOCKET PLCC 52POS TIN
- Type: PLCC
- Number of Positions or Pins (Grid): 52 (4 x 13)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 160µin (4.06µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 160µin (4.06µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
- Operating Temperature: -40°C ~ 105°C
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Package: - |
Stock16,656 |
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52 (4 x 13) | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
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3M |
CONN IC DIP SOCKET 48POS TIN
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 48 (2 x 24)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 35µin (0.90µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 35µin (0.90µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyester, Glass Filled
- Operating Temperature: -25°C ~ 85°C
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Package: - |
Stock17,256 |
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48 (2 x 24) | 0.100" (2.54mm) | Tin | 35µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 35µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled | -25°C ~ 85°C |
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3M |
CONN SOCKET QFN 80POS GOLD
- Type: QFN
- Number of Positions or Pins (Grid): 80 (4 x 20)
- Pitch - Mating: 0.020" (0.50mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.020" (0.50mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES)
- Operating Temperature: -
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Package: - |
Stock6,480 |
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80 (4 x 20) | 0.020" (0.50mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.020" (0.50mm) | Gold | - | Beryllium Copper | Polyethersulfone (PES) | - |
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3M |
CONN SOCKET QFN 56POS GOLD
- Type: QFN
- Number of Positions or Pins (Grid): 56 (4 x 14)
- Pitch - Mating: 0.016" (0.40mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.016" (0.40mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES)
- Operating Temperature: -
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Package: - |
Stock8,262 |
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56 (4 x 14) | 0.016" (0.40mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.016" (0.40mm) | Gold | - | Beryllium Copper | Polyethersulfone (PES) | - |
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