Page 42 - Embedded - Microcontroller, Microprocessor, FPGA Modules | Integrated Circuits (ICs)

TE0725-02-35-2C
Trenz Electronic GmbH

SOM ARTIX-7 XC7A35T-2C FLASH

Package: -

Stock5,232
COMMPC8360-10-1652LCR
Logic

KIT 128MB DDR 8MB NOR 64MB NAND

Package: -

Stock4,448
CENGLH7A404-11-403EIR
Logic

CARD ENGINE 32MB SDRAM

Package: -

Stock4,288
FS-326
Digi International

MODULE DIMM520 2MB FLASH

Package: -

Stock6,496
101-0383
Digi International

MODULE RABBITCORE RCM2020

Package: -

Stock6,096
DXUD5290I
Dave Embedded Systems

SYSTEM ON MODULE I.MX6 2GB DDR3

Package: -

Stock2,576
CC-MX-L76C-Z1
Digi International

MOD WI-I.MX6 50 PCS PACK

Package: -

Stock2,960
CC-9P-T225-Z1-B
Digi International

MODULE 9P 32MB SDRAM 32MB FLASH

Package: -

Stock3,872
CC-9P-V513-LX-B
Digi International

MODULE 9P 16MB SDRAM 8MB FLASH

Package: -

Stock5,184
TE0715-04-15-1I3
Trenz Electronic GmbH

SOM SOC 7Z015-1SBG485I 1GB LOPRO

Package: -

Stock5,200
TE0725LP-01-100-2C
Trenz Electronic GmbH

SOM ARTIX-7 XC7A100T-2C FLASH

Package: -

Stock5,440
XRM57D843ZWTT
Texas Instruments

MODULE MCU ARM

Package: -

Stock5,808
20-101-0404
Digi International

MODULE RABBITCORE RCM2000

Package: -

Stock7,376
20-101-1305
Digi International

RCM3700 W/MOUNTING HOLES

Package: -

Stock16,908
TE0841-02-0401IL
Trenz Electronic GmbH

IC MODULE

Package: -

Stock7,952
TE0820-05-2AE21MAZ
Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Package: -

Request a Quote
EC-VA-H264-10B-60-4K-MD00C-SX660
System-On-Chip (SOC) Technologies Inc.

MOD H264 EN 60FPS 4K SX660 SODIM

Package: -

Request a Quote
TE0813-02-4BE81-A
Trenz Electronic GmbH

MODULE MPSOC 4GB DDR4

Package: -

Request a Quote
TE0782-02-82I33FA
Trenz Electronic GmbH

IC MODULE CORTEX

Package: -

Request a Quote
RK3328-SOM-1G
Olimex LTD

IC

Package: -

Request a Quote

Part Number	Manufacturer	Description	Package	Stock	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
TE0725-02-35-2C	Trenz Electronic GmbH	SOM ARTIX-7 XC7A35T-2C FLASH Module/Board Type: FPGA Core Processor: Artix-7 A35T Co-Processor: - Speed: 100MHz Flash Size: 32MB RAM Size: - Connector Type: 50 Pin Size / Dimension: 2.87" x 1.38" (73mm x 35mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock5,232	Artix-7 A35T	-	100MHz	32MB	-	50 Pin	2.87" x 1.38" (73mm x 35mm)	0°C ~ 70°C
COMMPC8360-10-1652LCR	Logic	KIT 128MB DDR 8MB NOR 64MB NAND Module/Board Type: MPU Core Core Processor: PowerQUICC, MPC8360 Co-Processor: - Speed: 400MHz Flash Size: 64MB (NAND), 8MB (NOR) RAM Size: 128KB Connector Type: - Size / Dimension: 3.74" x 3.74" (95mm x 95mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock4,448	PowerQUICC, MPC8360	-	400MHz	64MB (NAND), 8MB (NOR)	128KB	-	3.74" x 3.74" (95mm x 95mm)	0°C ~ 70°C
CENGLH7A404-11-403EIR	Logic	CARD ENGINE 32MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A404 Co-Processor: - Speed: 200MHz Flash Size: 16MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock4,288	ARM922T, LH7A404	-	200MHz	16MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	-40°C ~ 85°C
FS-326	Digi International	MODULE DIMM520 2MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Stock6,496	-	-	-	-	-	-	-	-
101-0383	Digi International	MODULE RABBITCORE RCM2020 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 18.432MHz Flash Size: 256KB RAM Size: 128KB Connector Type: 2 IDC Headers 2x20 Size / Dimension: 1.9" x 2.3" (48.3mm x 58.4mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock6,096	Rabbit 2000	-	18.432MHz	256KB	128KB	2 IDC Headers 2x20	1.9" x 2.3" (48.3mm x 58.4mm)	-40°C ~ 85°C
DXUD5290I	Dave Embedded Systems	SYSTEM ON MODULE I.MX6 2GB DDR3 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A9, i.MX6 Dual Co-Processor: - Speed: 1GHz Flash Size: 512MB (NAND), 32MB (NOR) RAM Size: 2GB Connector Type: 3 x 140 Pins 0.6mm Pitch Size / Dimension: - Operating Temperature: -40°C ~ 85°C	Package: -	Stock2,576	ARM? Cortex?-A9, i.MX6 Dual	-	1GHz	512MB (NAND), 32MB (NOR)	2GB	3 x 140 Pins 0.6mm Pitch	-	-40°C ~ 85°C
CC-MX-L76C-Z1	Digi International	MOD WI-I.MX6 50 PCS PACK Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A9, i.MX6DualLite Co-Processor: - Speed: 800MHz Flash Size: 4GB RAM Size: 512MB Connector Type: - Size / Dimension: 1.97" x 1.97" (50mm x 50mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock2,960	ARM? Cortex?-A9, i.MX6DualLite	-	800MHz	4GB	512MB	-	1.97" x 1.97" (50mm x 50mm)	-40°C ~ 85°C
CC-9P-T225-Z1-B	Digi International	MODULE 9P 32MB SDRAM 32MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Stock3,872	-	-	-	-	-	-	-	-
CC-9P-V513-LX-B	Digi International	MODULE 9P 16MB SDRAM 8MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9215 Co-Processor: - Speed: 150MHz Flash Size: 8MB RAM Size: 16MB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 1.97" x 1.97" (50mm x 50mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock5,184	ARM926EJ-S, NS9215	-	150MHz	8MB	16MB	Board-to-Board (BTB) Socket - 160	1.97" x 1.97" (50mm x 50mm)	-40°C ~ 85°C
TE0715-04-15-1I3	Trenz Electronic GmbH	SOM SOC 7Z015-1SBG485I 1GB LOPRO Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7015) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock5,200	ARM Cortex-A9	Zynq-7000 (Z-7015)	125MHz	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
TE0725LP-01-100-2C	Trenz Electronic GmbH	SOM ARTIX-7 XC7A100T-2C FLASH Module/Board Type: FPGA Core Processor: Artix-7 A100T Co-Processor: - Speed: 25MHz Flash Size: 32MB RAM Size: - Connector Type: 50 Pin Size / Dimension: 2.87" x 1.38" (73mm x 35mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock5,440	Artix-7 A100T	-	25MHz	32MB	-	50 Pin	2.87" x 1.38" (73mm x 35mm)	0°C ~ 70°C
XRM57D843ZWTT	Texas Instruments	MODULE MCU ARM Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Stock5,808	-	-	-	-	-	-	-	-
20-101-0404	Digi International	MODULE RABBITCORE RCM2000 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 25.8MHz Flash Size: 256KB RAM Size: 512KB Connector Type: 2 IDC Headers 2x20 Size / Dimension: 1.9" x 2.3" (48.3mm x 58.4mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock7,376	Rabbit 2000	-	25.8MHz	256KB	512KB	2 IDC Headers 2x20	1.9" x 2.3" (48.3mm x 58.4mm)	-40°C ~ 85°C
20-101-1305	Digi International	RCM3700 W/MOUNTING HOLES Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 22.1MHz Flash Size: 512KB (Internal), 1MB (External) RAM Size: 512KB Connector Type: IDC Header 2x20 Size / Dimension: 1.2" x 2.95" (30mm x 75mm) Operating Temperature: -40°C ~ 70°C	Package: -	Stock16,908	Rabbit 3000	-	22.1MHz	512KB (Internal), 1MB (External)	512KB	IDC Header 2x20	1.2" x 2.95" (30mm x 75mm)	-40°C ~ 70°C
TE0841-02-0401IL	Trenz Electronic GmbH	IC MODULE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Stock7,952	-	-	-	-	-	-	-	-
TE0820-05-2AE21MAZ	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: MPU Core Core Processor: - Co-Processor: - Speed: - Flash Size: 8GB eMMC, 128MB QSPI RAM Size: 2GB Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Request a Quote	-	-	-	8GB eMMC, 128MB QSPI	2GB	-	-	-
EC-VA-H264-10B-60-4K-MD00C-SX660	System-On-Chip (SOC) Technologies Inc.	MOD H264 EN 60FPS 4K SX660 SODIM Module/Board Type: FPGA Core Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Co-Processor: - Speed: 1.5GHz Flash Size: 128KB RAM Size: 512MB Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Request a Quote	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	1.5GHz	128KB	512MB	-	-	-
TE0813-02-4BE81-A	Trenz Electronic GmbH	MODULE MPSOC 4GB DDR4 Module/Board Type: FPGA Core Processor: Xilinx Zynq UltraScale+ ZU4EG Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: BGA Size / Dimension: 2.047" L x 2.992" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	Package: -	Request a Quote	Xilinx Zynq UltraScale+ ZU4EG	-	-	128MB	2GB	BGA	2.047" L x 2.992" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0782-02-82I33FA	Trenz Electronic GmbH	IC MODULE CORTEX Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7035) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7035)	-	32MB	1GB	Board-to-Board (BTB) Socket - 480	3.350" L x 3.350" W (85.00mm x 85.00mm)	-40°C ~ 85°C
RK3328-SOM-1G	Olimex LTD	IC Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53 Co-Processor: - Speed: 1.5GHz Flash Size: - RAM Size: 1GB Connector Type: USB Size / Dimension: - Operating Temperature: -	Package: -	Request a Quote	ARM® Cortex®-A53	-	1.5GHz	-	1GB	USB	-	-
TE0722-03-41I-4-A	Trenz Electronic GmbH	IC MODULE CORTEX-A9 33MHZ 16MB Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Request a Quote	-	-	-	-	-	-	-	-
TE0803-04-4DE11-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	Package: -	Request a Quote	Zynq UltraScale+ XCZU4EV-1SFVC784E	-	-	128MB	2GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
MA-ZX2-10-2I-D9-R2	Enclustra FPGA Solutions	SOM ZYNQ 7Z010 512MB Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7010) Speed: - Flash Size: 64MB RAM Size: 512MB Connector Type: 200 Pin Size / Dimension: 2.660" L x 1.180" W (67.60mm x 30.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock168	ARM Cortex-A9	Zynq-7000 (Z-7010)	-	64MB	512MB	200 Pin	2.660" L x 1.180" W (67.60mm x 30.00mm)	-40°C ~ 85°C
TE0818-01-9GI21-A	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH ZYNQ Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU9EG-2FFVC900I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	Zynq UltraScale+ XCZU9EG-2FFVC900I	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C
TE0803-04-3AE11-AK	Trenz Electronic GmbH	MPSOC MODULE TE0803 WITH ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	Package: -	Request a Quote	Zynq UltraScale+ XCZU3CG-1SFVC784E	-	-	128MB	2GB	Board-to-Board (BTB) Socket - 160	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
2DC-VA-H264-10B-30-4K-MD00C-SX660	System-On-Chip (SOC) Technologies Inc.	MOD H264 DE 30FPS 4K SX660 SODIM Module/Board Type: FPGA Core Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Co-Processor: - Speed: 1.5GHz Flash Size: 128KB RAM Size: 512MB Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Request a Quote	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	1.5GHz	128KB	512MB	-	-	-
TE0817-01-7AI21-A	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU7CG-1FBVB900I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	Zynq UltraScale+ XCZU7CG-1FBVB900I	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C
MYS-7Z020-V2-0E1D-766-C	MYIR Tech Limited	Zynq-7020 SBC, Z-turn Kit V2 Module/Board Type: MPU, FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: - Speed: 667MHz Flash Size: - RAM Size: - Connector Type: - Size / Dimension: 4.016" x 2.480" (102.00mm x 63.00mm) Operating Temperature: -	Package: -	Request a Quote	ARM® Cortex®-A9	-	667MHz	-	-	-	4.016" x 2.480" (102.00mm x 63.00mm)	-