|
|
Critical Link LLC |
MOD MITYSOM-3354
- Module/Board Type: MPU Core
- Core Processor: ARM? Cortex?-A8, AM3354
- Co-Processor: NEON SIMD
- Speed: 800MHz
- Flash Size: -
- RAM Size: 256MB
- Connector Type: SO-DIMM-204
- Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
- Operating Temperature: 0°C ~ 70°C
|
Package: - |
Stock2,592 |
|
ARM? Cortex?-A8, AM3354 | NEON SIMD | 800MHz | - | 256MB | SO-DIMM-204 | 2.66" x 1.5" (67.6mm x 38.1mm) | 0°C ~ 70°C |
|
|
Digi International |
MOD WI-9M 64MB SDRAM 128MB FLASH
- Module/Board Type: MPU Core
- Core Processor: ARM920T, SC2443
- Co-Processor: -
- Speed: 533MHz
- Flash Size: 128MB
- RAM Size: 64MB
- Connector Type: Board-to-Board (BTB) Socket - 240
- Size / Dimension: 3.62" x 1.73" (92mm x 44 mm)
- Operating Temperature: -40°C ~ 65°C
|
Package: - |
Stock4,528 |
|
ARM920T, SC2443 | - | 533MHz | 128MB | 64MB | Board-to-Board (BTB) Socket - 240 | 3.62" x 1.73" (92mm x 44 mm) | -40°C ~ 65°C |
|
|
Logic |
SYSTEM ON MODULE LV OMAP3530
- Module/Board Type: MPU Core
- Core Processor: ARM? Cortex?-A8, OMAP3530
- Co-Processor: -
- Speed: 600MHz
- Flash Size: 256MB
- RAM Size: 128MB
- Connector Type: Board-to-Board (BTB) Socket - 200
- Size / Dimension: 0.59" x 1.06" (15mm x 27mm)
- Operating Temperature: 0°C ~ 70°C
|
Package: - |
Stock6,608 |
|
ARM? Cortex?-A8, OMAP3530 | - | 600MHz | 256MB | 128MB | Board-to-Board (BTB) Socket - 200 | 0.59" x 1.06" (15mm x 27mm) | 0°C ~ 70°C |
|
|
Digi International |
MODULE 32MB SDRAM 32MB FLASH
- Module/Board Type: -
- Core Processor: -
- Co-Processor: -
- Speed: -
- Flash Size: -
- RAM Size: -
- Connector Type: -
- Size / Dimension: -
- Operating Temperature: -
|
Package: - |
Stock5,168 |
|
- | - | - | - | - | - | - | - |
|
|
Dave Embedded Systems |
SYSTEM ON MODULE AM3359 1GB NAND
- Module/Board Type: MPU Core
- Core Processor: ARM? Cortex?-A8, AM3359
- Co-Processor: PowerVR SGX530
- Speed: 720MHz
- Flash Size: 1GB (NAND), 32MB (NOR)
- RAM Size: 512MB
- Connector Type: SO-DIMM-204
- Size / Dimension: -
- Operating Temperature: -40°C ~ 85°C
|
Package: - |
Stock4,576 |
|
ARM? Cortex?-A8, AM3359 | PowerVR SGX530 | 720MHz | 1GB (NAND), 32MB (NOR) | 512MB | SO-DIMM-204 | - | -40°C ~ 85°C |
|
|
Digi International |
MODULE 9C 16MB SDRAM 4MB FLASH
- Module/Board Type: MPU Core
- Core Processor: ARM926EJ-S, NS9360
- Co-Processor: -
- Speed: 155MHz
- Flash Size: 4MB
- RAM Size: 16MB
- Connector Type: SO-DIMM-144
- Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
- Operating Temperature: -40°C ~ 85°C
|
Package: - |
Stock5,312 |
|
ARM926EJ-S, NS9360 | - | 155MHz | 4MB | 16MB | SO-DIMM-144 | 3.59" x 2.06" (91.2mm x 52.2mm) | -40°C ~ 85°C |
|
|
Logic |
SYSTEM ON MODULE AM1808
- Module/Board Type: MPU Core
- Core Processor: ARM926EJ-S, AM1808
- Co-Processor: -
- Speed: 450MHz
- Flash Size: 8MB
- RAM Size: 64MB
- Connector Type: -
- Size / Dimension: 1.18" x 1.57" (30mm x 40mm)
- Operating Temperature: 0°C ~ 70°C
|
Package: - |
Stock6,128 |
|
ARM926EJ-S, AM1808 | - | 450MHz | 8MB | 64MB | - | 1.18" x 1.57" (30mm x 40mm) | 0°C ~ 70°C |
|
|
Parallax Inc. |
BASIC STAMP 2P40 MODULE
- Module/Board Type: MCU Core
- Core Processor: SX48AC
- Co-Processor: -
- Speed: 20MHz
- Flash Size: 16KB EEPROM
- RAM Size: 38B
- Connector Type: -
- Size / Dimension: 2.1" x 0.6" (53.3mm x 15.2mm)
- Operating Temperature: 0°C ~ 70°C
|
Package: - |
Stock7,584 |
|
SX48AC | - | 20MHz | 16KB EEPROM | 38B | - | 2.1" x 0.6" (53.3mm x 15.2mm) | 0°C ~ 70°C |
|
|
Digi International |
RCM3710 W/MOUNTING HOLES
- Module/Board Type: MPU Core
- Core Processor: Rabbit 3000
- Co-Processor: -
- Speed: 22.1MHz
- Flash Size: 256KB (Internal), 1MB (External)
- RAM Size: 128KB
- Connector Type: IDC Header 2x20
- Size / Dimension: 1.2" x 2.95" (30mm x 75mm)
- Operating Temperature: -40°C ~ 70°C
|
Package: - |
Stock20,382 |
|
Rabbit 3000 | - | 22.1MHz | 256KB (Internal), 1MB (External) | 128KB | IDC Header 2x20 | 1.2" x 2.95" (30mm x 75mm) | -40°C ~ 70°C |
|
|
Digi International |
MODULE CONNECTCORE 9C
- Module/Board Type: -
- Core Processor: -
- Co-Processor: -
- Speed: -
- Flash Size: -
- RAM Size: -
- Connector Type: -
- Size / Dimension: -
- Operating Temperature: -
|
Package: - |
Stock7,792 |
|
- | - | - | - | - | - | - | - |
|
|
Digi International |
MODULE CONNECTCORE
- Module/Board Type: MPU Core
- Core Processor: ARM7TDMI, NS7520
- Co-Processor: -
- Speed: 55MHz
- Flash Size: 4MB
- RAM Size: 8MB
- Connector Type: RJ45
- Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
- Operating Temperature: -40°C ~ 85°C
|
Package: - |
Stock4,208 |
|
ARM7TDMI, NS7520 | - | 55MHz | 4MB | 8MB | RJ45 | 1.45" x 0.75" (36.7mm x 19.1mm) | -40°C ~ 85°C |
|
|
Digi International |
MODULE DIGI CONNECT ME
- Module/Board Type: -
- Core Processor: -
- Co-Processor: -
- Speed: -
- Flash Size: -
- RAM Size: -
- Connector Type: -
- Size / Dimension: -
- Operating Temperature: -
|
Package: - |
Stock4,064 |
|
- | - | - | - | - | - | - | - |
|
|
Trenz Electronic GmbH |
SOM USCALE+ XCZU3CG-1S 1GB DDR4
- Module/Board Type: -
- Core Processor: -
- Co-Processor: -
- Speed: -
- Flash Size: -
- RAM Size: -
- Connector Type: -
- Size / Dimension: -
- Operating Temperature: -
|
Package: - |
Stock6,592 |
|
- | - | - | - | - | - | - | - |
|
|
Trenz Electronic GmbH |
SOM USCALE+ XCZU3CG-1S 2GB DDR4
- Module/Board Type: -
- Core Processor: -
- Co-Processor: -
- Speed: -
- Flash Size: -
- RAM Size: -
- Connector Type: -
- Size / Dimension: -
- Operating Temperature: -
|
Package: - |
Stock6,960 |
|
- | - | - | - | - | - | - | - |
|
|
Lantronix, Inc. |
XPORT ROHS SAMPLE EXTENDED TEMP.
- Module/Board Type: -
- Core Processor: -
- Co-Processor: -
- Speed: -
- Flash Size: -
- RAM Size: -
- Connector Type: -
- Size / Dimension: -
- Operating Temperature: -
|
Package: - |
Stock3,360 |
|
- | - | - | - | - | - | - | - |
|
|
Lantronix, Inc. |
XPORT ROHS EXTENDED TEMP. -40 TO
- Module/Board Type: -
- Core Processor: -
- Co-Processor: -
- Speed: -
- Flash Size: -
- RAM Size: -
- Connector Type: -
- Size / Dimension: -
- Operating Temperature: -
|
Package: - |
Stock12,354 |
|
- | - | - | - | - | - | - | - |
|
|
Trenz Electronic GmbH |
IC MODULE ZYNQ USCALE 2GB 128MB
- Module/Board Type: MPU Core
- Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
- Co-Processor: -
- Speed: -
- Flash Size: 128MB
- RAM Size: 2GB
- Connector Type: B2B
- Size / Dimension: 1.57" x 1.97" (40mm x 50mm)
- Operating Temperature: 0°C ~ 85°C
|
Package: - |
Stock4,832 |
|
Zynq UltraScale+ XCZU3EG-1SFVC784E | - | - | 128MB | 2GB | B2B | 1.57" x 1.97" (40mm x 50mm) | 0°C ~ 85°C |
|
|
Critical Link LLC |
IC MODULE CORTEX-A9 1.2GHZ 6GB
- Module/Board Type: MPU, FPGA Core
- Core Processor: ARM® Cortex®-A9, Arria 10 SX
- Co-Processor: NEON™ SIMD
- Speed: 1.2GHz
- Flash Size: -
- RAM Size: 6GB
- Connector Type: Board-to-Board (BTB)
- Size / Dimension: 4" x 4" (101.5mm x 101.5mm)
- Operating Temperature: -40°C ~ 85°C
|
Package: - |
Stock2,944 |
|
ARM® Cortex®-A9, Arria 10 SX | NEON™ SIMD | 1.2GHz | - | 6GB | Board-to-Board (BTB) | 4" x 4" (101.5mm x 101.5mm) | -40°C ~ 85°C |
|
|
Critical Link LLC |
IC MODULE CORTEX-A9 1.2GHZ 6GB
- Module/Board Type: MPU, FPGA Core
- Core Processor: ARM® Cortex®-A9, Arria 10 SX
- Co-Processor: NEON™ SIMD
- Speed: 1.2GHz
- Flash Size: -
- RAM Size: 6GB
- Connector Type: Board-to-Board (BTB)
- Size / Dimension: 4" x 4" (101.5mm x 101.5mm)
- Operating Temperature: 0°C ~ 70°C
|
Package: - |
Stock2,624 |
|
ARM® Cortex®-A9, Arria 10 SX | NEON™ SIMD | 1.2GHz | - | 6GB | Board-to-Board (BTB) | 4" x 4" (101.5mm x 101.5mm) | 0°C ~ 70°C |
|
|
Trenz Electronic GmbH |
IC MODULE ZYNQ USCALE 2GB 128MB
- Module/Board Type: MPU Core
- Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E
- Co-Processor: -
- Speed: -
- Flash Size: 128MB
- RAM Size: 2GB
- Connector Type: B2B
- Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
- Operating Temperature: 0°C ~ 85°C
|
Package: - |
Stock2,992 |
|
Zynq UltraScale+ XCZU2CG-1SFVC784E | - | - | 128MB | 2GB | B2B | 2.05" x 2.99" (52mm x 76mm) | 0°C ~ 85°C |
|
|
Trenz Electronic GmbH |
FPGA MODULE SPARTAN-6
- Module/Board Type: -
- Core Processor: -
- Co-Processor: -
- Speed: -
- Flash Size: -
- RAM Size: -
- Connector Type: -
- Size / Dimension: -
- Operating Temperature: -
|
Package: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
Trenz Electronic GmbH |
IC MODULE ZYNQ USCALE
- Module/Board Type: -
- Core Processor: -
- Co-Processor: -
- Speed: -
- Flash Size: -
- RAM Size: -
- Connector Type: -
- Size / Dimension: -
- Operating Temperature: -
|
Package: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
ARIES Embedded |
SoM i.MX287
- Module/Board Type: -
- Core Processor: i.MX287
- Co-Processor: -
- Speed: 454MHz
- Flash Size: 256MB (NAND)
- RAM Size: 128MB
- Connector Type: -
- Size / Dimension: -
- Operating Temperature: -40°C ~ 85°C
|
Package: - |
Request a Quote |
|
i.MX287 | - | 454MHz | 256MB (NAND) | 128MB | - | - | -40°C ~ 85°C |
|
|
AMD |
SOM K24 KRIA ZYNQ MPSOC
- Module/Board Type: -
- Core Processor: -
- Co-Processor: -
- Speed: -
- Flash Size: -
- RAM Size: -
- Connector Type: -
- Size / Dimension: -
- Operating Temperature: -
|
Package: - |
Stock900 |
|
- | - | - | - | - | - | - | - |
|
|
Trenz Electronic GmbH |
IC MODULE ZYNQBERRY
- Module/Board Type: MCU, FPGA
- Core Processor: ARM Cortex-A9
- Co-Processor: Zynq-7000 (Z-7010)
- Speed: -
- Flash Size: 16MB
- RAM Size: 128MB
- Connector Type: CSI, DSI
- Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm)
- Operating Temperature: 0°C ~ 70°C
|
Package: - |
Request a Quote |
|
ARM Cortex-A9 | Zynq-7000 (Z-7010) | - | 16MB | 128MB | CSI, DSI | 1.180" L x 1.570" W (30.00mm x 40.00mm) | 0°C ~ 70°C |
|
|
Trenz Electronic GmbH |
IC SOC MODULE
- Module/Board Type: MCU, FPGA
- Core Processor: ARM Cortex-A9
- Co-Processor: Zynq-7000 (Z-7030)
- Speed: 125MHz
- Flash Size: 32MB
- RAM Size: 1GB
- Connector Type: Samtec LSHM
- Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
- Operating Temperature: -40°C ~ 85°C
|
Package: - |
Request a Quote |
|
ARM Cortex-A9 | Zynq-7000 (Z-7030) | 125MHz | 32MB | 1GB | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | -40°C ~ 85°C |
|
|
iWave Systems |
ZU19EG (-2 SPEED) MPSOC SOM
- Module/Board Type: MPU, FPGA
- Core Processor: ARM® Cortex®-A53(x4), ARM® Cortex™-M7(x1)
- Co-Processor: ARM® Mali 400 MP2
- Speed: 1.5GHz, 600MHz
- Flash Size: 8GB eMMC
- RAM Size: 4GB from PS, 4GB from PL
- Connector Type: 2 x 240 Pin, 2 x 240 Pin
- Size / Dimension: 4.330" L x 2.950" W (110.00mm x 75.00mm)
- Operating Temperature: -40°C ~ 85°C
|
Package: - |
Request a Quote |
|
ARM® Cortex®-A53(x4), ARM® Cortex™-M7(x1) | ARM® Mali 400 MP2 | 1.5GHz, 600MHz | 8GB eMMC | 4GB from PS, 4GB from PL | 2 x 240 Pin, 2 x 240 Pin | 4.330" L x 2.950" W (110.00mm x 75.00mm) | -40°C ~ 85°C |
|
|
Trenz Electronic GmbH |
IC MODULE GIGABEE
- Module/Board Type: FPGA
- Core Processor: Xilinx Spartan™ 6 XC6SLX100-2FGG484C
- Co-Processor: -
- Speed: 125MHz
- Flash Size: 16MB
- RAM Size: 512MB
- Connector Type: B2B
- Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
- Operating Temperature: 0°C ~ 70°C
|
Package: - |
Request a Quote |
|
Xilinx Spartan™ 6 XC6SLX100-2FGG484C | - | 125MHz | 16MB | 512MB | B2B | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 0°C ~ 70°C |