Page 44 - Embedded - Microcontroller, Microprocessor, FPGA Modules | Integrated Circuits (ICs)

100-1217-1
Bluetechnix GmbH

MODULE ECM-BF609-C-C-Q25S256F8

Package: -

Stock3,952
CC-9M-NA37-Z1-B
Digi International

MOD 9M 64MB SDRAM 128MB FLASH 25

Package: -

Stock7,504
SOMOMAP3530-11-1670EFCR
Logic

SYSTEM ON MODULE LV OMAP3530

Package: -

Stock3,792
M5485AFE
NXP

MODULE MCF5485 FIRE ENGINE

Package: -

Stock2,656
FS-3007
Digi International

MODULE 32MB SDRAM 32MB FLASH

Package: -

Stock2,944
SOMLX800-11-000GCR-A
Logic

MODULE SOM LX800 GEODE WO/SODIMM

Package: -

Stock2,048
FS-364
Digi International

MODULE 9P 16MB SDRAM 32MB FLASH

Package: -

Stock6,608
CC-9C-V237-Z6-B
Digi International

MODULE 9C 64MB SDRAM 128MB FLASH

Package: -

Stock7,312
3352-HX-X38-RC
Critical Link LLC

MITYSOM-3352 W/ AM3352

Package: -

Stock4,080
CC-9P-V524-C
Digi International

CONNECTCORE 9P 9215 MODULE

Package: -

Stock3,232
SOMDM3730-10-1782JFIR
Logic

SYSTEM ON MODULE LV DM3730

Package: -

Stock6,384
L138-DX-225-RI
Critical Link LLC

MITYDSP-L138 W/ OMAP-L138

Package: -

Stock3,392
20-101-0488
Digi International

MODULE RABBITCORE RCM2210

Package: -

Stock7,236
OSD3358-512M-ICB
Octavo Systems LLC

AM3358 512MB DDR3L 4KB EEPROM TP

Package: -

Stock3,344
TE0803-02-05EV-1EA
Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Package: -

Stock6,336
TE0807-02-07EV-1E
Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 4GB 128MB

Package: -

Stock3,552
TE0715-04-21C33-A
Trenz Electronic GmbH

IC SOC MODULE 1GB DDR3L

Package: -

Request a Quote
TE0715-05-52I33-A
Trenz Electronic GmbH

SOC MODULE WITH XILINX ZYNQ XC7Z

Package: -

Request a Quote
TE0715-04-15-1IC
Trenz Electronic GmbH

IC SOC MODULE 1GB DDR3L

Package: -

Request a Quote
FORLINX-FET3588J-C-224GSE32GIA11
Forlinx Embedded

Rockchip RK3588J SOM,4GBLPDDR4x,

Package: -

Request a Quote

Part Number	Manufacturer	Description	Package	Stock	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
100-1217-1	Bluetechnix GmbH	MODULE ECM-BF609-C-C-Q25S256F8 Module/Board Type: MPU Core Core Processor: ADSP-BF609 (Dual Core) Co-Processor: - Speed: 500MHz x 2 Flash Size: 8MB RAM Size: 256KB Connector Type: Expansion 2 x 100 Size / Dimension: 1.73" x 1.3" (44mm x 33mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock3,952	ADSP-BF609 (Dual Core)	-	500MHz x 2	8MB	256KB	Expansion 2 x 100	1.73" x 1.3" (44mm x 33mm)	0°C ~ 70°C
CC-9M-NA37-Z1-B	Digi International	MOD 9M 64MB SDRAM 128MB FLASH 25 Module/Board Type: MPU Core Core Processor: ARM920T, SC2443 Co-Processor: - Speed: 533MHz Flash Size: 128MB RAM Size: 64MB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.36" x 1.73" (60mm x 44mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock7,504	ARM920T, SC2443	-	533MHz	128MB	64MB	Board-to-Board (BTB) Socket - 240	2.36" x 1.73" (60mm x 44mm)	-40°C ~ 85°C
SOMOMAP3530-11-1670EFCR	Logic	SYSTEM ON MODULE LV OMAP3530 Module/Board Type: MPU, DSP Core Core Processor: ARM? Cortex?-A8, OMAP3530 Co-Processor: TMS320C64x (DSP) Speed: 600MHz Flash Size: 256MB RAM Size: 128MB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock3,792	ARM? Cortex?-A8, OMAP3530	TMS320C64x (DSP)	600MHz	256MB	128MB	Board-to-Board (BTB) Socket - 240	1.23" x 3.01" (31.2mm x 76.5mm)	0°C ~ 70°C
M5485AFE	NXP	MODULE MCF5485 FIRE ENGINE Module/Board Type: MPU Core Core Processor: ColdFire V4e, MCF5485 Co-Processor: - Speed: 200MHz Flash Size: 2MB (Boot) RAM Size: 64MB Connector Type: - Size / Dimension: 3.7" x 4.5" (93.4mm x 114.3mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock2,656	ColdFire V4e, MCF5485	-	200MHz	2MB (Boot)	64MB	-	3.7" x 4.5" (93.4mm x 114.3mm)	-40°C ~ 85°C
FS-3007	Digi International	MODULE 32MB SDRAM 32MB FLASH Module/Board Type: MPU Core Core Processor: ARM920T, SC2440 Co-Processor: - Speed: 400MHz Flash Size: 32MB RAM Size: 32MB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.36" x 1.73" (60mm x 44mm) Operating Temperature: -25°C ~ 75°C	Package: -	Stock2,944	ARM920T, SC2440	-	400MHz	32MB	32MB	Board-to-Board (BTB) Socket - 240	2.36" x 1.73" (60mm x 44mm)	-25°C ~ 75°C
SOMLX800-11-000GCR-A	Logic	MODULE SOM LX800 GEODE WO/SODIMM Module/Board Type: MPU Core Core Processor: Geode, LX 800 Co-Processor: - Speed: 500MHz Flash Size: - RAM Size: - Connector Type: - Size / Dimension: 3.78" x 4.53" (96mm x 115mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock2,048	Geode, LX 800	-	500MHz	-	-	-	3.78" x 4.53" (96mm x 115mm)	0°C ~ 70°C
FS-364	Digi International	MODULE 9P 16MB SDRAM 32MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Stock6,608	-	-	-	-	-	-	-	-
CC-9C-V237-Z6-B	Digi International	MODULE 9C 64MB SDRAM 128MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9360 Co-Processor: - Speed: 155MHz Flash Size: 128MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock7,312	ARM926EJ-S, NS9360	-	155MHz	128MB	64MB	SO-DIMM-144	3.59" x 2.06" (91.2mm x 52.2mm)	-40°C ~ 85°C
3352-HX-X38-RC	Critical Link LLC	MITYSOM-3352 W/ AM3352 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3352 Co-Processor: NEON SIMD Speed: 800MHz Flash Size: 256MB RAM Size: 256MB Connector Type: SO-DIMM-204 Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock4,080	ARM? Cortex?-A8, AM3352	NEON SIMD	800MHz	256MB	256MB	SO-DIMM-204	2.66" x 1.5" (67.6mm x 38.1mm)	0°C ~ 70°C
CC-9P-V524-C	Digi International	CONNECTCORE 9P 9215 MODULE Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9215 Co-Processor: - Speed: 150MHz Flash Size: 16MB RAM Size: 32MB Connector Type: - Size / Dimension: - Operating Temperature: -40°C ~ 85°C	Package: -	Stock3,232	ARM926EJ-S, NS9215	-	150MHz	16MB	32MB	-	-	-40°C ~ 85°C
SOMDM3730-10-1782JFIR	Logic	SYSTEM ON MODULE LV DM3730 Module/Board Type: MPU, DSP Core Core Processor: ARM? Cortex?-A8, DM3730 Co-Processor: TMS320C64x (DSP) Speed: 800MHz Flash Size: 512MB (NAND), 8MB (NOR) RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock6,384	ARM? Cortex?-A8, DM3730	TMS320C64x (DSP)	800MHz	512MB (NAND), 8MB (NOR)	256MB	Board-to-Board (BTB) Socket - 480	1.23" x 3.01" (31.2mm x 76.5mm)	-40°C ~ 85°C
L138-DX-225-RI	Critical Link LLC	MITYDSP-L138 W/ OMAP-L138 Module/Board Type: MPU, DSP Core Core Processor: ARM926EJ-S, OMAP-L138 Co-Processor: TMS320C674x (DSP) Speed: 375MHz Flash Size: 256MB (NAND), 8MB (NOR) RAM Size: 8KB (Internal MPU), 256KB (Internal DSP), 128MB (External) Connector Type: SO-DIMM-200 Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock3,392	ARM926EJ-S, OMAP-L138	TMS320C674x (DSP)	375MHz	256MB (NAND), 8MB (NOR)	8KB (Internal MPU), 256KB (Internal DSP), 128MB (External)	SO-DIMM-200	2.66" x 1.5" (67.6mm x 38.1mm)	-40°C ~ 85°C
20-101-0488	Digi International	MODULE RABBITCORE RCM2210 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 22.1MHz Flash Size: 512KB RAM Size: 512KB Connector Type: 2 IDC Headers 2x13 Size / Dimension: 1.6" x 2.3" (41mm x 58mm) Operating Temperature: -40°C ~ 70°C	Package: -	Stock7,236	Rabbit 2000	-	22.1MHz	512KB	512KB	2 IDC Headers 2x13	1.6" x 2.3" (41mm x 58mm)	-40°C ~ 70°C
OSD3358-512M-ICB	Octavo Systems LLC	AM3358 512MB DDR3L 4KB EEPROM TP Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A8, AM3358 Co-Processor: NEON™ SIMD Speed: 1GHz Flash Size: 4GB RAM Size: 512MB Connector Type: 400-BGA Size / Dimension: 1.06" x 1.06" (27.0mm x 27.0mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock3,344	ARM® Cortex®-A8, AM3358	NEON™ SIMD	1GHz	4GB	512MB	400-BGA	1.06" x 1.06" (27.0mm x 27.0mm)	-40°C ~ 85°C
TE0803-02-05EV-1EA	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU5EV-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	Package: -	Stock6,336	Zynq UltraScale+ XCZU5EV-1SFVC784E	-	-	128MB	2GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
TE0807-02-07EV-1E	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 4GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	Package: -	Stock3,552	Zynq UltraScale+ XCZU7EV-1FBVB900E	-	-	128MB	4GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
TE0715-04-21C33-A	Trenz Electronic GmbH	IC SOC MODULE 1GB DDR3L Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7012S) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	Package: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7012S)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
TE0715-05-52I33-A	Trenz Electronic GmbH	SOC MODULE WITH XILINX ZYNQ XC7Z Module/Board Type: MPU Core Core Processor: Zynq™ 7015 XC7Z015-2CLG485I Co-Processor: ARM Cortex-A9 Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	Zynq™ 7015 XC7Z015-2CLG485I	ARM Cortex-A9	-	32MB	1GB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0715-04-15-1IC	Trenz Electronic GmbH	IC SOC MODULE 1GB DDR3L Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7015) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7015)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
FORLINX-FET3588J-C-224GSE32GIA11	Forlinx Embedded	Rockchip RK3588J SOM,4GBLPDDR4x, Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Request a Quote	-	-	-	-	-	-	-	-
ME-XU1-6CG-1E-D11E-G1-R5-0	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU6CG Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU6CG-1FFVC900E Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 2GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: 0°C ~ 85°C	Package: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU6CG-1FFVC900E	600MHz, 1.5GHz	16GB	2GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	0°C ~ 85°C
MSMP157-BAA	ARIES Embedded	SOM ST32MP1 Module/Board Type: MPU Core Processor: ARM® Cortex®-A7, Dual-Core Co-Processor: ARM® Cortex®-M4F Speed: 800MHz Flash Size: 4GB eMMC, 128MB QSPI RAM Size: 1GB Connector Type: OSM Size M, 476 Contacts Size / Dimension: 1.770" L x 1.180" W (45.00mm x 30.00mm) Operating Temperature: -25°C ~ 85°C	Package: -	Request a Quote	ARM® Cortex®-A7, Dual-Core	ARM® Cortex®-M4F	800MHz	4GB eMMC, 128MB QSPI	1GB	OSM Size M, 476 Contacts	1.770" L x 1.180" W (45.00mm x 30.00mm)	-25°C ~ 85°C
TE0720-04-61Q33ML	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: Ethernet Core Core Processor: ARM® Cortex®-A9 Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM® Cortex®-A9	-	-	32MB	1GB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0808-05-9GI81-AK	Trenz Electronic GmbH	ULTRASOM+ MPSOC-MODULE WITH ZYNQ Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Request a Quote	-	-	-	-	-	-	-	-
TEM0007-01-CBD11-A	Trenz Electronic GmbH	MICROCHIP POLARFIRE SOC FPGA 95T Module/Board Type: FPGA Core Processor: - Co-Processor: - Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: B2B Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -	Package: -	Request a Quote	-	-	-	64MB	1GB	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	-
SCM-20260E-B	GHI Electronics, LLC	SITCORE SCM20260E SOM Module/Board Type: MPU Core Core Processor: SITCore Co-Processor: - Speed: 480MHz Flash Size: 16MB RAM Size: 32MB Connector Type: - Size / Dimension: - Operating Temperature: -40°C ~ 85°C	Package: -	Stock1,776	SITCore	-	480MHz	16MB	32MB	-	-	-40°C ~ 85°C
TE0820-05-4BI21PLZ	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: MPU Core Core Processor: - Co-Processor: - Speed: - Flash Size: 64GB eMMC, 128MB QSPI RAM Size: 2GB Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Request a Quote	-	-	-	64GB eMMC, 128MB QSPI	2GB	-	-	-
TE0820-03-4DE21FA	Trenz Electronic GmbH	IC MODULE 2GB 128MB Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Request a Quote	-	-	-	-	-	-	-	-