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NXP |
TRANS PREBIAS PNP 250MW SMT3
- Transistor Type: PNP - Pre-Biased
- Current - Collector (Ic) (Max): 100mA
- Voltage - Collector Emitter Breakdown (Max): 50V
- Resistor - Base (R1) (Ohms): 47k
- Resistor - Emitter Base (R2) (Ohms): 47k
- DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
- Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
- Current - Collector Cutoff (Max): 1µA
- Frequency - Transition: -
- Power - Max: 250mW
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: SMT3; MPAK
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock2,144 |
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NXP |
IC COUNTER BIN 14STAGE 16TSSOP
- Logic Type: Binary Counter
- Direction: Up
- Number of Elements: 1
- Number of Bits per Element: 14
- Reset: Asynchronous
- Timing: -
- Count Rate: 35MHz
- Trigger Type: Negative Edge
- Voltage - Supply: 3 V ~ 15 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
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Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock5,728 |
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NXP |
IC INVERTER DUAL 4,2-INPUT 16DIP
- Logic Type: Buffer, Inverting
- Number of Elements: 2
- Number of Bits per Element: 2, 4 (Hex)
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 10mA, 20mA
- Voltage - Supply: 3 V ~ 15 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Through Hole
- Package / Case: 16-DIP (0.300", 7.62mm)
- Supplier Device Package: 16-DIP
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Package: 16-DIP (0.300", 7.62mm) |
Stock5,728 |
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NXP |
IC DEMODULATOR/DECODER 100-HTQFP
- Type: Demodulator
- Applications: Satellite
- Mounting Type: Surface Mount
- Package / Case: 100-TQFP Exposed Pad
- Supplier Device Package: 100-HTQFP (14x14)
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Package: 100-TQFP Exposed Pad |
Stock7,056 |
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NXP |
DUAL LINCELL 14SOIC
- Applications: -
- Interface: -
- Voltage - Supply: -
- Package / Case: -
- Supplier Device Package: -
- Mounting Type: -
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Package: - |
Stock5,040 |
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NXP |
IC MPU Q OR IQ 1.2GHZ 780FCBGA
- Core Processor: PowerPC e500mc
- Number of Cores/Bus Width: 4 Core, 32-Bit
- Speed: 1.2GHz
- Co-Processors/DSP: Security; SEC 4.2
- RAM Controllers: DDR3, DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (5)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
- Package / Case: -
- Supplier Device Package: 780-FCPBGA (23x23)
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Package: - |
Stock6,000 |
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NXP |
IC MPU MPC85XX 1.25GHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.25GHz
- Co-Processors/DSP: Security; SEC
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 (3)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 90°C (TA)
- Security Features: Cryptography
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock5,360 |
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NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Signal Processing; SPE
- RAM Controllers: DDR, DDR2, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock5,984 |
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NXP |
IC MPU I.MXL 150MHZ 225MAPBGA
- Core Processor: ARM920T
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 150MHz
- Co-Processors/DSP: -
- RAM Controllers: SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: LCD
- Ethernet: -
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 1.8V, 3.0V
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: -
- Package / Case: 225-LFBGA
- Supplier Device Package: 225-MAPBGA (13x13)
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Package: 225-LFBGA |
Stock4,240 |
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NXP |
IC MPU MPC85XX 667MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 667MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2)
- SATA: -
- USB: -
- Voltage - I/O: 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 784-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 784-BBGA, FCBGA |
Stock7,312 |
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NXP |
IC MPU MPC74XX 500MHZ 360FCCLGA
- Core Processor: PowerPC G4
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 500MHz
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 360-CLGA, FCCLGA
- Supplier Device Package: 360-FCCLGA (25x25)
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Package: 360-CLGA, FCCLGA |
Stock2,464 |
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NXP |
IC MCU 32BIT 128KB FLASH 64LQFP
- Core Processor: Coldfire V1
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: EBI/EMI, I2C, SPI, UART/USART
- Peripherals: DMA, LVD, POR, PWM
- Number of I/O: 48
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 20x16b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock4,448 |
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NXP |
IC MCU 8BIT 60KB FLASH 48LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: CAN, I2C, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 39
- Program Memory Size: 60KB (60K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 3K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock2,304 |
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NXP |
IC MCU 8BIT 4KB FLASH 16DIP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 2MHz
- Connectivity: -
- Peripherals: LVD, POR, PWM
- Number of I/O: 13
- Program Memory Size: 4KB (4K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128 x 8
- Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
- Data Converters: A/D 4x8b
- Oscillator Type: Internal
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: -
- Package / Case: 16-DIP (0.300", 7.62mm)
- Supplier Device Package: 16-DIP
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Package: 16-DIP (0.300", 7.62mm) |
Stock4,848 |
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NXP |
IC MCU 16BIT 32KB FLASH 48QFN
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: CAN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 34
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 10x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN-EP (7x7)
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Package: 48-VFQFN Exposed Pad |
Stock3,136 |
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NXP |
IC MCU 32BIT 32KB FLASH 25WLCSP
- Core Processor: ARM? Cortex?-M0
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, WDT
- Number of I/O: 21
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 1.65 V ~ 1.95 V
- Data Converters: A/D 6x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 25-UFBGA, WLCSP
- Supplier Device Package: -
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Package: 25-UFBGA, WLCSP |
Stock5,040 |
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NXP |
IC MCU 32BIT 256KB FLASH 144BGA
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O: 98
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 42x16b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 144-LBGA
- Supplier Device Package: 144-MAPBGA (13x13)
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Package: 144-LBGA |
Stock4,192 |
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NXP |
IC MCU 32BIT 512KB FLASH 100LQFP
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O: 59
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 35x16b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: 100-LQFP |
Stock9,396 |
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NXP |
IC MCU 8BIT 16KB FLASH 48QFN
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 50MHz
- Connectivity: I2C, LIN, SCI, SPI
- Peripherals: LVD, PWM, WDT
- Number of I/O: 38
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
- Data Converters: A/D 10x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN-EP (7x7)
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Package: 48-VFQFN Exposed Pad |
Stock23,154 |
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NXP |
IC MCU 8BIT 8KB FLASH 28SOIC
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: LIN, SCI
- Peripherals: LVD, POR, PWM
- Number of I/O: 24
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 10x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 28-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 28-SOIC
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Package: 28-SOIC (0.295", 7.50mm Width) |
Stock27,312 |
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NXP |
IC SMART CARD MIFARE 4K PLLMC
- Type: RFID Transponder
- Frequency: 13.56MHz
- Standards: ISO 14443, MIFARE
- Interface: UART
- Voltage - Supply: -
- Operating Temperature: -25°C ~ 70°C
- Package / Case: Die
- Supplier Device Package: Wafer
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Package: Die |
Stock2,772 |
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NXP |
16BIT 512K FLASH 144LQFP
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 119
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 24x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock7,856 |
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NXP |
AUTO 9S08AW32
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I²C, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 34
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 44-LQFP
- Supplier Device Package: 44-LQFP (10x10)
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Package: 44-LQFP |
Stock6,016 |
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NXP |
IC TRANSLTR BIDIRECTIONAL 8X2SON
- Translator Type: Voltage Level
- Channel Type: Bidirectional
- Number of Circuits: 2
- Channels per Circuit: 2
- Voltage - VCCA: 0.72 V ~ 1.98 V
- Voltage - VCCB: 0.72 V ~ 1.98 V
- Input Signal: -
- Output Signal: -
- Output Type: Non-Inverted
- Data Rate: 52Mbps
- Operating Temperature: -40°C ~ 125°C (TA)
- Features: -
- Mounting Type: Surface Mount
- Package / Case: 8-XFDFN
- Supplier Device Package: 8-X2SON (1.35x1)
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Package: - |
Stock20,655 |
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NXP |
IC MPU I.MX28 454MHZ 289MAPBGA
- Core Processor: ARM926EJ-S
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 454MHz
- Co-Processors/DSP: Data; DCP
- RAM Controllers: DDR2, LVDDR, LVDDR2
- Graphics Acceleration: No
- Display & Interface Controllers: Keypad, LCD, Touchscreen
- Ethernet: 10/100Mbps (1)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: 1.8V, 3.3V
- Operating Temperature: -20°C ~ 70°C (TA)
- Security Features: Boot Security, Cryptography, Hardware ID
- Package / Case: 289-LFBGA
- Supplier Device Package: 289-MAPBGA (14x14)
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Package: - |
Request a Quote |
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NXP |
I.MX 8DUALXPLUS 21X21
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
IC MCU 16BIT
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
SAFETY POWER MANAGEMENT IC, QFN5
- Applications: -
- Current - Supply: 15mA
- Voltage - Supply: 60V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-HVQFN (8x8)
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Package: - |
Request a Quote |
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