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NXP |
IC PWR SW USB 1CH 5A HI 15WLCSP
- Switch Type: USB Switch
- Number of Outputs: 1
- Ratio - Input:Output: 1:1
- Output Configuration: High Side
- Output Type: N-Channel
- Interface: On/Off
- Voltage - Load: 2.5 V ~ 20 V
- Voltage - Supply (Vcc/Vdd): -
- Current - Output (Max): 5A
- Rds On (Typ): 30 mOhm
- Input Type: -
- Features: -
- Fault Protection: Over Temperature, Over Voltage, Reverse Current, UVLO
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 15-UFBGA, WLCSP
- Supplier Device Package: 15-WLCSP (2.56x1.54)
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Package: 15-UFBGA, WLCSP |
Stock2,160 |
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NXP |
IC LED DRVR LIN DIM 25MA 28TSSOP
- Type: Linear
- Topology: -
- Internal Switch(s): Yes
- Number of Outputs: 16
- Voltage - Supply (Min): 2.3V
- Voltage - Supply (Max): 5.5V
- Voltage - Output: 5.5V
- Current - Output / Channel: 25mA
- Frequency: 100kHz ~ 1MHz
- Dimming: PWM
- Applications: Backlight
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 28-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 28-TSSOP
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Package: 28-TSSOP (0.173", 4.40mm Width) |
Stock7,424 |
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NXP |
IC SGL CELL BATTERY CHRGR 8-UDFN
- Battery Chemistry: Lithium-Ion/Polymer
- Number of Cells: 1
- Current - Charging: Constant - Programmable
- Programmable Features: -
- Fault Protection: Over Voltage
- Charge Current - Max: 1.2A
- Battery Pack Voltage: 4.2V
- Voltage - Supply (Max): 6.6V
- Interface: -
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 8-UFDFN Exposed Pad
- Supplier Device Package: 8-UDFN-EP (2x3)
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Package: 8-UFDFN Exposed Pad |
Stock15,852 |
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NXP |
IC GATE NOR 4CH 2-INP 14-SSOP
- Logic Type: NOR Gate
- Number of Circuits: 4
- Number of Inputs: 2
- Features: -
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Max): 50µA
- Current - Output High, Low: 15mA, 20mA
- Logic Level - Low: 0.8V
- Logic Level - High: 2V
- Max Propagation Delay @ V, Max CL: 3.7ns @ 5V, 50pF
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Supplier Device Package: 14-SSOP
- Package / Case: 14-SSOP (0.209", 5.30mm Width)
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Package: 14-SSOP (0.209", 5.30mm Width) |
Stock7,200 |
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NXP |
IC 9X64 FIFO REGISTER 3ST 28SOIC
- Memory Size: 576 (64 x 9)
- Function: Asynchronous, Synchronous
- Data Rate: 29MHz
- Access Time: 40ns
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Supply (Max): -
- Bus Directional: Uni-Directional
- Expansion Type: Depth, Width
- Programmable Flags Support: No
- Retransmit Capability: No
- FWFT Support: No
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 28-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 28-SO
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Package: 28-SOIC (0.295", 7.50mm Width) |
Stock5,888 |
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NXP |
IC TXRX OCTAL 3-ST 3.3V 20TSSOP
- Logic Type: Transceiver, Non-Inverting
- Number of Elements: 1
- Number of Bits per Element: 8
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 32mA, 64mA
- Voltage - Supply: 2.7 V ~ 3.6 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 20-TSSOP
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Package: 20-TSSOP (0.173", 4.40mm Width) |
Stock7,184 |
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NXP |
IC REDRIVER I2C 4CH 24HVQFN
- Type: Buffer, ReDriver
- Applications: I2C
- Input: 2-Wire Bus
- Output: 2-Wire Bus
- Data Rate (Max): 400kHz
- Number of Channels: 4
- Delay Time: -
- Signal Conditioning: -
- Capacitance - Input: 6pF
- Voltage - Supply: 3 V ~ 5.5 V
- Current - Supply: 11.6mA
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: -
- Package / Case: 24-VFQFN Exposed Pad
- Supplier Device Package: 24-HVQFN (4x4)
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Package: 24-VFQFN Exposed Pad |
Stock7,344 |
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NXP |
IC ANALOG SWITCH SPST XSON8
- Switch Circuit: SPST - NO
- Multiplexer/Demultiplexer Circuit: 1:1
- Number of Circuits: 2
- On-State Resistance (Max): 750 mOhm
- Channel-to-Channel Matching (ΔRon): 20 mOhm
- Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
- Voltage - Supply, Dual (V±): -
- Switch Time (Ton, Toff) (Max): 28ns, 20ns
- -3db Bandwidth: 60MHz
- Charge Injection: 6pC
- Channel Capacitance (CS(off), CD(off)): 35pF
- Current - Leakage (IS(off)) (Max): 10nA
- Crosstalk: -90dB @ 100kHz
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: 8-XFDFN
- Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
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Package: 8-XFDFN |
Stock40,950 |
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NXP |
IC MPU Q OR IQ 800MHZ 689TEBGA
- Core Processor: PowerPC e500v2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (3)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 689-BBGA Exposed Pad
- Supplier Device Package: 689-TEPBGA II (31x31)
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Package: 689-BBGA Exposed Pad |
Stock5,280 |
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NXP |
IC MPU MPC83XX 266MHZ 620BGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 266MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 620-BBGA Exposed Pad
- Supplier Device Package: 620-PBGA (29x29)
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Package: 620-BBGA Exposed Pad |
Stock4,592 |
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NXP |
IC MPU MPC82XX 350MHZ 352TBGA
- Core Processor: PowerPC 603e
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 350MHz
- Co-Processors/DSP: -
- RAM Controllers: SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 352-LBGA
- Supplier Device Package: 352-TBGA (35x35)
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Package: 352-LBGA |
Stock7,920 |
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NXP |
IC MPU MPC82XX 300MHZ 408TBGA
- Core Processor: PowerPC G2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 300MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (3)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 480-LBGA
- Supplier Device Package: 408-TBGA (37.5x37.5)
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Package: 480-LBGA |
Stock6,688 |
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NXP |
IC MPU MPC82XX 200MHZ 357BGA
- Core Processor: PowerPC 603e
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 200MHz
- Co-Processors/DSP: -
- RAM Controllers: SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BBGA |
Stock7,056 |
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NXP |
IC MCU 8BIT 60KB FLASH 32LQFP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: SCI, SPI
- Peripherals: LVD, POR, PWM
- Number of I/O: 21
- Program Memory Size: 60KB (60K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 24x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock2,960 |
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NXP |
IC MCU 8BIT 4KB FLASH 16TSSOP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: LIN, SCI
- Peripherals: LVD, POR, PWM
- Number of I/O: 14
- Program Memory Size: 4KB (4K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 256 x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
- Data Converters: A/D 8x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
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Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock5,872 |
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NXP |
IC MCU 8BIT 60KB FLASH 48LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: I2C, LIN, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 41
- Program Memory Size: 60KB (60K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 256 x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock4,928 |
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NXP |
IC MCU 8BIT 60KB FLASH 64QFP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8.4MHz
- Connectivity: CAN, SCI, SPI
- Peripherals: LVD, POR, PWM
- Number of I/O: 52
- Program Memory Size: 60KB (60K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 1K x 8
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 15x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 64-QFP
- Supplier Device Package: 64-QFP (14x14)
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Package: 64-QFP |
Stock6,400 |
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NXP |
IC DSP QUAD 1GHZ 783FCBGA
- Type: SC3400 Core
- Interface: Ethernet, I2C, SPI, TDM, UART, UTOPIA
- Clock Rate: 1GHz
- Non-Volatile Memory: External
- On-Chip RAM: 10.5MB
- Voltage - I/O: 3.30V
- Voltage - Core: 1.00V
- Operating Temperature: 0°C ~ 105°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock6,736 |
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NXP |
DSP 16BIT 400MHZ MULTI 431FCBGA
- Type: SC140 Core
- Interface: DSI, Ethernet, RS-232
- Clock Rate: 400MHz
- Non-Volatile Memory: External
- On-Chip RAM: 1.436MB
- Voltage - I/O: 3.30V
- Voltage - Core: 1.20V
- Operating Temperature: -40°C ~ 105°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 431-BFBGA, FCBGA
- Supplier Device Package: 431-FCPBGA (20x20)
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Package: 431-BFBGA, FCBGA |
Stock78,516 |
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NXP |
ACCELEROMETER 2.5G ANALOG 16SOIC
- Type: Analog
- Axis: Z
- Acceleration Range: ±2.5g
- Sensitivity (LSB/g): -
- Sensitivity (mV/g): 750
- Bandwidth: 50Hz
- Output Type: Analog Voltage
- Voltage - Supply: 4.75 V ~ 5.25 V
- Features: -
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 16-SOIC
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Package: 16-SOIC (0.295", 7.50mm Width) |
Stock4,626 |
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NXP |
MIFARE DESFIRE EV2 PLLMC
- Type: RFID Reader
- Frequency: 13.56MHz
- Standards: ISO 14443
- Interface: -
- Voltage - Supply: -
- Operating Temperature: -25°C ~ 70°C
- Package / Case: MOA4, Smart Card Module
- Supplier Device Package: PLLMC
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Package: MOA4, Smart Card Module |
Stock4,212 |
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NXP |
JN5169-001-M03-2 ZIGBEE 3.0, ZIG
- RF Family/Standard: 802.15.4
- Protocol: Zigbee?
- Modulation: -
- Frequency: 2.4GHz ~ 2.5GHz
- Data Rate: -
- Power - Output: 10dBm
- Sensitivity: -96dBm
- Serial Interfaces: I2C, SPI, UART
- Antenna Type: Not Included, U.FL
- Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM
- Voltage - Supply: 2 V ~ 3.6 V
- Current - Receiving: 17mA
- Current - Transmitting: 25mA
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 27-SMD Module
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Package: 27-SMD Module |
Stock6,534 |
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NXP |
IC TUNER CAR RADIO 32SO
- Frequency: -
- Sensitivity: -
- Data Rate (Max): -
- Modulation or Protocol: AM, FM
- Applications: AM/FM Radio Receiver
- Current - Receiving: -
- Data Interface: PCB, Surface Mount
- Memory Size: -
- Antenna Connector: PCB, Surface Mount
- Features: -
- Voltage - Supply: 8.5V
- Operating Temperature: -20°C ~ 85°C
- Package / Case: 32-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 32-SO
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Package: 32-SOIC (0.295", 7.50mm Width) |
Stock5,058 |
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NXP |
32-BIT ARM CORTEX-M4
- Core Processor: ARM® Cortex®-M4
- Core Size: 32-Bit
- Speed: 180MHz
- Connectivity: EBI/EMI, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
- Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
- Number of I/O: 64
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 360K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 12x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 100-TFBGA
- Supplier Device Package: 100-TFBGA (9x9)
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Package: 100-TFBGA |
Stock7,896 |
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NXP |
IC MCU 32BIT 128KB FLASH 64LQFP
- Core Processor: ARM® Cortex®-M0+
- Core Size: 32-Bit Single-Core
- Speed: 72MHz
- Connectivity: FlexIO, I2C, SPI, UART/USART
- Peripherals: DMA, LVD, PWM, WDT
- Number of I/O: 58
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
- Data Converters: A/D 16x12b SAR; D/A 1x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: - |
Request a Quote |
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NXP |
IC
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
SYSTEM BASIS CHIP, DCDC 1.5A VCO
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: 1V ~ 5V
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-HLQFP (7x7)
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Package: - |
Request a Quote |
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NXP |
IC MCU 32BIT EXT MEM 100LQFP
- Core Processor: ARM® Cortex®-M7
- Core Size: 32-Bit Single-Core
- Speed: 500MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
- Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O: 57
- Program Memory Size: -
- Program Memory Type: External Program Memory
- EEPROM Size: -
- RAM Size: 256K x 8
- Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
- Data Converters: A/D 10x12b
- Oscillator Type: External, Internal
- Operating Temperature: 0°C ~ 95°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: - |
Stock270 |
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